CN113861626A - High-performance epoxy composite casting material - Google Patents

Abstract

The invention relates to a high-performance epoxy composite casting material, in particular to a casting material compounded by high-performance epoxy resin and inorganic filler. The epoxy resin-based epoxy resin composite material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler, and is compounded and cast at room temperature, and curing is completed at 40-60 ℃. According to the invention, the silane coupling agent treatment is adopted, so that the hydrophobicity, the insulativity and the dispersion stability of the inorganic filler are improved, the mechanical property of the casting material is improved through the inorganic filler, and the protection effect on electronic components in a high-humidity and high-salt-spray environment is also improved.

Description

High-performance epoxy composite casting material

Technical Field

The present invention relates to a casting material for electronic components, and more particularly to a casting material in which a high-performance epoxy resin is compounded with an inorganic filler.

Background

The epoxy resin is adopted to encapsulate the electronic components, so that air, moisture and carbon dioxide can be blocked, the working environment of the electronic components, the electronic component combination and the circuit board is improved, the service life of the components is prolonged, the stability of the electronic components in the transportation and use processes can be improved, and the damage of mechanical forces such as oscillation and impact on the electronic components, the electronic component combination and the circuit board is prevented. However, the protective effect of the conventional epoxy resin casting material after curing needs to be improved, and electronic components, electronic component combinations and circuit boards face great test particularly under severe environments such as high humidity and high salt mist.

In order to overcome the defects that the existing epoxy casting resin is easy to absorb moisture in air in the construction process of casting a cylinder, so that tiny bubbles exist after a casting body is formed, partial discharge between coils is easy to generate, short-circuit breakdown is caused, and the service life of a transformer is shortened, CN 101812217 discloses a partial discharge resistant epoxy casting resin which comprises 2 components, is simple in production process, does not have three wastes in production, and does not pollute the environment. The component A comprises 20-30 parts of E39D type epoxy resin, 50-90 parts of CYD128 type epoxy casting resin, 3-10 parts of 594 type epoxy resin reactive diluent, 10-40 parts of semiconductor resin slurry and 800-1200-mesh SiO₂80-120 parts. The component B is 100-140 parts of methyl tetrahydrophthalic anhydride and 1000-mesh 1500-mesh SiO₂80-190 parts of N, N-dimethylbenzylamine, 0.1-1.5 parts of N, N-dimethylbenzylamine and 20-70 parts of hydroxyl-terminated liquid rubber. Because the component B contains hydroxyl-terminated liquid rubber, the effects of heat resistance, thermal oxygen resistance and ultraviolet aging resistance are not good enough.

CN105229078 discloses an epoxy casting resin system with good resistance to water, salt spray, inorganic acids, bases and most organic solvents. The epoxy resins have low viscosity while maintaining advantageous physical, thermal and electrical properties. The epoxy casting resin system can be used for at least partially covering electronic components or devices, and compared with similar products in the market, the thermal conductivity is improved by 24 percent, the electric conductivity is improved by 9.5 percent, and the physical property of the cured epoxy resin is improved by 10 to 20 percent. While the disclosed materials can achieve advantageous properties such as thermal conductivity through the use of non-alumina filled epoxy resins (e.g., using boron nitride), these are significantly more expensive. Thus, the disclosed materials are an economically efficient way to have improved properties over other epoxy resins in their class. The resin system is divided into a resin part (part a) and a hardener part (part B) which are mixed together to start the reaction. Bisphenol F epoxy resin, butyl glycidyl ether, epoxy carbon black dispersoid, alumina, phosphonium salt, aluminum hydroxide and ammonium polyphosphate are used as a part A, and polyethylene glycol diamine and polyamine blend is used as a part B. 5 to 10 percent by weight of polyethylene glycol diamine is used as a reactant in the system. The epoxy resin and hardener are mixed together to form a resin, which is poured into a container to cure. The mixed resin was then cured at 60 ℃ for 2 hours. The patent uses bisphenol F epoxy resin with higher price, the mass usage of aluminum hydroxide is 9 percent, the mass usage of aluminum oxide is up to 54 percent, and the inorganic material filler improves the resistance of a material system to environmental destruction factors, but the usage of the filler is too high, which is not beneficial to basic mechanical properties, such as compressive strength and impact strength. In addition, aluminum hydroxide and aluminum oxide exist in the form of particles or powder in the epoxy resin, and the efficiency of resistance to the destructive action of environmental factors is low.

The invention discloses a high-performance epoxy composite casting material, and particularly relates to a casting material compounded by high-performance epoxy resin and an inorganic filler. The epoxy resin-based epoxy resin composite material comprises organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler, and is compounded and cast at room temperature, and curing is completed at 40-60 ℃.

