JP2014192369A5 - - Google Patents

Download PDF

Info

Publication number
JP2014192369A5
JP2014192369A5 JP2013067014A JP2013067014A JP2014192369A5 JP 2014192369 A5 JP2014192369 A5 JP 2014192369A5 JP 2013067014 A JP2013067014 A JP 2013067014A JP 2013067014 A JP2013067014 A JP 2013067014A JP 2014192369 A5 JP2014192369 A5 JP 2014192369A5
Authority
JP
Japan
Prior art keywords
chamber
film
mesa structure
amorphous
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013067014A
Other languages
English (en)
Japanese (ja)
Other versions
JP6123414B2 (ja
JP2014192369A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013067014A priority Critical patent/JP6123414B2/ja
Priority claimed from JP2013067014A external-priority patent/JP6123414B2/ja
Publication of JP2014192369A publication Critical patent/JP2014192369A/ja
Publication of JP2014192369A5 publication Critical patent/JP2014192369A5/ja
Application granted granted Critical
Publication of JP6123414B2 publication Critical patent/JP6123414B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013067014A 2013-03-27 2013-03-27 半導体素子の製造方法、半導体素子の製造装置 Active JP6123414B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013067014A JP6123414B2 (ja) 2013-03-27 2013-03-27 半導体素子の製造方法、半導体素子の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013067014A JP6123414B2 (ja) 2013-03-27 2013-03-27 半導体素子の製造方法、半導体素子の製造装置

Publications (3)

Publication Number Publication Date
JP2014192369A JP2014192369A (ja) 2014-10-06
JP2014192369A5 true JP2014192369A5 (enExample) 2016-02-18
JP6123414B2 JP6123414B2 (ja) 2017-05-10

Family

ID=51838354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013067014A Active JP6123414B2 (ja) 2013-03-27 2013-03-27 半導体素子の製造方法、半導体素子の製造装置

Country Status (1)

Country Link
JP (1) JP6123414B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7080414B1 (ja) * 2021-06-17 2022-06-03 三菱電機株式会社 光半導体素子及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06291032A (ja) * 1993-04-06 1994-10-18 Matsushita Electric Ind Co Ltd 化合物半導体成長用基板
JP3330218B2 (ja) * 1994-03-25 2002-09-30 三菱電機株式会社 半導体装置の製造方法,及び半導体装置
JP2858095B2 (ja) * 1995-03-22 1999-02-17 光技術研究開発株式会社 化合物半導体の微細埋込構造の形成方法
JPH09205254A (ja) * 1996-01-26 1997-08-05 Mitsubishi Electric Corp 半導体装置の製造方法および半導体製造装置並びに半導体レーザの製造方法
JPH09260289A (ja) * 1996-03-19 1997-10-03 Nippon Steel Corp 化合物半導体単結晶の成長方法
JP4864014B2 (ja) * 2001-03-27 2012-01-25 株式会社リコー 面発光型半導体レーザ素子の製造方法

Similar Documents

Publication Publication Date Title
JP2011142310A5 (ja) 半導体装置の作製方法
JP2013153160A5 (ja) 半導体装置の作製方法
JP2011029627A5 (enExample)
JP2012084860A5 (enExample)
JP2008311621A5 (enExample)
JP2009003434A5 (enExample)
JP2015133481A5 (ja) 剥離方法
JP2012009837A5 (ja) 半導体装置の作製方法
JP2011192974A5 (ja) 半導体装置の作製方法
JP2009004736A5 (enExample)
JP2012049516A5 (enExample)
JP2013219336A5 (enExample)
WO2015027080A3 (en) Selective deposition of diamond in thermal vias
JP2012009838A5 (ja) 半導体装置の作製方法
JP2011258943A5 (ja) トランジスタの作製方法
JP2011035389A5 (enExample)
JP2012216796A5 (enExample)
JP2011029637A5 (enExample)
JP2011085923A5 (ja) 発光装置の作製方法
JP2010034511A5 (ja) 半導体装置の製造方法、基板処理方法、基板処理装置および半導体装置
JP2011258939A5 (enExample)
JP2009111363A5 (enExample)
JP2011176095A5 (enExample)
JP2009135472A5 (enExample)
JP2016046530A5 (ja) 半導体装置の作製方法