DE112014001966A5 - Optoelektronisches Bauelement - Google Patents
Optoelektronisches Bauelement Download PDFInfo
- Publication number
- DE112014001966A5 DE112014001966A5 DE112014001966.6T DE112014001966T DE112014001966A5 DE 112014001966 A5 DE112014001966 A5 DE 112014001966A5 DE 112014001966 T DE112014001966 T DE 112014001966T DE 112014001966 A5 DE112014001966 A5 DE 112014001966A5
- Authority
- DE
- Germany
- Prior art keywords
- optoelectronic component
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013103760.7 | 2013-04-15 | ||
DE102013103760.7A DE102013103760A1 (de) | 2013-04-15 | 2013-04-15 | Optoelektronisches Bauelement |
PCT/EP2014/057300 WO2014170211A1 (de) | 2013-04-15 | 2014-04-10 | Optoelektronisches bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112014001966A5 true DE112014001966A5 (de) | 2015-12-24 |
Family
ID=50628770
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013103760.7A Withdrawn DE102013103760A1 (de) | 2013-04-15 | 2013-04-15 | Optoelektronisches Bauelement |
DE112014001966.6T Pending DE112014001966A5 (de) | 2013-04-15 | 2014-04-10 | Optoelektronisches Bauelement |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013103760.7A Withdrawn DE102013103760A1 (de) | 2013-04-15 | 2013-04-15 | Optoelektronisches Bauelement |
Country Status (3)
Country | Link |
---|---|
US (2) | US9530951B2 (de) |
DE (2) | DE102013103760A1 (de) |
WO (1) | WO2014170211A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015113310B4 (de) * | 2015-08-12 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchip |
US10787303B2 (en) | 2016-05-29 | 2020-09-29 | Cellulose Material Solutions, LLC | Packaging insulation products and methods of making and using same |
US11078007B2 (en) | 2016-06-27 | 2021-08-03 | Cellulose Material Solutions, LLC | Thermoplastic packaging insulation products and methods of making and using same |
DE102017117165B4 (de) * | 2017-07-28 | 2023-04-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils |
CN111341750B (zh) * | 2018-12-19 | 2024-03-01 | 奥特斯奥地利科技与系统技术有限公司 | 包括有导电基部结构的部件承载件及制造方法 |
CN113207244A (zh) * | 2020-02-03 | 2021-08-03 | 奥特斯奥地利科技与系统技术有限公司 | 制造部件承载件的方法及部件承载件 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
JP4359195B2 (ja) * | 2004-06-11 | 2009-11-04 | 株式会社東芝 | 半導体発光装置及びその製造方法並びに半導体発光ユニット |
US20060124953A1 (en) | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
KR100949197B1 (ko) * | 2007-12-28 | 2010-03-23 | 전자부품연구원 | 방열 기판의 제조 방법 |
WO2011034259A1 (ko) * | 2009-09-17 | 2011-03-24 | 포인트엔지니어링 | 광소자 기판, 광소자 디바이스 및 그 제조 방법 |
DE102010034924A1 (de) * | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
DE102012101889A1 (de) | 2012-03-06 | 2013-09-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
DE102012207519A1 (de) | 2012-05-07 | 2013-11-07 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen eines bauelementträgers, einer elektronischen anordnung und einer strahlungsanordnung und bauelementträger, elektronische anordnung und strahlungsanordnung |
DE102012107797A1 (de) | 2012-08-23 | 2014-02-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement |
DE102012108160A1 (de) | 2012-09-03 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
-
2013
- 2013-04-15 DE DE102013103760.7A patent/DE102013103760A1/de not_active Withdrawn
-
2014
- 2014-04-10 WO PCT/EP2014/057300 patent/WO2014170211A1/de active Application Filing
- 2014-04-10 US US14/784,945 patent/US9530951B2/en active Active
- 2014-04-10 DE DE112014001966.6T patent/DE112014001966A5/de active Pending
-
2016
- 2016-11-16 US US15/353,687 patent/US9899586B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102013103760A1 (de) | 2014-10-16 |
WO2014170211A1 (de) | 2014-10-23 |
US20160056358A1 (en) | 2016-02-25 |
US9899586B2 (en) | 2018-02-20 |
US20170062687A1 (en) | 2017-03-02 |
US9530951B2 (en) | 2016-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL301171I1 (nl) | Tigolaner | |
DK3342773T3 (da) | Syk-hæmmere | |
DK3613453T3 (da) | Fordamper | |
DK3077047T3 (da) | Aramcholsalte | |
DK3060460T3 (da) | Saddel | |
DK3027598T3 (da) | Oxoquinazolinyl-butanamidderivater | |
DK2956698T5 (da) | Bindestrimler | |
DE112014005652A5 (de) | Optoelektronisches Bauelement | |
DK3052081T3 (da) | Pastil | |
DK2946640T3 (da) | Langmuir-probe | |
DE112014001263A5 (de) | Optoelektronisches Bauelement | |
DE112014001966A5 (de) | Optoelektronisches Bauelement | |
DE102013106534B8 (de) | Chromatographiepipettenspitze | |
DK3071227T3 (da) | Fiskevaccine | |
DE112014003515A5 (de) | Optoelektronisches Bauelement | |
DE112014001252A5 (de) | Aufbissschiene | |
DE112014005124A5 (de) | Optoelektronisches Bauelement | |
DK2981168T3 (da) | Laminitiskile | |
DE112014002467A5 (de) | Optoelektronisches Bauelement | |
DK3086679T3 (da) | Sportssko | |
FI10138U1 (fi) | Kelkkateltta | |
ES1078715Y (es) | Mosquitera | |
DE112014005422A5 (de) | Friktionsfalschdrallaggregat | |
DE112014002410A5 (de) | Organisches optoelektronisches Bauteil | |
TH1401007301A (th) | องค์ประกอบ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033480000 Ipc: H01L0033440000 |
|
R016 | Response to examination communication | ||
R016 | Response to examination communication | ||
R016 | Response to examination communication |