JP2014194837A - 半導体装置及び電子機器 - Google Patents
半導体装置及び電子機器 Download PDFInfo
- Publication number
- JP2014194837A JP2014194837A JP2014034764A JP2014034764A JP2014194837A JP 2014194837 A JP2014194837 A JP 2014194837A JP 2014034764 A JP2014034764 A JP 2014034764A JP 2014034764 A JP2014034764 A JP 2014034764A JP 2014194837 A JP2014194837 A JP 2014194837A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- memory cell
- voltage
- gate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 204
- 239000003990 capacitor Substances 0.000 claims description 23
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000005685 electric field effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 87
- 239000000758 substrate Substances 0.000 description 35
- 239000011701 zinc Substances 0.000 description 29
- 239000013078 crystal Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 20
- 239000008186 active pharmaceutical agent Substances 0.000 description 15
- 230000006870 function Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000012535 impurity Substances 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 238000010894 electron beam technology Methods 0.000 description 9
- 230000005669 field effect Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 238000007667 floating Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 208000005156 Dehydration Diseases 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 238000006356 dehydrogenation reaction Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000013081 microcrystal Substances 0.000 description 4
- 229910018137 Al-Zn Inorganic materials 0.000 description 3
- 229910018573 Al—Zn Inorganic materials 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- -1 for example Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 229910018120 Al-Ga-Zn Inorganic materials 0.000 description 2
- 229910020833 Sn-Al-Zn Inorganic materials 0.000 description 2
- 229910020868 Sn-Ga-Zn Inorganic materials 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000012905 input function Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000006213 oxygenation reaction Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020944 Sn-Mg Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- 229910007573 Zn-Mg Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002524 electron diffraction data Methods 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
- H01L27/1225—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Abstract
【解決手段】メモリセルが有する、ゲートに保持されたデータを読み出すためのトランジスタをソースフォロワ(ドレイン接地)として用いる構成とする。そして、メモリセルに流す参照電流を生成するトランジスタに印加する電圧を、ゲート−ソース間に印加する電圧が、概ね該トランジスタの閾値電圧となるように設定する構成とする。該構成により、メモリセルの保持されたデータが外部に読み出される際、その出力電圧を、トランジスタの電界効果移動度やトランジスタサイズ等のばらつきの影響が軽減された値として、出力させることができる。
【選択図】図1
Description
1.実施の形態1(本発明の一態様に関する基本構成について)
2.実施の形態2(センスアンプ、参照電圧生成回路の構成例について)
3.実施の形態3(周辺回路の構成例、半導体装置の動作について)
4.実施の形態4(半導体装置の変形例について)
5.実施の形態5(酸化物半導体について)
6.実施の形態6(半導体装置を構成する素子について)
7.実施の形態7(半導体装置の電子部品及び該電子部品を具備する電子機器への適用例)
本実施の形態では、開示する発明の一態様に係る半導体装置の基本構成について、図1を参照して説明する。
本実施の形態では、上記実施の形態1で図示したセンスアンプ、及びセンスアンプに与えられる参照電圧を生成する参照電圧生成回路の構成例について、図3及び図4を参照して説明する。
本実施の形態では、上記実施の形態1、2で図示したメモリセル、参照電流生成回路、センスアンプ、及び参照電圧生成回路を含む周辺回路の構成例について、図5を参照して説明する。また本実施の形態では、列方向に設けられた複数のメモリセルを例に挙げて、該メモリセルから多値のデータを読み出す際のタイミングチャート図について、図6及び図7を参照して説明する。
本実施の形態では、上記実施の形態1乃至3で説明した半導体装置の各構成における変形例について、図8乃至図11を参照して説明する。
本実施の形態では、上記実施の形態で説明したオフ電流の低いトランジスタの半導体層に用いることのできる酸化物半導体層について説明する。
本実施の形態では、開示する発明の一態様に係る半導体装置のメモリセルが有するトランジスタの断面の構造について、図面を参照して説明する。
本実施の形態では、上述の実施の形態で説明した半導体装置を電子部品に適用する例、及び該電子部品を具備する電子機器に適用する例について、図14、図15を用いて説明する。
D_3 データ
D_5 データ
DS データ
DS_1 データ
Node_M ノード
Node_ref ノード
Node_D1 ノード
Node_M1 ノード
Node_M2 ノード
Node_M3 ノード
RS 読み出し信号
RS_1 読み出し信号
RS_2 読み出し信号
RS_3 読み出し信号
Sout 判定信号
Sout_n 判定信号
Sout_1 判定信号
V_x 基準電圧
V_1 基準電圧
V_7 基準電圧
Vref 参照電圧
Vref_x 参照電圧
Vref_1 参照電圧
Vref_7 参照電圧
WS ワード信号
WS_1 ワード信号
WS_2 ワード信号
WS_3 ワード信号
SEL 選択信号
Ref_SEL 選択信号
100 半導体装置
100p 半導体装置
100q 半導体装置
100r 半導体装置
100s 半導体装置
101 メモリセル
101_mn メモリセル
101_11 メモリセル
101_12 メモリセル
101_13 メモリセル
101_21 メモリセル
101_22 メモリセル
102 参照電流生成回路
102_n 参照電流生成回路
102_1 参照電流生成回路
103 センスアンプ
103_n センスアンプ
103_1 センスアンプ
104 参照電圧生成回路
111 トランジスタ
111_1 トランジスタ
111_3 トランジスタ
112 トランジスタ
112_1 トランジスタ
112_3 トランジスタ
112p トランジスタ
113 容量素子
113_1 容量素子
113_3 容量素子
114 トランジスタ
121 トランジスタ
121p トランジスタ
122 電圧源
123 スイッチ
131 オペアンプ
141 トランジスタ
142 トランジスタ
143 トランジスタ
144 電圧源
145 基準電圧生成回路
151 抵抗素子
152 バッファ回路
170 半導体装置
171 メモリセル
172 電流電圧変換回路
173 センスアンプ
181 トランジスタ
182 トランジスタ
183 容量素子
191 負荷
193 スイッチ
200 記憶回路部
201 駆動回路
202 駆動回路
203 電源回路
204 回路部
205 演算回路
300 半導体装置
700 電子部品
701 リード
702 プリント基板
703 半導体装置
704 実装基板
800 半導体基板
801 素子分離用絶縁膜
802 不純物領域
803 不純物領域
804 ゲート電極
805 ゲート絶縁膜
809 絶縁膜
810 配線
811 配線
812 配線
815 配線
816 配線
817 配線
820 絶縁膜
821 配線
830 半導体膜
830a 酸化物半導体層
830b 酸化物半導体層
830c 酸化物半導体層
831 ゲート絶縁膜
832 導電膜
833 導電膜
834 ゲート電極
835 導電膜
841 絶縁膜
843 導電膜
901 筐体
902 筐体
903a 表示部
903b 表示部
904 選択ボタン
905 キーボード
910 電子書籍
911 筐体
912 筐体
913 表示部
914 表示部
915 軸部
916 電源
917 操作キー
918 スピーカー
920 テレビジョン装置
921 筐体
922 表示部
923 スタンド
924 リモコン操作機
930 本体
931 表示部
932 スピーカー
933 マイク
934 操作ボタン
941 本体
942 表示部
943 操作スイッチ
Claims (8)
- データを書き込むための第1のトランジスタと、前記データをゲートに保持し、該ゲートの電位に従って前記データを読み出す第2のトランジスタと、を有するメモリセルと、
前記第2のトランジスタのソース、ドレイン間に流す電流を設定するための第3のトランジスタを有する参照電流生成回路と、を有し、
前記第2のトランジスタは、ドレイン接地されたトランジスタであることを特徴とする半導体装置。 - データを書き込むための第1のトランジスタと、前記データをゲートに保持し、該ゲートの電位に従って前記データを読み出す第2のトランジスタと、を有するメモリセルと、
前記第2のトランジスタのソース、ドレイン間に流す電流を設定するための第3のトランジスタを有する参照電流生成回路と、を有し、
前記第2のトランジスタは、ドレイン接地されたトランジスタであり、
前記参照電流生成回路は、前記第3のトランジスタのゲート、ソース間に印加する電圧を、前記第3のトランジスタの閾値電圧となるように設定し、前記電流を設定することを特徴とする半導体装置。 - データを書き込むための第1のトランジスタと、前記データをゲートに保持し、該ゲートの電位に従って前記データを読み出す第2のトランジスタと、前記第2のトランジスタのゲートに電気的に接続された容量素子と、を有するメモリセルと、
前記第2のトランジスタのソース、ドレイン間に流す電流を設定するための第3のトランジスタを有する参照電流生成回路と、を有し、
前記第2のトランジスタは、ドレイン接地されたトランジスタであり、
前記参照電流生成回路は、前記第3のトランジスタのゲート、ソース間に印加する電圧を、前記第3のトランジスタの閾値電圧となるように設定し、前記電流を設定することを特徴とする半導体装置。 - 請求項1乃至3のいずれか一において、
前記メモリセルは、前記データを読み出すための信号が与えられる第4のトランジスタを有することを特徴とする半導体装置。 - 請求項3において、
前記容量素子は、前記データの読み出しを制御するための信号が与えられることを特徴とする半導体装置。 - 請求項1乃至5のいずれか一において、
前記メモリセルは、マトリクス状に設けられていることを特徴とする半導体装置。 - 請求項1乃至6のいずれか一において、
前記第1のトランジスタの半導体層は、酸化物半導体を有することを特徴とする半導体装置。 - 請求項1乃至請求項7のいずれか一に記載の半導体装置を具備する電子部品を備えた、電子機器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014034764A JP6405097B2 (ja) | 2013-02-28 | 2014-02-26 | 半導体装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013038326 | 2013-02-28 | ||
JP2013038326 | 2013-02-28 | ||
JP2014034764A JP6405097B2 (ja) | 2013-02-28 | 2014-02-26 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014194837A true JP2014194837A (ja) | 2014-10-09 |
JP6405097B2 JP6405097B2 (ja) | 2018-10-17 |
Family
ID=51387973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014034764A Active JP6405097B2 (ja) | 2013-02-28 | 2014-02-26 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9286953B2 (ja) |
JP (1) | JP6405097B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017174425A (ja) * | 2016-03-18 | 2017-09-28 | 株式会社半導体エネルギー研究所 | 半導体装置、及び該半導体装置を利用したシステム |
JP2020004474A (ja) * | 2014-11-21 | 2020-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9349418B2 (en) | 2013-12-27 | 2016-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving the same |
US9887212B2 (en) | 2014-03-14 | 2018-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
JP6689062B2 (ja) | 2014-12-10 | 2020-04-28 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR20170030697A (ko) * | 2015-09-09 | 2017-03-20 | 에스케이하이닉스 주식회사 | 균일한 프로그램 문턱전압값을 갖는 불휘발성 메모리장치 및 그 프로그램 방법 |
JP6963463B2 (ja) | 2016-11-10 | 2021-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品、及び電子機器 |
US10585630B2 (en) * | 2017-09-11 | 2020-03-10 | Samsung Electronics Co., Ltd. | Selectorless 3D stackable memory |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04182991A (ja) * | 1990-11-19 | 1992-06-30 | Hitachi Ltd | 電流源制御方式及び、それを使用したセレクタ回路及び、それを使用したメモリ回路を含む集積回路 |
US6044004A (en) * | 1998-12-22 | 2000-03-28 | Stmicroelectronics, Inc. | Memory integrated circuit for storing digital and analog data and method |
JP2001306031A (ja) * | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 電流制御型発光装置 |
US20050018501A1 (en) * | 2003-06-27 | 2005-01-27 | Dialog Semiconductor Gmbh | Natural analog or multilevel transistor DRAM-cell |
JP2007073121A (ja) * | 2005-09-06 | 2007-03-22 | Sony Corp | 半導体メモリ回路 |
JP2007122758A (ja) * | 2005-10-24 | 2007-05-17 | Sony Corp | 半導体メモリ装置およびその読み出し方法 |
JP2007280570A (ja) * | 2006-04-12 | 2007-10-25 | Sony Corp | 半導体メモリデバイスおよびその動作方法 |
JP2011119675A (ja) * | 2009-10-30 | 2011-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US20120104480A1 (en) * | 2010-10-29 | 2012-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Storage device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7176751B2 (en) * | 2004-11-30 | 2007-02-13 | Intel Corporation | Voltage reference apparatus, method, and system |
KR101761432B1 (ko) | 2009-11-06 | 2017-07-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
CN102612714B (zh) | 2009-11-13 | 2016-06-29 | 株式会社半导体能源研究所 | 半导体器件及其驱动方法 |
KR20190124813A (ko) | 2009-11-20 | 2019-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
KR101943807B1 (ko) * | 2010-01-15 | 2019-01-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP5743790B2 (ja) | 2010-08-06 | 2015-07-01 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8792284B2 (en) | 2010-08-06 | 2014-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor memory device |
TWI555128B (zh) | 2010-08-06 | 2016-10-21 | 半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的驅動方法 |
KR102334169B1 (ko) * | 2010-08-27 | 2021-12-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치, 반도체 장치 |
US8520426B2 (en) | 2010-09-08 | 2013-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving semiconductor device |
US8854865B2 (en) | 2010-11-24 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
US8686415B2 (en) | 2010-12-17 | 2014-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8848464B2 (en) | 2011-04-29 | 2014-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of driving semiconductor device |
TWI595502B (zh) | 2012-05-18 | 2017-08-11 | 半導體能源研究所股份有限公司 | 記憶體裝置和用於驅動記憶體裝置的方法 |
-
2014
- 2014-02-26 US US14/190,244 patent/US9286953B2/en not_active Expired - Fee Related
- 2014-02-26 JP JP2014034764A patent/JP6405097B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04182991A (ja) * | 1990-11-19 | 1992-06-30 | Hitachi Ltd | 電流源制御方式及び、それを使用したセレクタ回路及び、それを使用したメモリ回路を含む集積回路 |
US6044004A (en) * | 1998-12-22 | 2000-03-28 | Stmicroelectronics, Inc. | Memory integrated circuit for storing digital and analog data and method |
JP2001306031A (ja) * | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | 電流制御型発光装置 |
US20050018501A1 (en) * | 2003-06-27 | 2005-01-27 | Dialog Semiconductor Gmbh | Natural analog or multilevel transistor DRAM-cell |
JP2007073121A (ja) * | 2005-09-06 | 2007-03-22 | Sony Corp | 半導体メモリ回路 |
JP2007122758A (ja) * | 2005-10-24 | 2007-05-17 | Sony Corp | 半導体メモリ装置およびその読み出し方法 |
JP2007280570A (ja) * | 2006-04-12 | 2007-10-25 | Sony Corp | 半導体メモリデバイスおよびその動作方法 |
JP2011119675A (ja) * | 2009-10-30 | 2011-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US20120104480A1 (en) * | 2010-10-29 | 2012-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Storage device |
JP2012256824A (ja) * | 2010-10-29 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020004474A (ja) * | 2014-11-21 | 2020-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2017174425A (ja) * | 2016-03-18 | 2017-09-28 | 株式会社半導体エネルギー研究所 | 半導体装置、及び該半導体装置を利用したシステム |
KR20180123098A (ko) * | 2016-03-18 | 2018-11-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
US10664748B2 (en) | 2016-03-18 | 2020-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and system using the same |
US10769520B2 (en) | 2016-03-18 | 2020-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and system using the same |
US11003986B2 (en) | 2016-03-18 | 2021-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and system using the same |
KR20210096327A (ko) * | 2016-03-18 | 2021-08-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
KR102285800B1 (ko) | 2016-03-18 | 2021-08-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
KR102382727B1 (ko) | 2016-03-18 | 2022-04-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
KR20220045243A (ko) * | 2016-03-18 | 2022-04-12 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
KR102505695B1 (ko) * | 2016-03-18 | 2023-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 시스템 |
US11636883B2 (en) | 2016-03-18 | 2023-04-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and system using the same |
Also Published As
Publication number | Publication date |
---|---|
US9286953B2 (en) | 2016-03-15 |
JP6405097B2 (ja) | 2018-10-17 |
US20140241054A1 (en) | 2014-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6397638B2 (ja) | 半導体装置の駆動方法 | |
JP6405097B2 (ja) | 半導体装置 | |
JP6533397B2 (ja) | 半導体装置 | |
JP6010681B2 (ja) | プログラマブルロジックデバイス | |
TWI619117B (zh) | 驅動半導體裝置的方法及半導體裝置 | |
JP6736296B2 (ja) | 半導体装置及び電子機器 | |
JP6864132B2 (ja) | 半導体装置 | |
JP6560508B2 (ja) | 半導体装置 | |
JP6516978B2 (ja) | 半導体装置 | |
JP6431436B2 (ja) | 半導体装置 | |
JP6563313B2 (ja) | 半導体装置、及び電子機器 | |
JP6457239B2 (ja) | 半導体装置 | |
JP6329843B2 (ja) | 半導体装置 | |
JP2016116220A (ja) | 半導体装置、及び電子機器 | |
JP2016149174A (ja) | 半導体装置、及び電子機器 | |
JP6392603B2 (ja) | 半導体装置 | |
JP6667267B2 (ja) | 半導体装置 | |
JP2015118724A (ja) | 半導体装置及び半導体装置の駆動方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170221 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171031 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171114 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180320 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180509 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180828 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180914 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6405097 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |