DE112014001263A5 - Optoelektronisches Bauelement - Google Patents

Optoelektronisches Bauelement Download PDF

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Publication number
DE112014001263A5
DE112014001263A5 DE112014001263.7T DE112014001263T DE112014001263A5 DE 112014001263 A5 DE112014001263 A5 DE 112014001263A5 DE 112014001263 T DE112014001263 T DE 112014001263T DE 112014001263 A5 DE112014001263 A5 DE 112014001263A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014001263.7T
Other languages
English (en)
Other versions
DE112014001263B4 (de
Inventor
Stefan Grötsch
Michael Brandl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014001263A5 publication Critical patent/DE112014001263A5/de
Application granted granted Critical
Publication of DE112014001263B4 publication Critical patent/DE112014001263B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
DE112014001263.7T 2013-03-12 2014-02-25 Optoelektronisches Bauelement und Leuchtvorrichtung Expired - Fee Related DE112014001263B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013204291.4 2013-03-12
DE102013204291.4A DE102013204291A1 (de) 2013-03-12 2013-03-12 Optoelektronisches Bauelement
PCT/EP2014/053599 WO2014139789A1 (de) 2013-03-12 2014-02-25 Optoelektronisches bauelement

Publications (2)

Publication Number Publication Date
DE112014001263A5 true DE112014001263A5 (de) 2015-11-26
DE112014001263B4 DE112014001263B4 (de) 2020-06-18

Family

ID=50179615

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013204291.4A Withdrawn DE102013204291A1 (de) 2013-03-12 2013-03-12 Optoelektronisches Bauelement
DE112014001263.7T Expired - Fee Related DE112014001263B4 (de) 2013-03-12 2014-02-25 Optoelektronisches Bauelement und Leuchtvorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013204291.4A Withdrawn DE102013204291A1 (de) 2013-03-12 2013-03-12 Optoelektronisches Bauelement

Country Status (5)

Country Link
US (1) US20160020365A1 (de)
JP (1) JP6096939B2 (de)
KR (1) KR20150127657A (de)
DE (2) DE102013204291A1 (de)
WO (1) WO2014139789A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015107593A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Leuchtmittel
WO2017138180A1 (ja) * 2016-02-09 2017-08-17 日東電工株式会社 セラミックスプレート、その製造方法および光半導体装置
JP6743801B2 (ja) 2017-10-27 2020-08-19 日亜化学工業株式会社 発光装置の製造方法
JP7092506B2 (ja) * 2018-01-09 2022-06-28 スタンレー電気株式会社 発光装置
JP7101547B2 (ja) * 2018-06-27 2022-07-15 株式会社小糸製作所 車両用前照灯
US11158774B2 (en) 2018-12-14 2021-10-26 Nichia Corporation Light-emitting device, light-emitting module, and method of manufacturing light-emitting device
JP7474770B2 (ja) * 2019-09-18 2024-04-25 泉州三安半導体科技有限公司 発光ダイオードパッケージアセンブリ

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP4144498B2 (ja) * 2002-10-01 2008-09-03 松下電器産業株式会社 線状光源装置及びその製造方法、並びに、面発光装置
JP2006351773A (ja) * 2005-06-15 2006-12-28 Rohm Co Ltd 半導体発光装置
JP5214128B2 (ja) * 2005-11-22 2013-06-19 シャープ株式会社 発光素子及び発光素子を備えたバックライトユニット
JP2008135709A (ja) * 2006-10-31 2008-06-12 Sharp Corp 発光装置、画像表示装置、およびその製造方法
US8410500B2 (en) * 2006-12-21 2013-04-02 Koninklijke Philips Electronics N.V. Light-emitting apparatus with shaped wavelength converter
WO2009115998A2 (en) * 2008-03-21 2009-09-24 Koninklijke Philips Electronics N.V. A luminous device
MY153923A (en) * 2008-07-30 2015-04-15 Lummus Technology Inc High energy reduction in a propane dehydrogenation unit by utilizing a high pressure product splitter column
TWI478370B (zh) * 2008-08-29 2015-03-21 Epistar Corp 一具有波長轉換結構之半導體發光裝置及其封裝結構
WO2010035206A1 (en) * 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof
US8378358B2 (en) * 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
WO2010143114A1 (en) * 2009-06-11 2010-12-16 Koninklijke Philips Electronics N.V. Led illumination device
JP2011096740A (ja) * 2009-10-27 2011-05-12 Panasonic Electric Works Co Ltd 発光装置
DE102010028407B4 (de) * 2010-04-30 2021-01-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102010024864B4 (de) * 2010-06-24 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
DE102010036739B4 (de) * 2010-07-29 2022-02-17 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Betankungsvorrichtung und Kraftfahrzeug mit einer derartigen Betankungsvorrichtung
DE102010048162A1 (de) * 2010-10-11 2012-04-12 Osram Opto Semiconductors Gmbh Konversionsbauteil
JP5700544B2 (ja) * 2011-04-14 2015-04-15 日東電工株式会社 発光ダイオード装置の製造方法
JP5730680B2 (ja) * 2011-06-17 2015-06-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
DE102012102420B4 (de) * 2012-03-21 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
JP6153327B2 (ja) * 2013-01-22 2017-06-28 シチズン電子株式会社 Ｌｅｄモジュール

Also Published As

Publication number Publication date
JP2016510177A (ja) 2016-04-04
WO2014139789A1 (de) 2014-09-18
JP6096939B2 (ja) 2017-03-15
DE102013204291A1 (de) 2014-10-02
US20160020365A1 (en) 2016-01-21
KR20150127657A (ko) 2015-11-17
DE112014001263B4 (de) 2020-06-18

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R012 Request for examination validly filed
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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033460000

Ipc: H01L0025075000

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025075000

Ipc: H01L0025130000

R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee