DE112014002467A5 - Optoelektronisches Bauelement - Google Patents

Optoelektronisches Bauelement Download PDF

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Publication number
DE112014002467A5
DE112014002467A5 DE112014002467.8T DE112014002467T DE112014002467A5 DE 112014002467 A5 DE112014002467 A5 DE 112014002467A5 DE 112014002467 T DE112014002467 T DE 112014002467T DE 112014002467 A5 DE112014002467 A5 DE 112014002467A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014002467.8T
Other languages
English (en)
Other versions
DE112014002467B4 (de
Inventor
Simon Schicktanz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pictiva Displays International Ltd
Original Assignee
Osram Oled GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Oled GmbH filed Critical Osram Oled GmbH
Publication of DE112014002467A5 publication Critical patent/DE112014002467A5/de
Application granted granted Critical
Publication of DE112014002467B4 publication Critical patent/DE112014002467B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
DE112014002467.8T 2013-05-17 2014-05-19 Optoelektronisches Bauelement Active DE112014002467B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013105128.6 2013-05-17
DE102013105128.6A DE102013105128A1 (de) 2013-05-17 2013-05-17 Optoelektronisches Bauelement
PCT/EP2014/060243 WO2014184387A1 (de) 2013-05-17 2014-05-19 Optoelektronisches bauelement

Publications (2)

Publication Number Publication Date
DE112014002467A5 true DE112014002467A5 (de) 2016-02-18
DE112014002467B4 DE112014002467B4 (de) 2022-05-25

Family

ID=50780473

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013105128.6A Withdrawn DE102013105128A1 (de) 2013-05-17 2013-05-17 Optoelektronisches Bauelement
DE112014002467.8T Active DE112014002467B4 (de) 2013-05-17 2014-05-19 Optoelektronisches Bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013105128.6A Withdrawn DE102013105128A1 (de) 2013-05-17 2013-05-17 Optoelektronisches Bauelement

Country Status (4)

Country Link
US (1) US9748519B2 (de)
CN (1) CN105229816B (de)
DE (2) DE102013105128A1 (de)
WO (1) WO2014184387A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016103336A1 (de) * 2016-02-25 2017-08-31 Osram Oled Gmbh Elektronisches Bauelement und Verfahren zu seiner Herstellung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405335B2 (ja) * 2000-11-27 2003-05-12 株式会社デンソー 有機ｅｌ素子
JP4325249B2 (ja) 2003-03-31 2009-09-02 凸版印刷株式会社 有機エレクトロルミネッセンス素子の製造方法
JP2006351299A (ja) * 2005-06-14 2006-12-28 Tohoku Pioneer Corp 自発光パネル、自発光パネル用の封止部材、および自発光パネルの製造方法
JP5201854B2 (ja) 2007-03-07 2013-06-05 キヤノン株式会社 有機ｅｌパネルの製造方法
RU2482637C2 (ru) * 2007-08-17 2013-05-20 Конинклейке Филипс Электроникс Н.В. Масштабируемый распределитель электропитания
TWI420722B (zh) 2008-01-30 2013-12-21 Osram Opto Semiconductors Gmbh 具有封裝單元之裝置
LU91493B1 (en) 2008-10-31 2010-05-03 Wurth Paul Sa Method for operating a blast furnace and blast furnace installation
DE102009024411A1 (de) 2009-03-24 2010-09-30 Osram Opto Semiconductors Gmbh Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement
DE102009042795A1 (de) * 2009-09-25 2011-04-07 Schreiner Group Gmbh & Co. Kg Verfahren zur Herstellung eines Elektrolumineszenzelements, Verwendung eines Drucklacks und Elektrolumineszenzelement
JP5290268B2 (ja) 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
DE102011077614B4 (de) 2011-06-16 2023-08-17 Osram Gmbh Verfahren zur Herstellung einer Leuchtvorrichtung und Leuchtvorrichtung
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung

Also Published As

Publication number Publication date
CN105229816A (zh) 2016-01-06
DE112014002467B4 (de) 2022-05-25
DE102013105128A1 (de) 2014-11-20
WO2014184387A1 (de) 2014-11-20
US20160079563A1 (en) 2016-03-17
CN105229816B (zh) 2017-08-08
US9748519B2 (en) 2017-08-29

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: PICTIVA DISPLAYS INTERNATIONAL LIMITED, IE

Free format text: FORMER OWNER: OSRAM OLED GMBH, 93049 REGENSBURG, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0051520000

Ipc: H10K0050800000

R020 Patent grant now final