JP2014111301A5 - - Google Patents
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- Publication number
- JP2014111301A5 JP2014111301A5 JP2013216656A JP2013216656A JP2014111301A5 JP 2014111301 A5 JP2014111301 A5 JP 2014111301A5 JP 2013216656 A JP2013216656 A JP 2013216656A JP 2013216656 A JP2013216656 A JP 2013216656A JP 2014111301 A5 JP2014111301 A5 JP 2014111301A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- cover
- plate
- side plate
- atomizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 62
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 14
- 239000007921 spray Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013216656A JP6031426B2 (ja) | 2012-11-02 | 2013-10-17 | 研磨装置及び研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012242951 | 2012-11-02 | ||
| JP2012242951 | 2012-11-02 | ||
| JP2013216656A JP6031426B2 (ja) | 2012-11-02 | 2013-10-17 | 研磨装置及び研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014111301A JP2014111301A (ja) | 2014-06-19 |
| JP2014111301A5 true JP2014111301A5 (enrdf_load_stackoverflow) | 2016-07-28 |
| JP6031426B2 JP6031426B2 (ja) | 2016-11-24 |
Family
ID=51168848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013216656A Expired - Fee Related JP6031426B2 (ja) | 2012-11-02 | 2013-10-17 | 研磨装置及び研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6031426B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016043471A (ja) * | 2014-08-26 | 2016-04-04 | 株式会社荏原製作所 | 基板処理装置 |
| SG10201906815XA (en) | 2014-08-26 | 2019-08-27 | Ebara Corp | Substrate processing apparatus |
| JP6313196B2 (ja) | 2014-11-20 | 2018-04-18 | 株式会社荏原製作所 | 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法 |
| JP6353774B2 (ja) * | 2014-12-03 | 2018-07-04 | 株式会社東京精密 | ウェハ研削装置 |
| JP6758066B2 (ja) * | 2016-03-31 | 2020-09-23 | 株式会社荏原製作所 | 研磨装置 |
| JP2017177303A (ja) * | 2016-03-31 | 2017-10-05 | 株式会社荏原製作所 | 基板研磨装置、その洗浄方法および基板研磨装置への液体供給装置 |
| US11484987B2 (en) * | 2020-03-09 | 2022-11-01 | Applied Materials, Inc. | Maintenance methods for polishing systems and articles related thereto |
| JP2022014055A (ja) * | 2020-07-06 | 2022-01-19 | 株式会社荏原製作所 | 液体供給装置および研磨装置 |
| CN111790669A (zh) * | 2020-07-14 | 2020-10-20 | 东阳市俊华电器销售有限公司 | 一种五金配件打磨清洗喷涂一体机 |
| EP4297930A4 (en) * | 2021-02-26 | 2024-12-11 | Axus Technology, LLC | Containment and exhaust system for substrate polishing components |
| CN119816397A (zh) * | 2022-09-16 | 2025-04-11 | 东京毅力科创株式会社 | 基板处理装置和基板处理方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5893753A (en) * | 1997-06-05 | 1999-04-13 | Texas Instruments Incorporated | Vibrating polishing pad conditioning system and method |
| US6139406A (en) * | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
| US6283840B1 (en) * | 1999-08-03 | 2001-09-04 | Applied Materials, Inc. | Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus |
| US6284092B1 (en) * | 1999-08-06 | 2001-09-04 | International Business Machines Corporation | CMP slurry atomization slurry dispense system |
| JP5744382B2 (ja) * | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
-
2013
- 2013-10-17 JP JP2013216656A patent/JP6031426B2/ja not_active Expired - Fee Related
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