Disclosure of Invention

The invention aims to provide a high-performance epoxy composite casting material. The casting material is prepared by compounding and casting organic components of epoxy resin, a diluent, a curing agent, an accelerator, a silane coupling agent and an inorganic filler at room temperature, and curing is completed at 40-60 ℃. The inorganic filler improves the protection effect on electronic components, electronic component combinations and circuit boards under severe environments such as high humidity, high salt mist and the like.

The technical scheme of the invention is as follows:

a high-performance epoxy composite casting material. The casting material is prepared by compounding and casting an organic component and an inorganic filler at room temperature and completing curing at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises bisphenol A epoxy resin, a diluent, a curing agent, an accelerator and a silane coupling agent. The bisphenol A type epoxy resin is one or two of E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, the accelerator is 2, 4, 6-tris (dimethylaminomethyl) phenol, and the coupling agent is one or two of epoxy silane 3- (2, 3-glycidoxy) propyl trimethoxysilane, 3- (2, 3-glycidoxy) propyl triethoxysilane and 2- (3, 4-epoxycyclohexyl) ethyl trimethoxysilane.

The inorganic filler is pyrophyllite treated by a silane coupling agent.

The invention has the beneficial effects that:

(1) the high-performance epoxy composite casting material disclosed by the invention has good mechanical properties after being cured, and the protection effect on electronic components, electronic component combinations and circuit boards in a high-humidity and high-salt-spray environment is improved.

(2) The pyrophyllite can reinforce epoxy resin, improve mechanical property, has good cutting insulation property and stable physical and chemical properties, and has no adverse effect on the normal operation of electronic components.

(3) The pyrophyllite is treated by epoxy silane, so that the hydrophobicity and the insulativity of the pyrophyllite are further improved, and the epoxy silane participates in curing, so that the dispersion stability of the pyrophyllite is improved.

(4) The condensate does not contain harmful volatile matters, and is beneficial to environmental protection.

Detailed Description

The following is further illustrated with reference to examples:

example one

35 parts of 1000-mesh pyrophyllite powder, and an ethanol solution of 3- (2, 3-epoxypropoxy) propyl trimethoxy silane are uniformly mixed, and the mixture is dried for 48 hours at room temperature for use. 100 parts of bisphenol A epoxy resin E-51 and 32 parts of 1, 4-butanediol diglycidyl ether are added into a stirring tank to be stirred, and 20 parts of polyamide 650, 2 parts of 2, 4, 6-tris (dimethylaminomethyl) phenol and 35 parts of pyrophyllite powder treated by a coupling agent are added. Mixing at room temperature, removing bubbles, pouring, and curing at 60 deg.C.

Determination of compressive strength and modulus of elasticity: the determination method is referred to GB/T2567-2008.

Example two

The implementation steps are the same as those in the first embodiment, except that: the pyrophyllite is changed from 35 parts to 15 parts.

And (3) performance measurement: the method is the same as the first embodiment.

EXAMPLE III

The implementation steps are the same as those in the first embodiment, except that: pyrophyllite was not treated with a coupling agent.

And (3) performance measurement: the method is the same as the first embodiment.

Comparative example

The implementation steps are the same as those in the first embodiment, except that: no pyrophyllite was added to the casting material.

And (3) performance measurement: the method is the same as the first embodiment.

TABLE-attached Properties of the high-Performance epoxy composite castable of the invention

	Example one	Example two	EXAMPLE III	Comparative example
					Compressive strength/MPa	85.8	80.5	60.3	63.7
Modulus of elasticity/GPa	4.9	3.8	2.5	1.8

While the invention has been described in further detail with reference to specific preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The invention is not the best known technology.

Claims (2)

1. A high-performance epoxy composite casting material. The casting material is prepared by compounding and casting an organic component and an inorganic filler at room temperature and completing curing at 40-60 ℃. The raw material ratio is as follows:

the organic component comprises bisphenol A epoxy resin, a diluent, a curing agent, an accelerator and a silane coupling agent. The bisphenol A type epoxy resin is one or two of E-51 and E-44, the diluent is one or two of 1, 4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether and butyl glycidyl ether, the curing agent is one or two of polyamide 650, N, N-dimethylaniline and modified fatty amine 593, the accelerator is 2, 4, 6-tris (dimethylaminomethyl) phenol, and the coupling agent is one or two of epoxy silane 3- (2, 3-glycidoxy) propyl trimethoxysilane, 3- (2, 3-glycidoxy) propyl triethoxysilane and 2- (3, 4-epoxycyclohexyl) ethyl trimethoxysilane.

2. The inorganic filler according to claim 1, which is pyrophyllite treated with a silane coupling agent.