SG11201404295QA - Resin composition and semiconductor mounting substrate obtained by molding same - Google Patents
Resin composition and semiconductor mounting substrate obtained by molding sameInfo
- Publication number
- SG11201404295QA SG11201404295QA SG11201404295QA SG11201404295QA SG11201404295QA SG 11201404295Q A SG11201404295Q A SG 11201404295QA SG 11201404295Q A SG11201404295Q A SG 11201404295QA SG 11201404295Q A SG11201404295Q A SG 11201404295QA SG 11201404295Q A SG11201404295Q A SG 11201404295QA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- mounting substrate
- substrate obtained
- semiconductor mounting
- molding same
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012014301 | 2012-01-26 | ||
JP2012153487 | 2012-07-09 | ||
PCT/JP2013/051068 WO2013111697A1 (en) | 2012-01-26 | 2013-01-21 | Resin composition and semiconductor mounting substrate obtained by molding same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201404295QA true SG11201404295QA (en) | 2014-10-30 |
Family
ID=48873417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201404295QA SG11201404295QA (en) | 2012-01-26 | 2013-01-21 | Resin composition and semiconductor mounting substrate obtained by molding same |
Country Status (8)
Country | Link |
---|---|
US (1) | US20150017450A1 (en) |
JP (1) | JPWO2013111697A1 (en) |
KR (1) | KR20140124773A (en) |
CN (1) | CN104105756A (en) |
PH (1) | PH12014501678A1 (en) |
SG (1) | SG11201404295QA (en) |
TW (1) | TWI555768B (en) |
WO (1) | WO2013111697A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6251575B2 (en) * | 2013-01-23 | 2017-12-20 | 日東電工株式会社 | Sheet-like thermosetting resin composition for encapsulating electronic components, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device |
KR101574023B1 (en) * | 2013-09-24 | 2015-12-02 | 주식회사 엘지화학 | Curable Composition |
US10150898B2 (en) | 2014-05-28 | 2018-12-11 | Xerox Corporation | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads |
US9890306B2 (en) * | 2014-05-28 | 2018-02-13 | Xerox Corporation | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads |
JP6425062B2 (en) * | 2014-08-07 | 2018-11-21 | パナソニックIpマネジメント株式会社 | Insulating resin sheet, and circuit board and semiconductor package using the same |
CA2969328A1 (en) * | 2015-01-16 | 2016-07-21 | Halliburton Energy Services, Inc. | Hydrazide-based curing agents for use in subterranean operations |
JP6241549B2 (en) | 2015-05-13 | 2017-12-06 | 三菱ケミカル株式会社 | Sheet molding compounds and fiber reinforced composite materials |
TWI575016B (en) * | 2015-12-03 | 2017-03-21 | 財團法人工業技術研究院 | Epoxy resin compositions and thermal interface materials comprising the same |
CN106997801B (en) | 2016-01-25 | 2020-10-20 | 美蓓亚株式会社 | Rare earth bonded magnet |
JP6393737B2 (en) * | 2016-01-25 | 2018-09-19 | ミネベアミツミ株式会社 | Rare earth bonded magnet |
TWI723211B (en) * | 2016-09-23 | 2021-04-01 | 日商住友電木股份有限公司 | Thermosetting resin composition, resin encapsulating substrate and electronic device |
JP2018070694A (en) * | 2016-10-25 | 2018-05-10 | 株式会社巴川製紙所 | Conductive adhesive composition, electromagnetic wave-shielding sheet and wiring device using the same |
JP7168157B2 (en) * | 2017-08-25 | 2022-11-09 | 国立大学法人信州大学 | COMPOSITION FOR HIGHLY HEAT RESISTANT RESIN CURED MATERIAL, ELECTRONIC COMPONENTS AND SEMICONDUCTOR DEVICE USING THE SAME |
WO2019087259A1 (en) * | 2017-10-30 | 2019-05-09 | 日立化成株式会社 | Resin composition, cured product, formed body and manufacturing method thereof, and film capacitor and manufacturing method thereof |
