JPS5553484A - Method of correcting slet of printed board - Google Patents
Method of correcting slet of printed boardInfo
- Publication number
- JPS5553484A JPS5553484A JP12607178A JP12607178A JPS5553484A JP S5553484 A JPS5553484 A JP S5553484A JP 12607178 A JP12607178 A JP 12607178A JP 12607178 A JP12607178 A JP 12607178A JP S5553484 A JPS5553484 A JP S5553484A
- Authority
- JP
- Japan
- Prior art keywords
- slet
- correcting
- printed board
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12607178A JPS5553484A (en) | 1978-10-16 | 1978-10-16 | Method of correcting slet of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12607178A JPS5553484A (en) | 1978-10-16 | 1978-10-16 | Method of correcting slet of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5553484A true JPS5553484A (en) | 1980-04-18 |
Family
ID=14925887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12607178A Pending JPS5553484A (en) | 1978-10-16 | 1978-10-16 | Method of correcting slet of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5553484A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0217878U (en) * | 1988-07-22 | 1990-02-06 | ||
JPH02256294A (en) * | 1988-12-15 | 1990-10-17 | Matsushita Electric Works Ltd | Warpage correcting device for printing wiring board |
JP2002368388A (en) * | 2001-06-11 | 2002-12-20 | Murata Mfg Co Ltd | Method for preventing warpage of circuit board, method for correcting warpage, and jig used therefor |
JP2007110051A (en) * | 2005-09-15 | 2007-04-26 | Denso Corp | Device for adjusting warpage amount of circuit board |
JP2009206446A (en) * | 2008-02-29 | 2009-09-10 | Ngk Spark Plug Co Ltd | Method for producing wiring board |
JP2014195042A (en) * | 2013-02-27 | 2014-10-09 | Shinko Electric Ind Co Ltd | Device for correcting substrate warpage and method for correcting substrate warpage |
JP2015019035A (en) * | 2013-06-11 | 2015-01-29 | イビデン株式会社 | Method of manufacturing wiring board, warpage correction method of wiring board and manufacturing apparatus for wiring board |
CN105960708A (en) * | 2014-09-27 | 2016-09-21 | 英特尔公司 | Substrate warpage control using temper glass with uni-directional heating |
-
1978
- 1978-10-16 JP JP12607178A patent/JPS5553484A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0217878U (en) * | 1988-07-22 | 1990-02-06 | ||
JPH02256294A (en) * | 1988-12-15 | 1990-10-17 | Matsushita Electric Works Ltd | Warpage correcting device for printing wiring board |
JP2002368388A (en) * | 2001-06-11 | 2002-12-20 | Murata Mfg Co Ltd | Method for preventing warpage of circuit board, method for correcting warpage, and jig used therefor |
JP2007110051A (en) * | 2005-09-15 | 2007-04-26 | Denso Corp | Device for adjusting warpage amount of circuit board |
JP4670581B2 (en) * | 2005-09-15 | 2011-04-13 | 株式会社デンソー | Circuit board warpage adjustment device |
JP2009206446A (en) * | 2008-02-29 | 2009-09-10 | Ngk Spark Plug Co Ltd | Method for producing wiring board |
JP4673388B2 (en) * | 2008-02-29 | 2011-04-20 | 日本特殊陶業株式会社 | Wiring board manufacturing method |
JP2014195042A (en) * | 2013-02-27 | 2014-10-09 | Shinko Electric Ind Co Ltd | Device for correcting substrate warpage and method for correcting substrate warpage |
JP2015019035A (en) * | 2013-06-11 | 2015-01-29 | イビデン株式会社 | Method of manufacturing wiring board, warpage correction method of wiring board and manufacturing apparatus for wiring board |
CN105960708A (en) * | 2014-09-27 | 2016-09-21 | 英特尔公司 | Substrate warpage control using temper glass with uni-directional heating |
JP2016540390A (en) * | 2014-09-27 | 2016-12-22 | インテル コーポレイション | Warpage control of substrates using tempered glass with unidirectional heating |
US9887110B2 (en) | 2014-09-27 | 2018-02-06 | Intel Corporation | Substrate warpage control using temper glass with uni-directional heating |
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