CN108178828A - Epoxy resin cured product and composition epoxy resin - Google Patents
Epoxy resin cured product and composition epoxy resin Download PDFInfo
- Publication number
- CN108178828A CN108178828A CN201711449240.XA CN201711449240A CN108178828A CN 108178828 A CN108178828 A CN 108178828A CN 201711449240 A CN201711449240 A CN 201711449240A CN 108178828 A CN108178828 A CN 108178828A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- cured product
- resin cured
- composition epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
Abstract
The present invention proposes a kind of epoxy resin cured product and composition epoxy resin, wherein, epoxy resin cured product includes：45 55 parts of high temperature modification mixture；21 23 parts of aluminium oxide；17 20 parts of isoprene；15 20 parts of n-butanol water glycerin ether；10 13 parts of carbon fiber；12 13 parts of diluent.The curing reaction rate of epoxy resin cured product is fast, and can improve solidification effect.Also, have many advantages, such as that solidification effect is good using the composition epoxy resin of above-mentioned epoxy resin cured product, stability is high and stickiness is good.
Description
Technical field
The present invention relates to epoxy resin cured products and composition epoxy resin field.
Background technology
Epoxy resin has superior heat resistance, mechanical property, electrical characteristic and adhesiveness.Epoxy resin is special using this
Property, for wiring substrate, circuit board or the sealing material by the circuit board of these multiple stratifications, semiconductor chip, coil, circuit etc.
Material.Alternatively, epoxy resin can also be used as the resin of adhesive, coating, fiber-reinforced resin.
However, because epoxy resin is usually more crisp, exist due to using during curing agent solidification or when using ess-strain,
Impact in heat, mechanics etc. easily leads to the problem of cracking.
Invention content
The purpose of the present invention is to provide a kind of epoxy resin cured product and composition epoxy resin, for solving existing skill
The problem of art.
In order to achieve the above object, the present invention proposes a kind of epoxy resin cured product, including：
45-55 parts of high temperature modification mixture
21-23 parts of aluminium oxide
17-20 parts of isoprene
15-20 parts of n-butanol water glycerin ether
10-13 parts of carbon fiber
12-13 parts of diluent；
Further, in the epoxy resin cured product, the high temperature modification mixture includes aromatic polyamine, acid
Acid anhydride, resol, amino resins, dicyandiamide and hydrazides.
Further, in the epoxy resin cured product, the diluent include polypropylene glycol diglycidyl ether,
Epoxy propane butyl ether and ethylene glycol diglycidylether.
Also proposed a kind of composition epoxy resin in another aspect of this invention, including at least one amino-compound,
Phenolic compound, the liquid epoxies compound, inorganic that at least one range of viscosities is 1000mPa-s~500,000mPa-s
Filler and epoxy resin cured product as described above.
Further, in the composition epoxy resin, the phenolic compound includes Benzenediol.
Further, in the composition epoxy resin, the amino-compound includes hydroxyl functional amine compounds
Object.
Further, in the composition epoxy resin, the inorganic filler for silicon carbide micro-powder, corundum powder or
Graphite microparticles.
Compared with prior art, the beneficial effects are mainly as follows：The curing reaction speed of epoxy resin cured product
Rate is fast, and can improve solidification effect.
Specific embodiment
The epoxy resin cured product and composition epoxy resin of the present invention are carried out below in conjunction with schematic diagram more detailed
Description, which show the preferred embodiment of the present invention, it should be appreciated that those skilled in the art can change described here
Invention, and still realize the advantageous effects of the present invention.Therefore, description below should be understood as those skilled in the art's
It is widely known, and it is not intended as limitation of the present invention.
In the present embodiment, it is proposed that a kind of epoxy resin cured product, including：
45-55 parts of high temperature modification mixture
21-23 parts of aluminium oxide
17-20 parts of isoprene
15-20 parts of n-butanol water glycerin ether
10-13 parts of carbon fiber
12-13 parts of diluent；
Wherein, the high temperature modification mixture includes aromatic polyamine, acid anhydrides, resol, amino resins, dicyandiamide
And hydrazides.The diluent includes polypropylene glycol diglycidyl ether, epoxy propane butyl ether and ethylene glycol diglycidyl
Ether.
Wherein, increased carbon fiber can improve the curing reaction rate of epoxy resin cured product, and reaction effect is good, property
Can more it stablize.Compared to traditional epoxy resin cured product, stability can be improved.
Also proposed a kind of composition epoxy resin in another aspect of this invention, including at least one amino-compound,
Phenolic compound, the liquid epoxies compound, inorganic that at least one range of viscosities is 1000mPa-s~500,000mPa-s
Filler and epoxy resin cured product as described above.
Wherein, the phenolic compound includes Benzenediol.The amino-compound includes hydroxyl functional amine compounds.
In the present embodiment, can be had using above-mentioned epoxy resin cured product in composition epoxy resin good solid
Change effect and performance, increased inorganic filler generally can be silicon carbide micro-powder, corundum powder, graphite microparticles, increased inorganic
Filler can improve epoxyn intensity.
The preferred embodiment of the present invention is above are only, does not play the role of any restrictions to the present invention.Belonging to any
Those skilled in the art, in the range of technical scheme of the present invention is not departed from, to the invention discloses technical solution and
Technology contents make the variations such as any type of equivalent replacement or modification, belong to the content without departing from technical scheme of the present invention, still
Within belonging to the scope of protection of the present invention.
Claims (7)
1. a kind of epoxy resin cured product, which is characterized in that including：
45-55 parts of high temperature modification mixture
21-23 parts of aluminium oxide
17-20 parts of isoprene
15-20 parts of n-butanol water glycerin ether
10-13 parts of carbon fiber
12-13 parts of diluent.
2. epoxy resin cured product as described in claim 1, which is characterized in that it is more that the high temperature modification mixture includes aromatic series
Amine, acid anhydrides, resol, amino resins, dicyandiamide and hydrazides.
3. epoxy resin cured product as described in claim 1, which is characterized in that the diluent shrinks including polypropylene glycol two
Glycerin ether, epoxy propane butyl ether and ethylene glycol diglycidylether.
4. a kind of composition epoxy resin, which is characterized in that including at least one amino-compound, phenolic compound, at least one
Liquid epoxies compound, inorganic filler and such as claim 1 that kind range of viscosities is 1000mPa-s~500,000mPa-s
To the epoxy resin cured product described in any one of 3.
5. composition epoxy resin as claimed in claim 4, which is characterized in that the phenolic compound includes Benzenediol.
6. composition epoxy resin as claimed in claim 4, which is characterized in that the amino-compound includes hydroxyl functional
Amine compounds.
7. composition epoxy resin as claimed in claim 4, which is characterized in that the inorganic filler is silicon carbide micro-powder, just
Beautiful micro mist or graphite microparticles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711449240.XA CN108178828A (en) | 2017-12-27 | 2017-12-27 | Epoxy resin cured product and composition epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711449240.XA CN108178828A (en) | 2017-12-27 | 2017-12-27 | Epoxy resin cured product and composition epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108178828A true CN108178828A (en) | 2018-06-19 |
Family
ID=62547792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711449240.XA Pending CN108178828A (en) | 2017-12-27 | 2017-12-27 | Epoxy resin cured product and composition epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108178828A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113816712A (en) * | 2021-10-15 | 2021-12-21 | 钟祥绿景环保科技有限公司 | Calcination-free production process of phosphogypsum environment-friendly building material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105756A (en) * | 2012-01-26 | 2014-10-15 | 东丽株式会社 | Resin composition and semiconductor mounting substrate obtained by molding same |
| CN105143301A (en) * | 2012-12-14 | 2015-12-09 | 蓝立方知识产权有限责任公司 | Modified epoxy resins |
| CN105778050A (en) * | 2016-03-25 | 2016-07-20 | 南通市福来特化工有限公司 | Epoxy resin curing agent |
| CN106280885A (en) * | 2016-08-16 | 2017-01-04 | 湖北巴司特科技有限公司 | A kind of high-efficiency and energy-saving type bicomponent epoxy resin coating and preparation method thereof |
-
2017
- 2017-12-27 CN CN201711449240.XA patent/CN108178828A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105756A (en) * | 2012-01-26 | 2014-10-15 | 东丽株式会社 | Resin composition and semiconductor mounting substrate obtained by molding same |
| CN105143301A (en) * | 2012-12-14 | 2015-12-09 | 蓝立方知识产权有限责任公司 | Modified epoxy resins |
| CN105778050A (en) * | 2016-03-25 | 2016-07-20 | 南通市福来特化工有限公司 | Epoxy resin curing agent |
| CN106280885A (en) * | 2016-08-16 | 2017-01-04 | 湖北巴司特科技有限公司 | A kind of high-efficiency and energy-saving type bicomponent epoxy resin coating and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113816712A (en) * | 2021-10-15 | 2021-12-21 | 钟祥绿景环保科技有限公司 | Calcination-free production process of phosphogypsum environment-friendly building material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101811184B1 (en) | Solvent-free and one-pack type cyanic ester/epoxy composite resin composition | |
| CA2835658C (en) | Insulation formulations | |
| JP6082806B2 (en) | Epoxy resin composition for marine equipment maintenance and restoration coating with improved overcoating | |
| JP6824179B2 (en) | Thermosetting epoxy resin compositions for manufacturing outdoor products, and the resulting outdoor products | |
| CA2835651A1 (en) | Insulation formulations | |
| JP7365118B2 (en) | Process for the production of insulation systems for electrical engineering, products obtained therefrom and their use | |
| KR20130090789A (en) | Curable compositions | |
| CN103146150A (en) | Novel epoxy resin curing agent | |
| CN108178828A (en) | Epoxy resin cured product and composition epoxy resin | |
| TWI438216B (en) | Modified liquid epoxy resin, epoxy resin composition by using modified liquid epoxy resin and cured product thereof | |
| US4894431A (en) | Accelerated curing systems for epoxy resins | |
| CN101440266B (en) | Novel paster glue for surface mounting technology and preparation thereof | |
| JP7142233B2 (en) | EPOXY RESIN COMPOSITION FOR ENCAPSULATION, CURED PRODUCT AND SEMICONDUCTOR DEVICE | |
| JP4201632B2 (en) | Curing agent composition for epoxy resin | |
| JP4264769B2 (en) | Epoxy resin composition and semiconductor sealing material | |
| CN105419240A (en) | Low-stress epoxy resin composition | |
| KR102388117B1 (en) | Method of Preparing Resin Composition for Sealing Semiconductor | |
| TW201841972A (en) | Curable resin composition, cured product thereof, and method for producing curable resin composition | |
| US9534157B2 (en) | Composition for an adhesive material | |
| CN113881382A (en) | Heat-conducting epoxy potting material | |
| JPH08151428A (en) | Epoxy resin composition and semiconductor sealing material | |
| JPH0812745A (en) | Liquid epoxy resin composition | |
| JP2014227465A (en) | Liquid resin compositions for injection molding, and semiconductor device | |
| JP2013189490A (en) | Epoxy resin composition for encapsulation and semiconductor device | |
| KR102228914B1 (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180619 |