JP2013232452A5 - - Google Patents

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Publication number
JP2013232452A5
JP2013232452A5 JP2012102342A JP2012102342A JP2013232452A5 JP 2013232452 A5 JP2013232452 A5 JP 2013232452A5 JP 2012102342 A JP2012102342 A JP 2012102342A JP 2012102342 A JP2012102342 A JP 2012102342A JP 2013232452 A5 JP2013232452 A5 JP 2013232452A5
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JP
Japan
Prior art keywords
substrate
photocured product
anda
producing
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012102342A
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English (en)
Japanese (ja)
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JP5930832B2 (ja
JP2013232452A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2012102342A external-priority patent/JP5930832B2/ja
Priority to JP2012102342A priority Critical patent/JP5930832B2/ja
Priority to EP13782399.3A priority patent/EP2837019B1/en
Priority to PCT/JP2013/062684 priority patent/WO2013162049A1/en
Priority to US14/391,069 priority patent/US10150231B2/en
Priority to KR1020147032394A priority patent/KR101667132B1/ko
Priority to CN201380021750.0A priority patent/CN104246976B/zh
Priority to TW102114841A priority patent/TWI524383B/zh
Publication of JP2013232452A publication Critical patent/JP2013232452A/ja
Publication of JP2013232452A5 publication Critical patent/JP2013232452A5/ja
Publication of JP5930832B2 publication Critical patent/JP5930832B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012102342A 2012-04-27 2012-04-27 光硬化物の製造方法 Active JP5930832B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012102342A JP5930832B2 (ja) 2012-04-27 2012-04-27 光硬化物の製造方法
KR1020147032394A KR101667132B1 (ko) 2012-04-27 2013-04-23 광경화물의 제조 방법
PCT/JP2013/062684 WO2013162049A1 (en) 2012-04-27 2013-04-23 Method for manufacturing photo cured material
US14/391,069 US10150231B2 (en) 2012-04-27 2013-04-23 Method for manufacturing photo cured material
EP13782399.3A EP2837019B1 (en) 2012-04-27 2013-04-23 Method for manufacturing photo cured material, optical component, electronic component, and photo-curable composition
CN201380021750.0A CN104246976B (zh) 2012-04-27 2013-04-23 光固化物的制造方法
TW102114841A TWI524383B (zh) 2012-04-27 2013-04-25 製造經光固化材料的方法，製造具有電路之基板的方法，光學組件，及電子組件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012102342A JP5930832B2 (ja) 2012-04-27 2012-04-27 光硬化物の製造方法

Publications (3)

Publication Number Publication Date
JP2013232452A JP2013232452A (ja) 2013-11-14
JP2013232452A5 true JP2013232452A5 (enExample) 2015-05-07
JP5930832B2 JP5930832B2 (ja) 2016-06-08

Family

ID=49483339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012102342A Active JP5930832B2 (ja) 2012-04-27 2012-04-27 光硬化物の製造方法

Country Status (7)

