CN113881382A - Heat-conducting epoxy potting material - Google Patents
Heat-conducting epoxy potting material Download PDFInfo
- Publication number
- CN113881382A CN113881382A CN202111303429.4A CN202111303429A CN113881382A CN 113881382 A CN113881382 A CN 113881382A CN 202111303429 A CN202111303429 A CN 202111303429A CN 113881382 A CN113881382 A CN 113881382A
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- China
- Prior art keywords
- heat
- epoxy resin
- conducting
- inorganic filler
- epoxy
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a heat-conducting epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator and a heat-conducting inorganic filler at room temperature, and curing is completed at 40-60 ℃. According to the invention, the heat conduction efficiency of the solidified encapsulating material is improved through the heat-conducting inorganic filler, the interaction between the heat-conducting inorganic filler and the epoxy resin matrix is obviously improved through the functional curing agent, and the heat conduction and mechanical properties are favorably improved. The epoxy encapsulating material does not contain harmful volatile matters, and is beneficial to environmental protection.
Description
Technical Field
The present invention relates to a potting material for electronic components, and more particularly to an organic/inorganic composite epoxy resin high thermal conductivity potting material.
Background
The epoxy resin is used for encapsulating the electronic components, so that air, moisture and carbon dioxide can be blocked, the working environment of the electronic components, the electronic component combination and the circuit board is improved, the service life of the components is prolonged, the stability of the electronic components in the transportation and use processes can be improved, and the electronic components, the electronic component combination and the circuit board are prevented from being damaged by mechanical force such as oscillation and impact. However, the heat conductivity of the conventional epoxy resin potting material after curing is limited, and heat generated by electronic components, electronic component combinations and circuit boards in the working process cannot be well and timely led out. Because the heat dissipation capability is poor, the heat accumulation and the temperature rise of the electronic components are caused, and the working state and the service life of the electronic components are directly influenced.
CN105229078 discloses an epoxy casting resin system with good resistance to water, salt spray, inorganic acids, bases and most organic solvents. The epoxy resins have low viscosity while maintaining advantageous physical, thermal and electrical properties. The epoxy casting resin system can be used for at least partially covering electronic components or devices, and compared with similar products in the market, the thermal conductivity is improved by 24 percent, the electric conductivity is improved by 9.5 percent, and the physical property of the cured epoxy resin is improved by 10 to 20 percent. While the disclosed materials can achieve advantageous properties such as thermal conductivity through the use of non-alumina filled epoxy resins (e.g., using boron nitride), these are significantly more expensive. Thus, the disclosed materials are an economically efficient way to have improved properties over other epoxy resins in their class. The resin system is divided into a resin part (part a) and a hardener part (part B) which are mixed together to start the reaction. Bisphenol F epoxy resin, butyl glycidyl ether, epoxy carbon black dispersoid, alumina, phosphonium salt, aluminum hydroxide and ammonium polyphosphate are used as a part A, and polyethylene glycol diamine and polyamine blend is used as a part B. 5 to 10 percent by weight of polyethylene glycol diamine is used as a reactant in the system. The epoxy resin and hardener are mixed together to form a resin, which is poured into a container to cure. The mixed resin was then cured at 60 ℃ for 2 hours. The patent uses bisphenol F epoxy resin with higher price, the mass usage of aluminum hydroxide is 9 percent, the mass usage of aluminum oxide is up to 54 percent, and the inorganic material filler improves the resistance of a material system to environmental destruction factors, but the usage of the filler is too high, which is not beneficial to basic mechanical properties, such as compressive strength and impact strength. In addition, aluminum hydroxide is used as an inorganic non-metal oxide, and is generally used as a common filler, so that the abrasion resistance and the abrasion resistance of the material can be improved, but the heat dissipation of a system is not facilitated.
CN 103450638 discloses a method for preparing high thermal conductivity epoxy resin for epoxy cast dry transformer, which utilizes the high thermal conductivity of boron nitride particles to add micron-sized boron nitride particles into epoxy resin. After ultrasonic dispersion, ball milling and high-speed centrifugal dispersion at 48-50 ℃, the mixture is continuously heated to 145 ℃ and cured at 150 ℃ for 3 hours after encapsulation, and the pressure of a hot-press forming machine is maintained at 30 MPa. The boron nitride particles in the composite material can form a heat conduction channel in the epoxy matrix, so that the heat conduction performance of the whole composite material is improved.
The patent discloses a heat-conducting epoxy potting material, and more particularly relates to an organic/inorganic composite epoxy resin high-heat-conducting potting material. The epoxy resin-epoxy resin composite material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator and a heat-conducting inorganic filler, and is compounded and encapsulated at room temperature, and the curing is completed at 40-60 ℃.
Disclosure of Invention
The invention aims to provide a heat-conducting epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator and a heat-conducting inorganic filler at room temperature, and curing is completed at 40-60 ℃. The heat conduction efficiency of the solidified encapsulating material is improved through the heat-conducting inorganic filler.
The technical scheme of the invention is as follows:
a heat-conducting epoxy potting material. The encapsulating material is prepared by compounding and encapsulating an organic component and a heat-conducting inorganic filler at room temperature and curing at 40-60 ℃. The raw material ratio is as follows:
the organic component comprises epoxy resin, a diluent, a curing agent and an accelerator. The epoxy resin is one or two of bisphenol A type epoxy resin E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, and the accelerator is 2, 4, 6-tris (dimethylaminomethyl) phenol.
The functional curing agent is dopamine.
The heat-conducting inorganic filler is micron-sized boron nitride powder.
The invention has the beneficial effects that:
(1) after the thermal-conductive epoxy potting material is cured, the thermal conductivity is improved on the basis of good strength, and the protection effect on electronic components is improved.
(2) The dopamine can be chemically bonded with the heat-conducting inorganic filler boron nitride, and can also be used for curing the epoxy resin, so that the interaction between the boron nitride powder and the epoxy resin matrix is obviously improved, and the heat conduction and mechanical properties are favorably improved.
(3) The boron nitride has strong heat conductivity and high insulativity, improves the heat dissipation capacity of the epoxy encapsulating material, and has no adverse effect on electronic components, electronic component combinations and circuit boards.
(4) The condensate does not contain harmful volatile matters, and is beneficial to environmental protection.
Detailed Description
The following is further illustrated with reference to examples:
example one
35 parts of boron nitride powder, adding 15 parts of dopamine aqueous solution, regulating the pH value by using trihydroxymethyl aminomethane, uniformly stirring, and drying at room temperature for 48 hours. 100 parts of bisphenol A epoxy resin E-51 and 32 parts of 1, 4-butanediol diglycidyl ether were put into a stirring tank and stirred, and 20 parts of polyamide 650, 2 parts of 2, 4, 6-tris (dimethylaminomethyl) phenol and 35 parts of dopamine-treated boron nitride powder were added. Mixing at room temperature, removing bubbles, bottling, and curing at 50 deg.C.
Example two
The implementation steps are the same as those in the first embodiment, except that: the dopamine is changed from 15 parts to 8 parts, and the polyamide 650 is changed from 20 parts to 27 parts.
EXAMPLE III
The implementation steps are the same as those in the first embodiment, except that: the amount of boron nitride was changed from 35 parts to 25 parts.
Comparative example
The implementation steps are the same as those in the first embodiment, except that: no boron nitride was added to the potting material.
And (3) performance measurement: the method is the same as the first embodiment.
TABLE Performance of the thermally conductive epoxy potting Material of the present invention
While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
The invention is not the best known technology.
Claims (3)
1. A heat-conducting epoxy potting material. The encapsulating material is prepared by compounding and encapsulating an organic component and a heat-conducting inorganic filler at room temperature and curing at 40-60 ℃. The raw material ratio is as follows:
the organic component comprises epoxy resin, a diluent, a curing agent and an accelerator. The epoxy resin is one or two of bisphenol A type epoxy resin E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, and the accelerator is 2, 4, 6-tris (dimethylaminomethyl) phenol.
2. The functional curing agent of claim 1, which is dopamine.
3. The thermally conductive inorganic filler of claim 1 is a micron-sized boron nitride powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111303429.4A CN113881382A (en) | 2021-11-05 | 2021-11-05 | Heat-conducting epoxy potting material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111303429.4A CN113881382A (en) | 2021-11-05 | 2021-11-05 | Heat-conducting epoxy potting material |
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| Publication Number | Publication Date |
|---|---|
| CN113881382A true CN113881382A (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111303429.4A Pending CN113881382A (en) | 2021-11-05 | 2021-11-05 | Heat-conducting epoxy potting material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115651582A (en) * | 2022-12-07 | 2023-01-31 | 河北工业大学 | Preparation method of heat-conducting toughening insulating epoxy resin structural adhesive |
-
2021
- 2021-11-05 CN CN202111303429.4A patent/CN113881382A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115651582A (en) * | 2022-12-07 | 2023-01-31 | 河北工业大学 | Preparation method of heat-conducting toughening insulating epoxy resin structural adhesive |
| CN115651582B (en) * | 2022-12-07 | 2023-09-22 | 河北工业大学 | Preparation method of heat-conducting toughened insulating epoxy resin structural adhesive |
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