WO2015055646A3 - Herstellung eines optoelektronischen bauelements - Google Patents

Herstellung eines optoelektronischen bauelements Download PDF

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Publication number
WO2015055646A3
WO2015055646A3 PCT/EP2014/072007 EP2014072007W WO2015055646A3 WO 2015055646 A3 WO2015055646 A3 WO 2015055646A3 EP 2014072007 W EP2014072007 W EP 2014072007W WO 2015055646 A3 WO2015055646 A3 WO 2015055646A3
Authority
WO
WIPO (PCT)
Prior art keywords
production
optoelectronic component
semiconductor chips
optoelectronic semiconductor
region
Prior art date
Application number
PCT/EP2014/072007
Other languages
English (en)
French (fr)
Other versions
WO2015055646A2 (de
Inventor
Markus Pindl
Simon Jerebic
Tobias Geltl
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to CN201480056817.9A priority Critical patent/CN105612624A/zh
Priority to DE112014004745.7T priority patent/DE112014004745A5/de
Priority to US15/025,759 priority patent/US20160233200A1/en
Publication of WO2015055646A2 publication Critical patent/WO2015055646A2/de
Publication of WO2015055646A3 publication Critical patent/WO2015055646A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Luminescent Compositions (AREA)

Abstract

Herstellung eines optoelektronischen Bauelements Die Erfindung betrifft ein Verfahren zum Herstellen eines optoelektronischen Bauelements. Bei dem Verfahren werden mehrere optoelektronische Halbleiterchips auf einem Träger angeordnet. Weiter vorgesehen ist ein gemeinsames Zusammendrücken von separaten Formmassen im Bereich der optoelektronischen Halbleiterchips, wobei separate Formkörper im Bereich der optoelektronischen Halbleiterchips gebildet werden.
PCT/EP2014/072007 2013-10-15 2014-10-14 Herstellung eines optoelektronischen bauelements WO2015055646A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201480056817.9A CN105612624A (zh) 2013-10-15 2014-10-14 光电组件的生产
DE112014004745.7T DE112014004745A5 (de) 2013-10-15 2014-10-14 Herstellung eines optoelektronischen Bauelements
US15/025,759 US20160233200A1 (en) 2013-10-15 2014-10-15 Production of an Optoelectronic Component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013220790.5A DE102013220790A1 (de) 2013-10-15 2013-10-15 Herstellung eines optoelektronischen Bauelements
DE102013220790.5 2013-10-15

Publications (2)

Publication Number Publication Date
WO2015055646A2 WO2015055646A2 (de) 2015-04-23
WO2015055646A3 true WO2015055646A3 (de) 2016-01-21

Family

ID=51844677

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/072007 WO2015055646A2 (de) 2013-10-15 2014-10-14 Herstellung eines optoelektronischen bauelements

Country Status (4)

Country Link
US (1) US20160233200A1 (de)
CN (1) CN105612624A (de)
DE (2) DE102013220790A1 (de)
WO (1) WO2015055646A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018162075A1 (en) * 2017-03-10 2018-09-13 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
DE102017117150A1 (de) * 2017-07-28 2019-01-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580818A1 (de) * 2004-03-10 2005-09-28 Nitto Denko Corporation Verfahren zur Herstellung optischer Halbleiter
US20060292753A1 (en) * 2005-06-27 2006-12-28 Yoshimi Takahashi Semiconductor Device and Method of Manufacturing a Semiconductor Device
JP2007005730A (ja) * 2005-06-27 2007-01-11 Texas Instr Japan Ltd 半導体装置および半導体装置の製造方法
JP2007005727A (ja) * 2005-06-27 2007-01-11 Texas Instr Japan Ltd 半導体装置および半導体装置の製造方法
US20120064673A1 (en) * 2010-09-13 2012-03-15 Edward Fuergut Method for fabricating a semiconductor chip panel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60117713T2 (de) * 2001-12-18 2006-10-19 Telefonaktiebolaget Lm Ericsson (Publ) Verfahren zum transferieren von teilnehmerdaten zwischen verschiedenen servern eines telekommunikationsnetzes
KR100703217B1 (ko) * 2006-02-22 2007-04-09 삼성전기주식회사 발광다이오드 패키지 제조방법
DE102009058006B4 (de) * 2009-12-11 2022-03-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
CN102683542B (zh) * 2011-03-15 2014-12-10 展晶科技(深圳)有限公司 Led封装结构
CN202049995U (zh) * 2011-04-19 2011-11-23 鹤山丽得电子实业有限公司 一种贴片发光二极管支架及采用该支架的贴片发光二极管
JP6003016B2 (ja) * 2011-07-15 2016-10-05 ソニー株式会社 還元処理装置、還元処理方法および還元システム
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
DE102011111917A1 (de) * 2011-08-30 2013-02-28 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
CN103187485A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580818A1 (de) * 2004-03-10 2005-09-28 Nitto Denko Corporation Verfahren zur Herstellung optischer Halbleiter
US20060292753A1 (en) * 2005-06-27 2006-12-28 Yoshimi Takahashi Semiconductor Device and Method of Manufacturing a Semiconductor Device
JP2007005730A (ja) * 2005-06-27 2007-01-11 Texas Instr Japan Ltd 半導体装置および半導体装置の製造方法
JP2007005727A (ja) * 2005-06-27 2007-01-11 Texas Instr Japan Ltd 半導体装置および半導体装置の製造方法
US20120064673A1 (en) * 2010-09-13 2012-03-15 Edward Fuergut Method for fabricating a semiconductor chip panel

Also Published As

Publication number Publication date
WO2015055646A2 (de) 2015-04-23
DE102013220790A1 (de) 2015-04-16
DE112014004745A5 (de) 2016-10-27
US20160233200A1 (en) 2016-08-11
CN105612624A (zh) 2016-05-25

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