Country Link
US (1) US10150231B2 (enExample)
EP (1) EP2837019B1 (enExample)
JP (1) JP5930832B2 (enExample)
KR (1) KR101667132B1 (enExample)
CN (1) CN104246976B (enExample)
TW (1) TWI524383B (enExample)
WO (1) WO2013162049A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6305058B2 (ja) 2013-03-05 2018-04-04 キヤノン株式会社 感光性ガス発生剤、光硬化性組成物
JP6327947B2 (ja) * 2013-06-26 2018-05-23 キヤノン株式会社 光硬化性組成物、これを用いた、膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、硬化物
JP6327948B2 (ja) * 2013-06-26 2018-05-23 キヤノン株式会社 光硬化性組成物、硬化物、これを用いた、膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6460672B2 (ja) 2013-09-18 2019-01-30 キヤノン株式会社 膜の製造方法、光学部品の製造方法、回路基板の製造方法及び電子部品の製造方法
WO2015065320A1 (en) * 2013-10-28 2015-05-07 Hewlett-Packard Development Company, L.P. Encapsulating a bonded wire with low profile encapsulation
JP6584074B2 (ja) 2014-02-26 2019-10-02 キヤノン株式会社 光硬化性組成物、硬化物、これを用いた、パターン形状を有する膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6624808B2 (ja) * 2014-07-25 2019-12-25 キヤノン株式会社 光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法
JP7118580B2 (ja) * 2014-08-26 2022-08-16 キヤノン株式会社 光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、およびインプリント用モールドの製造方法
JP6259383B2 (ja) * 2014-09-30 2018-01-10 富士フイルム株式会社 パターン形成体の製造方法、インクジェット用光硬化性組成物およびデバイスの製造方法
JP6779611B2 (ja) 2014-12-19 2020-11-04 キヤノン株式会社 インプリント用光硬化性組成物、硬化膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6324363B2 (ja) 2014-12-19 2018-05-16 キヤノン株式会社 インプリント用光硬化性組成物、これを用いた膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6632200B2 (ja) * 2015-02-27 2020-01-22 キヤノン株式会社 パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6700794B2 (ja) * 2015-04-03 2020-05-27 キヤノン株式会社 インプリント材吐出装置
US10562223B2 (en) 2015-10-29 2020-02-18 National Institute Of Advanced Industrial Science And Technology Imprint device
US10754244B2 (en) 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10845700B2 (en) 2016-03-31 2020-11-24 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10883006B2 (en) 2016-03-31 2021-01-05 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10754243B2 (en) 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10829644B2 (en) 2016-03-31 2020-11-10 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10578965B2 (en) 2016-03-31 2020-03-03 Canon Kabushiki Kaisha Pattern forming method
US10754245B2 (en) 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
WO2017175668A1 (ja) * 2016-04-08 2017-10-12 キヤノン株式会社 硬化物パターンの形成方法、加工基板の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法、インプリントモールドの製造方法、およびインプリント前処理コート用材料
KR102385158B1 (ko) 2017-03-08 2022-04-12 캐논 가부시끼가이샤 패턴 형성 방법, 임프린트 전처리 코팅 재료, 및 기판의 전처리 방법
KR102419881B1 (ko) 2017-08-10 2022-07-12 캐논 가부시끼가이샤 패턴 형성 방법
CN109116679A (zh) * 2018-09-19 2019-01-01 京东方科技集团股份有限公司 纳米压印方法及纳米压印装置
SG10202005345XA (en) * 2019-06-11 2021-01-28 Canon Kk Simulation method, simulation apparatus, and program
US12428508B2 (en) 2022-02-11 2025-09-30 Canon Kabushiki Kaisha Photocurable composition including a non-reactive polymer

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US6432614B1 (en) 1998-07-31 2002-08-13 Dai Nippon Printing Co., Ltd. Photosensitive resin composition and color filter
JP3615977B2 (ja) * 1999-12-21 2005-02-02 クラリアント インターナショナル リミテッド 感光性樹脂組成物
JP3700001B2 (ja) * 2002-09-10 2005-09-28 独立行政法人産業技術総合研究所 インプリント方法及び装置
WO2005120834A2 (en) * 2004-06-03 2005-12-22 Molecular Imprints, Inc. Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing
US20070228593A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
EP1957249B1 (en) 2005-12-08 2014-11-12 Canon Nanotechnologies, Inc. Method and system for double-sided patterning of substrates
JP5109556B2 (ja) * 2006-11-01 2012-12-26 セントラル硝子株式会社 １，１，２，２−テトラフルオロ−１−メトキシエタンを含む共沸及び共沸様組成物
JP4908369B2 (ja) * 2007-10-02 2012-04-04 株式会社東芝 インプリント方法及びインプリントシステム
JP2010106062A (ja) * 2008-10-28 2010-05-13 Fujifilm Corp ナノインプリント用組成物、パターンおよびその形成方法
JP2011066100A (ja) * 2009-09-16 2011-03-31 Bridgestone Corp 光硬化性転写シート、及びこれを用いた凹凸パターンの形成方法
JP5671302B2 (ja) 2009-11-10 2015-02-18 富士フイルム株式会社 インプリント用硬化性組成物、パターン形成方法およびパターン

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