CN108178828A (en) * | 2017-12-27 | 2018-06-19 | 上海华谊树脂有限公司 | Epoxy resin cured product and composition epoxy resin |
TWI791721B (en) * | 2017-12-27 | 2023-02-11 | 日商三菱瓦斯化學股份有限公司 | Resin composition, prepreg, laminate, meta foil-clad laminate, printed wiring board, and multilayer printed wiring board |
CN109535654B (en) * | 2018-11-21 | 2021-02-09 | 苏州生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
CN109535388B (en) * | 2018-11-21 | 2021-02-09 | 苏州生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
CN109535390B (en) * | 2018-11-21 | 2021-01-29 | 常熟生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
JP7222320B2 (en) * | 2019-06-25 | 2023-02-15 | 味の素株式会社 | resin composition |
JP7282011B2 (en) | 2019-10-28 | 2023-05-26 | サンスター技研株式会社 | Curable composition and cured product |
CN111647253A (en) * | 2020-04-29 | 2020-09-11 | 江西省航宇新材料股份有限公司 | Low-thermal expansion coefficient copper-clad plate and preparation method thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919844A (en) * | 1995-12-28 | 1999-07-06 | Toray Industries, Inc. | Epoxy resin composition |
JP4568940B2 (en) * | 1999-04-13 | 2010-10-27 | 日立化成工業株式会社 | Epoxy resin composition for sealing and electronic component device |
JP2001214041A (en) * | 2000-02-02 | 2001-08-07 | Toshiba Chem Corp | Insulating paste |
JP2003218249A (en) * | 2002-01-18 | 2003-07-31 | Mitsui Chemicals Inc | Semiconductor hollow package |
JP2003292734A (en) * | 2002-04-03 | 2003-10-15 | Mitsui Chemicals Inc | Epoxy resin composition and optical part produced by using the same |
JP2006143784A (en) * | 2004-11-16 | 2006-06-08 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2006278530A (en) * | 2005-03-28 | 2006-10-12 | Sumitomo Bakelite Co Ltd | Solder resist and thermosetting resin composition therefor |
JP4285491B2 (en) * | 2006-02-28 | 2009-06-24 | Dic株式会社 | Epoxy resin composition, cured product thereof, novel epoxy resin, novel phenol resin, and semiconductor sealing material |
MY150836A (en) * | 2007-09-21 | 2014-02-28 | Nippon Soda Co | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
WO2011096273A1 (en) * | 2010-02-03 | 2011-08-11 | Dic株式会社 | Phenol resin composition, process for production thereof, curable resin composition, cured products tehreof, and printed wiring board |
JP2011246596A (en) * | 2010-05-26 | 2011-12-08 | Kyocera Chemical Corp | Sheet-like resin composition and circuit component sealed by using the same |
-
2013
- 2013-01-21 US US14/374,643 patent/US20150017450A1/en not_active Abandoned
- 2013-01-21 KR KR1020147022486A patent/KR20140124773A/en not_active Application Discontinuation
- 2013-01-21 CN CN201380006755.6A patent/CN104105756A/en active Pending
- 2013-01-21 SG SG11201404295QA patent/SG11201404295QA/en unknown
- 2013-01-21 WO PCT/JP2013/051068 patent/WO2013111697A1/en active Application Filing
- 2013-01-21 JP JP2013505232A patent/JPWO2013111697A1/en active Pending
- 2013-01-24 TW TW102102566A patent/TWI555768B/en not_active IP Right Cessation
-
2014
- 2014-07-23 PH PH12014501678A patent/PH12014501678A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI555768B (en) | 2016-11-01 |
WO2013111697A1 (en) | 2013-08-01 |
JPWO2013111697A1 (en) | 2015-05-11 |
TW201336884A (en) | 2013-09-16 |
PH12014501678A1 (en) | 2014-10-20 |
US20150017450A1 (en) | 2015-01-15 |
CN104105756A (en) | 2014-10-15 |
KR20140124773A (en) | 2014-10-27 |
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