JP6031426B2 - 研磨装置及び研磨方法 - Google Patents

研磨装置及び研磨方法 Download PDF

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Publication number
JP6031426B2
JP6031426B2 JP2013216656A JP2013216656A JP6031426B2 JP 6031426 B2 JP6031426 B2 JP 6031426B2 JP 2013216656 A JP2013216656 A JP 2013216656A JP 2013216656 A JP2013216656 A JP 2013216656A JP 6031426 B2 JP6031426 B2 JP 6031426B2
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polishing
cover
atomizer
top ring
liquid
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Expired - Fee Related
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JP2013216656A
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Japanese (ja)
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JP2014111301A (ja
JP2014111301A5 (enrdf_load_stackoverflow
Inventor
正雄 梅本
正雄 梅本
曽根　忠一
忠一 曽根
相澤　英夫
英夫 相澤
隆一 小菅
隆一 小菅
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Ebara Corp
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Ebara Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013216656A 2012-11-02 2013-10-17 研磨装置及び研磨方法 Expired - Fee Related JP6031426B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013216656A JP6031426B2 (ja) 2012-11-02 2013-10-17 研磨装置及び研磨方法

Applications Claiming Priority (3)

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JP2012242951 2012-11-02
JP2012242951 2012-11-02
JP2013216656A JP6031426B2 (ja) 2012-11-02 2013-10-17 研磨装置及び研磨方法

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JP2014111301A JP2014111301A (ja) 2014-06-19
JP2014111301A5 JP2014111301A5 (enrdf_load_stackoverflow) 2016-07-28
JP6031426B2 true JP6031426B2 (ja) 2016-11-24

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016043471A (ja) * 2014-08-26 2016-04-04 株式会社荏原製作所 基板処理装置
SG10201906815XA (en) 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
JP6313196B2 (ja) 2014-11-20 2018-04-18 株式会社荏原製作所 研磨面洗浄装置、研磨装置、および研磨面洗浄装置の製造方法
JP6353774B2 (ja) * 2014-12-03 2018-07-04 株式会社東京精密 ウェハ研削装置
JP6758066B2 (ja) * 2016-03-31 2020-09-23 株式会社荏原製作所 研磨装置
JP2017177303A (ja) * 2016-03-31 2017-10-05 株式会社荏原製作所 基板研磨装置、その洗浄方法および基板研磨装置への液体供給装置
US11484987B2 (en) * 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto
JP2022014055A (ja) * 2020-07-06 2022-01-19 株式会社荏原製作所 液体供給装置および研磨装置
CN111790669A (zh) * 2020-07-14 2020-10-20 东阳市俊华电器销售有限公司 一种五金配件打磨清洗喷涂一体机
EP4297930A4 (en) * 2021-02-26 2024-12-11 Axus Technology, LLC Containment and exhaust system for substrate polishing components
CN119816397A (zh) * 2022-09-16 2025-04-11 东京毅力科创株式会社 基板处理装置和基板处理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893753A (en) * 1997-06-05 1999-04-13 Texas Instruments Incorporated Vibrating polishing pad conditioning system and method
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US6283840B1 (en) * 1999-08-03 2001-09-04 Applied Materials, Inc. Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
US6284092B1 (en) * 1999-08-06 2001-09-04 International Business Machines Corporation CMP slurry atomization slurry dispense system
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法

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