JP2014175659A5 - - Google Patents

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JP2014175659A5
JP2014175659A5 JP2014042486A JP2014042486A JP2014175659A5 JP 2014175659 A5 JP2014175659 A5 JP 2014175659A5 JP 2014042486 A JP2014042486 A JP 2014042486A JP 2014042486 A JP2014042486 A JP 2014042486A JP 2014175659 A5 JP2014175659 A5 JP 2014175659A5
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substrate
metal
reducing gas
seed layer
exposing
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JP2014042486A
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JP6388773B2 (ja
JP2014175659A (ja
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Priority claimed from US13/787,499 external-priority patent/US9070750B2/en
Priority claimed from US14/020,339 external-priority patent/US20150072538A1/en
Priority claimed from US14/086,770 external-priority patent/US9865501B2/en
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Publication of JP2014175659A publication Critical patent/JP2014175659A/ja
Publication of JP2014175659A5 publication Critical patent/JP2014175659A5/ja
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JP2014042486A 2013-03-06 2014-03-05 めっき用の金属シード層を有する基板を準備してメッキする方法 Active JP6388773B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US13/787,499 2013-03-06
US13/787,499 US9070750B2 (en) 2013-03-06 2013-03-06 Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment
US14/020,339 US20150072538A1 (en) 2013-09-06 2013-09-06 Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US14/020,339 2013-09-06
US14/086,770 2013-11-21
US14/086,770 US9865501B2 (en) 2013-03-06 2013-11-21 Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer

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JP2018152800A Division JP6681953B2 (ja) 2013-03-06 2018-08-15 金属シード層上の金属酸化物を還元するための方法および装置

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JP2014175659A JP2014175659A (ja) 2014-09-22
JP2014175659A5 true JP2014175659A5 (enExample) 2017-06-01
JP6388773B2 JP6388773B2 (ja) 2018-09-12

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JP2018152800A Active JP6681953B2 (ja) 2013-03-06 2018-08-15 金属シード層上の金属酸化物を還元するための方法および装置

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US (2) US9865501B2 (enExample)
JP (2) JP6388773B2 (enExample)
KR (3) KR102249529B1 (enExample)
CN (2) CN110085501B (enExample)
TW (1) TWI612170B (enExample)

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