JP2014130959A - 発光装置及びその製造方法 - Google Patents
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Abstract
【解決手段】基板2上の配線パターン4に複数の発光素子6e、6b、6f、6dが実装された発光装置であって、不良素子6cに代わる新たな発光素子6fが不良素子6cと同じ配線パターン4に実装され、不良素子6cまたは不良素子の取り外し後に残る跡10が新たな発光素子6e、6fと同じ封止部材8a、8cによって封止される発光装置である。
【選択図】図1
Description
図1は、本発明の実施形態に係る発光装置の概略構成を示す図であり、図1(a)は平面図、図1(b)は図1(a)中のA−A断面を示す図、図1(c)は図1(a)中のB−B断面を示す図である。
基板2には、各種の部材を適宜用いることができる。例えば、紙にフェノールやエポキシなどの樹脂を含浸させたものや、帯状の樹脂や金属を基体とする部材などを、基板2の一例として挙げることができる。
配線パターン4には、例えば、銅やアルミ・ニッケル・鉄・金・銀などの金属やそれらの合金、またはこれらの金属を含むメッキ・導電性ペースト・導電インク、あるいは錫・銀・銅・金・ビスマス・亜鉛・鉛などから形成される半田などを用いることができる。
発光素子6a〜6fには、例えば、表面実装型LED、LEDチップ、チップサイズパッケージLEDなどの様々な発光ダイオードを用いることができるが、特にLEDチップを用いれば、低コスト化を図ることができる。
封止部材8a、8b、8c、8dには、例えば、エポキシやシリコーン及びこれらの変性タイプに代表される透明樹脂を用いることができる。
ダイボンド痕、ワイヤボンド痕、ダイボンド材残り、及び/又はワイヤ残りなどは、不良素子6aの取り外し後に残る跡10の一例である。
反射部材12には、例えば、白色フィラーや白色粉末などを含有している白色の部材を用いることができる。このような白色の部材の一例としては、絶縁性で光反射率が高く耐熱や耐光性が高い樹脂を挙げることができ、より具体的には、例えば酸化チタンや酸化珪素、硫酸バリウム、酸化アルミニウム等を含有するシリコーン樹脂やこれらの変性タイプ、レジストなどを一例として挙げることができる。また、先述した波長変換部材を含有していても良い。
図2A〜Eは、本発明の実施形態に係る発光装置の製造方法の概略工程を示す図である。各図において、(a)は平面図、(b)は(a)中のA−A断面を示す図、(c)は(a)中のB−B断面を示す図である。
まず、図2Aに示すように、配線パターン4が設けられた基板2を準備する。
次に、図2Bに示すように、印刷などの方法によって、基板2に反射部材12を設ける。なお、図2Bに示すように、反射部材12は、配線パターン4が露出する開口2を有している。この開口2の面積は、特に限定されるものではないが、不良素子に代わる新たな発光素子を容易に実装できるよう、2つ程度の発光素子を実装できる大きさであることが好ましい。
次に、図2Cに示すように、複数の発光素子6a、6b、6c、6dを基板2上に設けられた配線パターン4に実装する。ここで、各発光素子は、例えば金バンプを用いて、フリップチップ方式により、配線パターン4に超音波実装される。
次に、複数の発光素子6a、6b、6c、6dの良・不良を判定する。
次に、図2Dに示すように、複数の発光素子6a、6b、6c、6d中の不良素子6a、6cと同じ配線パターン4に不良素子6a、6cに代わる新たな発光素子6e、6fを実装する。
次に、図2Eに示すように、発光素子6e、6b、6f、6dを封止部材8a、8b、8c、8dによってそれぞれ封止する。ここで、不良素子6aの取り外し後に残る跡10と不良素子6cとは、新たな発光素子6e、6fと同じ封止部材8a、8cによって封止する。また、本発明の実施形態では、不良素子6aの取り外し後に残る跡10を被覆する反射部材12や、不良素子6cを被覆する反射部材12も、新たな発光素子6e、6fと同じ封止部材8a、8cによって封止する。
2 基板
4 配線パターン
6a 発光素子
6b 発光素子
6c 発光素子
6d 発光素子
6e 発光素子
6f 発光素子
8a 封止部材
8b 封止部材
8c 封止部材
8d 封止部材
10 跡
12 反射部材
Claims (12)
- 基板上の配線パターンに複数の発光素子が実装された発光装置であって、
不良素子に代わる新たな発光素子が前記不良素子と同じ配線パターンに実装され、
前記不良素子または前記不良素子の取り外し後に残る跡が前記新たな発光素子と同じ封止部材によって封止される、
ことを特徴とする発光装置。 - 前記不良素子の取り外し後に残る跡は、ダイボンド痕及び/又はダイボンド材残りであることを特徴とする請求項1に記載の発光装置。
- 前記不良素子または前記不良素子の取り外し後に残る跡の少なくとも一部が反射部材によって被覆されることを特徴とする請求項1または請求項2に記載の発光装置。
- 前記反射部材は、前記新たな発光素子の下方に充填されたアンダーフィルの一部であることを特徴とする請求項3に記載の発光装置。
- 前記反射部材は、白色の部材であることを特徴とする請求項3または請求項4に記載の発光装置。
- 前記複数の発光素子は、前記配線パターンに対しフリップチップ方式で超音波実装されることを特徴とする請求項1から請求項5のいずれか1項に記載の発光装置。
- 基板上の配線パターンに複数の発光素子を実装する工程と、
不良素子に代わる新たな発光素子を前記不良素子と同じ配線パターンに実装する工程と、
前記不良素子または前記不良素子の取り外し後に残る跡を前記新たな発光素子と同じ封止部材によって封止する工程と、
を有することを特徴とする発光装置の製造方法。 - 前記不良素子の取り外し後に残る跡は、ダイボンド痕及び/又はダイボンド材残りであることを特徴とする請求項7に記載の発光装置の製造方法。
- 前記不良素子または前記不良素子の取り外し後に残る跡の少なくとも一部が反射部材によって被覆されることを特徴とする請求項7または請求項8に記載の発光装置の製造方法。
- 前記反射部材は、前記新たな発光素子の下方に充填するアンダーフィルの一部であることを特徴とする請求項9に記載の発光装置の製造方法。
- 前記反射部材は、白色の部材であることを特徴とする請求項9または請求項10に記載の発光装置の製造方法。
- 前記複数の発光素子を前記配線パターンに対しフリップチップ方式で超音波実装することを特徴とする請求項7から請求項11のいずれか1項に記載の発光装置の製造方法。
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