DE112014004745A5 - Herstellung eines optoelektronischen Bauelements - Google Patents
Herstellung eines optoelektronischen Bauelements Download PDFInfo
- Publication number
- DE112014004745A5 DE112014004745A5 DE112014004745.7T DE112014004745T DE112014004745A5 DE 112014004745 A5 DE112014004745 A5 DE 112014004745A5 DE 112014004745 T DE112014004745 T DE 112014004745T DE 112014004745 A5 DE112014004745 A5 DE 112014004745A5
- Authority
- DE
- Germany
- Prior art keywords
- production
- optoelectronic component
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013220790.5 | 2013-10-15 | ||
DE102013220790.5A DE102013220790A1 (de) | 2013-10-15 | 2013-10-15 | Herstellung eines optoelektronischen Bauelements |
PCT/EP2014/072007 WO2015055646A2 (de) | 2013-10-15 | 2014-10-14 | Herstellung eines optoelektronischen bauelements |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112014004745A5 true DE112014004745A5 (de) | 2016-10-27 |
Family
ID=51844677
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013220790.5A Withdrawn DE102013220790A1 (de) | 2013-10-15 | 2013-10-15 | Herstellung eines optoelektronischen Bauelements |
DE112014004745.7T Withdrawn DE112014004745A5 (de) | 2013-10-15 | 2014-10-14 | Herstellung eines optoelektronischen Bauelements |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013220790.5A Withdrawn DE102013220790A1 (de) | 2013-10-15 | 2013-10-15 | Herstellung eines optoelektronischen Bauelements |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160233200A1 (de) |
CN (1) | CN105612624A (de) |
DE (2) | DE102013220790A1 (de) |
WO (1) | WO2015055646A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018162075A1 (en) * | 2017-03-10 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
DE102017117150A1 (de) * | 2017-07-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil |
DE102019118543B4 (de) * | 2019-07-09 | 2023-02-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anordnung von elektronischen halbleiterbauelementen und verfahren zum betrieb einer anordnung von elektronischen halbleiterbauelementen |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1457078B1 (de) * | 2001-12-18 | 2006-03-08 | Telefonaktiebolaget LM Ericsson (publ) | Verfahren zum transferieren von teilnehmerdaten zwischen verschiedenen servern eines telekommunikationsnetzes |
JP2005259847A (ja) * | 2004-03-10 | 2005-09-22 | Nitto Denko Corp | 光半導体装置の製造方法 |
JP3964438B2 (ja) * | 2005-06-27 | 2007-08-22 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置および半導体装置の製造方法 |
US7520052B2 (en) * | 2005-06-27 | 2009-04-21 | Texas Instruments Incorporated | Method of manufacturing a semiconductor device |
JP4001608B2 (ja) * | 2005-06-27 | 2007-10-31 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置および半導体装置の製造方法 |
KR100703217B1 (ko) * | 2006-02-22 | 2007-04-09 | 삼성전기주식회사 | 발광다이오드 패키지 제조방법 |
DE102009058006B4 (de) * | 2009-12-11 | 2022-03-31 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
US8148210B1 (en) * | 2010-09-13 | 2012-04-03 | Infineon Technologies Ag | Method for fabricating a semiconductor chip panel |
CN102683542B (zh) * | 2011-03-15 | 2014-12-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
CN202049995U (zh) * | 2011-04-19 | 2011-11-23 | 鹤山丽得电子实业有限公司 | 一种贴片发光二极管支架及采用该支架的贴片发光二极管 |
JP6003016B2 (ja) * | 2011-07-15 | 2016-10-05 | ソニー株式会社 | 還元処理装置、還元処理方法および還元システム |
JP2013038187A (ja) * | 2011-08-05 | 2013-02-21 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
DE102011111917A1 (de) * | 2011-08-30 | 2013-02-28 | Osram Opto Semiconductors Gmbh | Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements |
CN103187485A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管的制造方法 |
-
2013
- 2013-10-15 DE DE102013220790.5A patent/DE102013220790A1/de not_active Withdrawn
-
2014
- 2014-10-14 DE DE112014004745.7T patent/DE112014004745A5/de not_active Withdrawn
- 2014-10-14 WO PCT/EP2014/072007 patent/WO2015055646A2/de active Application Filing
- 2014-10-14 CN CN201480056817.9A patent/CN105612624A/zh active Pending
- 2014-10-15 US US15/025,759 patent/US20160233200A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2015055646A2 (de) | 2015-04-23 |
DE102013220790A1 (de) | 2015-04-16 |
WO2015055646A3 (de) | 2016-01-21 |
US20160233200A1 (en) | 2016-08-11 |
CN105612624A (zh) | 2016-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK2988791T3 (da) | Tværbundet silke-hyaluronsyresammensætning | |
DE112015001114A5 (de) | Herstellung optoelektronischer Bauelemente | |
DK2999494T3 (da) | Anti-trombogene transplantater | |
DK3083554T3 (da) | Dimethylbenzoesyreforbindelser | |
DK2943561T3 (da) | Fotobioreaktor | |
DE112013004556A5 (de) | Optoelektronisches Bauelement | |
DK2965026T3 (da) | Generering af slushice | |
DE112014005652A5 (de) | Optoelektronisches Bauelement | |
DE112014001263A5 (de) | Optoelektronisches Bauelement | |
FR3001759B1 (fr) | Rouge aubagee de turbomachine | |
DE112013004762A5 (de) | Optoelektronisches Bauelement | |
DE112014001966A5 (de) | Optoelektronisches Bauelement | |
FR3000700B1 (fr) | Revetement anti-foudre | |
DE112014001282A5 (de) | Herstellung eines optoelektronischen Bauelements | |
DE112014003515A5 (de) | Optoelektronisches Bauelement | |
DE112014004745A5 (de) | Herstellung eines optoelektronischen Bauelements | |
DE112014005124A5 (de) | Optoelektronisches Bauelement | |
DE112014002171A5 (de) | Thermophoretische Kraftmaschine | |
FR3015054B1 (fr) | Structure alveolaire | |
DE112014002467A5 (de) | Optoelektronisches Bauelement | |
ES1081332Y (es) | Protesis ocular | |
ES1098808Y (es) | Juguete-instrumento de muneco bailarin | |
ES1086679Y (es) | Caballete-Expositor de cuadros | |
DE112014002410A5 (de) | Organisches optoelektronisches Bauteil | |
DE112014003213A5 (de) | Flansch |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |