JP2014179504A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2014179504A JP2014179504A JP2013053239A JP2013053239A JP2014179504A JP 2014179504 A JP2014179504 A JP 2014179504A JP 2013053239 A JP2013053239 A JP 2013053239A JP 2013053239 A JP2013053239 A JP 2013053239A JP 2014179504 A JP2014179504 A JP 2014179504A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
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- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
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- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
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- 239000012190 activator Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 YAG: Ce Chemical compound 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】基体11と、基体に保持されている発光素子21と、基体に保持され発光素子の上方に配されて発光素子からの出射光を集光するレンズ15と、基体上に配されている第1の筒部材23と、第1の筒部材と嵌合している第2の筒部材25と、第2の筒部材内に挿入されることで第2の筒部材と嵌合しており、レンズにより集光された光が通過する貫通孔33を有している保持体27と、保持体上に貫通孔を塞ぐように形成されている透光性部材41と、を含む。
【選択図】図1B
Description
13 ステム
15 レンズ
17 ステム底部
19 ステム柱体
21 発光素子
23 第1の筒部材
25 第2の筒部材
25a 放熱突起
27 保持体
27a フランジ
29 凹部
31 入射孔
33 貫通孔
35 導光孔
41 透光性部材
43 反射部材
Claims (3)
- 基体と、
前記基体に保持されている発光素子と、
前記基体に保持され前記発光素子の上方に配されて前記発光素子からの出射光を集光するレンズと、
前記基体上に配されている第1の筒部材と、
前記第1の筒部材と嵌合している第2の筒部材と、
前記第2の筒部材内に挿入されることで前記第2の筒部材と嵌合しており、前記レンズにより集光された光が通過する貫通孔を有している保持体と、
前記保持体上に前記貫通孔を塞ぐように形成されている透光性部材と、
を含むことを特徴とする発光装置。 - 前記貫通孔は、前記発光素子側の一方の面よりも前記一方の面と反対側の他方の面の方が小さい錐台形状を有していることを特徴とする請求項1に記載の発光装置。
- 前記第2の筒部材は、その外側面に放熱部を有し、前記保持体の外側面が、前記第2の筒部材の前記放熱部が形成されている領域の内側面と接触していることを特徴とする請求項1または2に記載の発光装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013053239A JP6103998B2 (ja) | 2013-03-15 | 2013-03-15 | 発光装置 |
KR1020140030204A KR102154644B1 (ko) | 2013-03-15 | 2014-03-14 | 발광장치 |
US14/213,157 US9461433B2 (en) | 2013-03-15 | 2014-03-14 | Light-emitting device |
EP14020031.2A EP2779331B1 (en) | 2013-03-15 | 2014-03-17 | Light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013053239A JP6103998B2 (ja) | 2013-03-15 | 2013-03-15 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014179504A true JP2014179504A (ja) | 2014-09-25 |
JP6103998B2 JP6103998B2 (ja) | 2017-03-29 |
Family
ID=50442320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013053239A Active JP6103998B2 (ja) | 2013-03-15 | 2013-03-15 | 発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9461433B2 (ja) |
EP (1) | EP2779331B1 (ja) |
JP (1) | JP6103998B2 (ja) |
KR (1) | KR102154644B1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016092364A (ja) * | 2014-11-11 | 2016-05-23 | スタンレー電気株式会社 | 発光装置及び灯具 |
JP2016122692A (ja) * | 2014-12-24 | 2016-07-07 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP2016219723A (ja) * | 2015-05-26 | 2016-12-22 | スタンレー電気株式会社 | 光源装置及びこれを用いた照明装置 |
JP2018037484A (ja) * | 2016-08-30 | 2018-03-08 | 日亜化学工業株式会社 | 発光装置 |
JP2018056160A (ja) * | 2016-09-26 | 2018-04-05 | 日亜化学工業株式会社 | 発光装置 |
JP2021048354A (ja) * | 2019-09-20 | 2021-03-25 | 日亜化学工業株式会社 | 発光装置 |
CN112864794A (zh) * | 2021-01-21 | 2021-05-28 | 常州纵慧芯光半导体科技有限公司 | 一种激光设备及其控制方法 |
JP7436891B2 (ja) | 2020-10-09 | 2024-02-22 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6331353B2 (ja) | 2013-07-03 | 2018-05-30 | 日亜化学工業株式会社 | 発光装置 |
KR101785879B1 (ko) * | 2014-07-23 | 2017-10-16 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들 |
JP6303931B2 (ja) * | 2014-08-29 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置 |
WO2017023211A1 (en) | 2015-08-06 | 2017-02-09 | Heptagon Micro Optics Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
JP6493308B2 (ja) * | 2016-05-31 | 2019-04-03 | 日亜化学工業株式会社 | 発光装置 |
KR102535603B1 (ko) * | 2017-08-04 | 2023-05-23 | 한국전자통신연구원 | 광 모듈 플랫폼 구조 및 제조방법 |
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JP6702349B2 (ja) * | 2018-03-27 | 2020-06-03 | 日亜化学工業株式会社 | 発光装置 |
KR102025192B1 (ko) * | 2018-04-06 | 2019-09-25 | (주)제이스텍 | 하나의 조명에 의한 디스플레이 패널 및 cof 동시 촬상장치 |
US11205886B2 (en) * | 2019-03-12 | 2021-12-21 | Nichia Corporation | Method of manufacturing optical member, optical member, and light emitting device |
KR102394436B1 (ko) * | 2019-11-04 | 2022-05-03 | 한국전기연구원 | 광원 파장 변조 장치 |
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JP2016092364A (ja) * | 2014-11-11 | 2016-05-23 | スタンレー電気株式会社 | 発光装置及び灯具 |
JP2016122692A (ja) * | 2014-12-24 | 2016-07-07 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP2016219723A (ja) * | 2015-05-26 | 2016-12-22 | スタンレー電気株式会社 | 光源装置及びこれを用いた照明装置 |
JP2018037484A (ja) * | 2016-08-30 | 2018-03-08 | 日亜化学工業株式会社 | 発光装置 |
JP2018056160A (ja) * | 2016-09-26 | 2018-04-05 | 日亜化学工業株式会社 | 発光装置 |
JP2021048354A (ja) * | 2019-09-20 | 2021-03-25 | 日亜化学工業株式会社 | 発光装置 |
US11721950B2 (en) | 2019-09-20 | 2023-08-08 | Nichia Corporation | Light emission device |
JP7568390B2 (ja) | 2019-09-20 | 2024-10-16 | 日亜化学工業株式会社 | 発光装置 |
JP7436891B2 (ja) | 2020-10-09 | 2024-02-22 | 日亜化学工業株式会社 | 発光装置 |
CN112864794A (zh) * | 2021-01-21 | 2021-05-28 | 常州纵慧芯光半导体科技有限公司 | 一种激光设备及其控制方法 |
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EP2779331A1 (en) | 2014-09-17 |
US20140268787A1 (en) | 2014-09-18 |
KR20140113516A (ko) | 2014-09-24 |
JP6103998B2 (ja) | 2017-03-29 |
US9461433B2 (en) | 2016-10-04 |
EP2779331B1 (en) | 2016-11-30 |
KR102154644B1 (ko) | 2020-09-10 |
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