JP2014104526A - Polishing apparatus and polishing method for polishing peripheral edge part of workpiece, e.g. plate glass with polishing tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing apparatus and a polishing method for polishing a peripheral edge part of a workpiece, e.g. a plate glass, with high precision.SOLUTION: A polishing apparatus includes a first polishing portion having a first horizontal polishing axis line for polishing a linear to-be-polished part of a peripheral edge part of a workpiece and a second polishing portion having a second horizontal polishing axis line for polishing a nonlinear to-be-polished part of the peripheral edge part of the workpiece. The first and second polishing portions each include a workpiece unit holding the workpiece and a polishing tape unit arranging at least a part of the surface of a polishing tape so as to face the work unit with the polishing axis line between the work unit and the polishing tape unit. The arranged surfaces of the polishing tape each constitute a polishing surface. In polishing, the linear to-be-polished part and a first polishing surface come in mutual contact and move relatively on the first polishing axis line, and the nonlinear to-be-polished part and a second polishing surface come into mutual contact and move relatively on the second polishing line.

Description

  The present invention relates to an apparatus for polishing a work such as a flat display such as a mobile phone display window, a liquid crystal panel, an organic EL panel, a plasma panel, a solar cell panel, a cover glass for electronic parts, a plate glass used for an optical filter, and the like. The present invention relates to a polishing method. In particular, the present invention relates to a polishing apparatus and a polishing method for polishing a peripheral portion of a workpiece such as plate glass with high accuracy using a polishing tape.

  In recent years, the market for smartphones, tablet terminals and the like is expanding. Many of these electronic devices have an exposed display and are easily damaged when dropped or impacted. The size of the display is, for example, around 5 inches for smartphones, around 6 inches to 10 inches for tablet terminals, and around 3 inches for feature phones (the aspect ratio is usually 4: 3 horizontal: vertical ratio, wide Case 16: 9). There is an increasing demand for cover members for protecting such displays for electronic devices.

  In recent years, cover glass has been adopted as a cover material for displays (main display, sub-display, camera display, etc.) instead of conventional scratch-resistant acrylic or polycarbonate with a hard coat on one side (or both sides). It is increasing, and improving the strength of this cover glass has become a problem.

Glass is in theory a high-strength material (1000~2000kg / ^mm 2), the actual intensity is low (3~20kg / ^mm 2). This is because there are invisible fine scratches, cracks, chipping, etc. (latent scratches) on the glass surface, etc., and stress concentration often occurs when tensile stress is applied to the glass, often causing damage. It is.

  Various physical methods (surface quenching method, etc.) and chemical methods (chemical etching treatment, ion exchange method, etc.) have been devised to improve the strength of glass, but these strengthening methods are adopted. Even in this case, it is important to remove fine scratches on the glass that cause breakage.

  Generally, a cover glass is manufactured by cutting a glass base plate, which is a material, into a predetermined size and subjecting it to various processes. Fine scratches, cracks, and the like are formed on the end surface, which is a cut surface of the glass base plate. In order to remove such fine flaws formed on the end face, chamfering (thread chamfering) for removing ridges and corners is performed.

  In chamfering, a so-called C chamfering that polishes a side portion (boundary portion between an end surface and an upper surface or a lower surface) of a plate glass having a predetermined shape (rectangular shape), or a corner portion (boundary portion between one end surface and an adjacent end surface). So-called R chamfering or the like for polishing is performed.

  Conventionally, a polishing material such as a grindstone is used for C chamfering and R chamfering, and in particular, R chamfering requires an abrasive material having a corresponding shape depending on the R shape (for example, R1, R10, etc.). It was difficult to form with high accuracy. In addition, it has been difficult to maintain and improve the quality of the surface to be polished formed by creating a polishing program or polishing.

  Conventionally, C chamfering has been performed in which only the ridge portion is removed by tilting the disk surface of a substantially disc-shaped grinding wheel and pressing it against the ridge portion of the plate glass (Japanese Patent Laid-Open No. 2000-233351: Patent Document 1). Further, a chamfering process has been performed in which an inclined surface is provided on the end surface of the grinding wheel, and the inclined surface is pressed against the ridge portion of the plate glass to remove only the ridge portion (Japanese Patent Laid-Open No. 2003-231046: Patent Document 2, JP, 2011-51068, A: patent documents 3).

  Furthermore, an R chamfering process or a total shape process was performed in which an arc-shaped recess or a recess having a desired shape was formed on the end face of the grinding wheel, and the end face of the plate glass was removed following the end face shape of the grinding wheel ( JP 2002-59346 A: Patent Document 4; JP 2001-85710 A: Patent Document 5).

  In the conventional chamfering process as described above, a metal bond diamond wheel or the like in which metal powder is hardened and sintered and diamond abrasive grains are fixed is used as a grinding wheel, and wheels (grinding stones) having different abrasive grain sizes are used. In use, primary and secondary processing were performed. For the primary processing, a wheel using diamond particles of # 325 to # 600 in mesh size is used, and the average surface roughness Ra of the processed glass sheet edge is generally in the range of 0.5 μm to 1.0 μm. there were. In order to reduce the surface roughness, the secondary processing includes a finishing wheel using diamond particles of # 1000 to # 2000 with a mesh size formed in the same cross-sectional shape as the primary processing wheel. Used.

  Further, instead of the metal bond diamond wheel as described above, a chamfering wheel of a fiber structure in which a fiber space is filled with a resin, or abrasive grains such as silicon carbide and alumina of # 500 to # 2000 in mesh size are used. There has been proposed a chamfering wheel for a resin structure (Japanese Patent Laid-Open No. 2002-160147: Patent Document 6). While rotating the chamfering wheel (grinding stone), the peripheral portion of the wheel formed in a concave cross section was pressed against an end surface of a plate glass for liquid crystal display, and the like, and the processing was performed. In order to eliminate unevenness in processing and perform uniform polishing, the chamfering wheel was used with a rotation axis inclined at a predetermined angle with respect to a vertical line that is erected on the surface of the plate glass.

JP 2000-233351 A JP 2003-231046 A JP 2011-51068 A JP 2002-59346 A JP 2001-85710 A JP 2002-160147 A

  When chamfering is performed while pressing the grindstone (wheel) as described above against the edge of the plate glass and rotating, there is a problem that clogging of the grindstone and wear of the grindstone gradually progress. If the shape or the like of the processed part of the grindstone deteriorates due to clogging or wear, grinding flaws will occur at the peripheral edge of the plate glass, and the grindstone does not contact a part of the peripheral edge of the flat glass. ) And burning due to non-uniform processing pressure.

  Dressing and truing are performed when the shape of the processed part of the grindstone deteriorates, but high precision is indispensable for diamond wheels, and it takes time to adjust the position of the dressing and grindstone. Decreased. In addition, there is a problem that the cost increases because it is necessary to perform dressing or the like of the processed portion while leaving many unused areas of the grindstone, or to replace the grindstone as a lifetime.

  In addition, if a grindstone is used to chamfer the peripheral edge of a plate glass, a mechanical impact is applied when the grindstone is brought into contact with the workpiece, and the plate glass is damaged by the impact, resulting in a poor processing yield. .

  In a chamfered wheel (Patent Document 6) such as a resin structure having low rigidity compared to a metal bond diamond wheel, the impact on the edge of the plate glass is reduced, and the occurrence of chipping and scratches is reduced. However, since the wear of the grindstone is intense, the shape of the processed part changes rapidly and clogging occurs, which causes a problem that the frequency of dressing (or truing) of the grindstone is high. In addition, there is a problem in that it takes time to maintain the apparatus because the debris from the grindstone adheres to a workpiece such as a plate glass and a cleaning apparatus and a cleaning process are required, or the apparatus itself becomes dirty.

  Furthermore, display cover glass (sheet glass) for which the demand has been increasing in recent years is thin (for example, 1 mm or less), and it is required that the peripheral edge (ridge or corner) be chamfered with higher accuracy. It became so. When chamfering the peripheral edge of a plate glass using a conventional grinding wheel, the accuracy of the resulting processed surface is insufficient, leaving fine scratches or chipping on the peripheral edge, and improving the strength of the plate glass by polishing. I could not.

  In view of the above problems, the present invention provides a polishing apparatus capable of polishing a peripheral portion (side portion, corner portion, etc.) of a workpiece such as a plate glass using a polishing tape and processing it with high accuracy. For the purpose. Moreover, the polishing apparatus which can grind the peripheral part of the workpiece | work which has various shapes using a polishing apparatus and a polishing tape is provided.

  Moreover, it aims at providing the grinding | polishing method which grind | polishes the peripheral part of plate glass with high precision so that the intensity | strength of plate glass may be improved. It aims at providing the plate glass which was grind | polished by this method and improved the intensity | strength.

  A polishing apparatus for polishing a peripheral portion of a workpiece using an abrasive tape according to one aspect of the present invention that solves the above-described problem is a horizontal first polishing device that polishes a linear portion to be polished at the peripheral portion of the workpiece. A first polishing portion having one polishing axis, and a second polishing portion having a horizontal second polishing axis for polishing a non-linear portion to be polished at the peripheral edge of the workpiece, The polishing unit disposes at least a part of the surface of the first polishing tape facing the first work unit across the first work unit for holding the work and the first polishing axis. A second polishing unit facing the second work unit across the second polishing unit and the second work unit for holding the work. And disposing at least a part of the surface of the second polishing tape A second polishing tape unit, wherein the surface of the first polishing tape disposed in the first polishing section defines a first polishing surface, and the linear portion to be polished and the first polishing tape Polishing is performed by moving relative to the first polishing axis in contact with the polishing surface, and in the second polishing portion, the surface of the second polishing tape disposed defines the second polishing surface; Polishing is performed by the non-linear portion to be polished and the second polishing surface being in contact with each other and relatively moving in the second polishing axis.

  By comprising in this way, using a polishing tape, the linear to-be-polished part of the peripheral part of a workpiece | work, for example, the side part (ridge part) of a rectangular plate glass, and the non-linear part of the peripheral part of a workpiece | work A portion to be polished, for example, a corner portion of a rectangular plate glass can be polished by a polishing apparatus. Moreover, by configuring as described above, for example, by arranging the first polishing tape and the second polishing tape (which may be the same) in the polishing apparatus, various shapes (for example, linear) And a portion to be polished) can be polished. The polishing apparatus according to the present invention can polish the peripheral portion of a thin plate workpiece having a thickness of 1 mm or less with high accuracy. The workpiece may be a plate glass or a plate made of a crystalline material such as silicon. The present invention is particularly effective for polishing the peripheral edge so as to improve the strength of a plate made of a crystal material having a cleavage property. The workpiece may be a plate made of a crystal material having no cleavage property, or a plate made of a metal material such as stainless steel or aluminum.

  The polishing apparatus according to the present invention may preferably include a work transfer unit in order to perform automatic continuous polishing from the first polishing unit to the second polishing unit. The workpiece transfer unit preferably has arm means for sucking and transferring the upper surface of the workpiece. The arm means of the work transfer unit also rotates and places the work on the work unit. For example, as shown in FIG. 15, with respect to a rectangular workpiece W, the workpiece is centered on the center C1 that is the intersection of the workpiece diagonals or the center C2 that is the intersection of the square diagonals including the short sides of the workpiece. Rotate (90 degrees or 180 degrees). By having the workpiece transfer unit, for example, the entire peripheral edge of the workpiece including the four end surfaces (or the eight sides related to the upper and lower surfaces) of the rectangular workpiece and the four corners can be automatically and continuously polished. Can do.

  The polishing apparatus according to the present invention preferably polishes the peripheral portion of a workpiece made of plate glass. When polishing the peripheral portion of a workpiece made of plate glass, in the first polishing unit of the polishing apparatus, the linear portion to be polished and the first polishing surface are the linear portion to be polished at the peripheral portion of the plate glass. The relative surface moves so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less. However, the non-linear polished portion at the peripheral edge of the plate glass is relatively moved so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less.

  The polishing apparatus according to the present invention is configured to polish the peripheral portion of the plate glass to improve the mechanical strength of the plate glass. As shown in FIG. 16, the plate glass W that is an object to be polished was formed when the base plate was cleaved at the main surface (upper surface, lower surface) or the peripheral portion (ridge portion, corner portion) of the end surface. (A) It has a recessed part and a convex part, and (B) a crack etc. The sharp convex part formed in the ridge part becomes the starting point of chipping, and the crack becomes the starting point of destruction of the plate glass. The polishing apparatus according to the present invention improves the strength of the plate glass by polishing the peripheral edge with high precision so that cracks and the like generated during the production of the plate glass disappear without propagating. In order to form a highly accurate surface property that can improve the strength of the plate glass, the polishing surface is made of polishing tape, and the polishing surface and the portion to be polished are relative to each other so that scratches and chipping are not formed on the portion to be polished. Moving.

  Specifically, the first work unit includes a first work holding base for holding the work, and a swinging means for swinging the first work holding base along the first polishing axis. ,including.

  In the polishing apparatus according to the present invention, polishing is performed by reciprocating (swinging) a linear portion to be polished horizontally with a predetermined stroke with respect to a stationary polishing surface. The work unit is reduced in size and weight, and by arranging a balancer or the like, vibration during swinging can be reduced. As a result, the generation of scratches on the surface to be polished due to vibration is reduced, and a smooth polished surface can be finished with high accuracy. The position of the polishing surface is stationary, and the polishing tape that forms the polishing surface may be running.

  In the polishing apparatus according to the present invention, the range (stroke) in which the plate glass held by the workpiece holding unit and the polishing surface of the polishing tape unit swing (relatively) is preferably in the range of plus or minus 1 to 200 mm. It is in. By doing so, it becomes difficult for the polishing amount to vary.

  An X-direction movable stage provided on the horizontal base so as to be movable in a horizontal direction and a direction perpendicular to the second polishing axis (X direction), and a second polishing axis. A Y-direction movable stage provided so as to be movable in a parallel direction (Y-direction), and integrally provided on a Y-direction movable stage integrally having a groove extending in the X direction, and the X-direction movable stage. A second workpiece holding table horizontally supported by the first vertical axis, the second workpiece holding table extending vertically from the surface of the second workpiece holding table. A second vertical axis that is slidably positioned in the groove of the Y-direction movable stage, and the workpiece is held by the second workpiece holder, and is a non-linear object to be polished However, by the movement of the first vertical axis and the second vertical axis Wherein while swinging motion along a second polishing axis swings, characterized in that.

  Also in the second polishing section, polishing is performed by a non-linear polished portion reciprocating with a predetermined stroke while swinging in a horizontal plane with respect to a stationary polishing surface. At this time, the swing motion can be determined according to the curvature or the like of the portion to be polished (or according to the curvature to be formed), and the trajectory of the horizontal reciprocation coincides with the polishing axis. Polishing is performed while the portions sequentially contact the flat polishing surface.

  The positions of the two vertical axes are preferably controlled synchronously by a servo motor or the like. The position x in the X direction of the first vertical axis, the position x ′ in the X direction of the second vertical axis, and the position y in the Y direction are controlled in synchronism so that the corners of the plate glass are non-linear. A portion to be polished can be formed into a desired R shape (for example, R1, R10, etc.).

  Preferably, even with one type of polishing tape, a portion to be polished having various curvatures can be polished. It is not necessary to produce a polishing material (grinding stone or the like) according to the R shape, and a highly accurate finished surface can be formed at the corner of the workpiece while reducing the cost.

  Further, the first polishing tape unit has first polishing tape moving means for moving the first polishing surface in the horizontal direction and in the direction perpendicular to the first polishing axis. The portion to be polished and the first polishing surface can be in contact with each other at the first polishing axis, and the second polishing tape unit has a direction in which the second polishing surface is horizontal and perpendicular to the second polishing axis. Having a second polishing tape moving means for moving to at least a portion of the non-linear object to be polished and the second polishing surface at the second polishing axis, It is characterized by that.

  By having the positioning mechanism as described above, for example, the entire side portion of the rectangular workpiece can be brought into contact with the flat polishing surface at the polishing axis, and uniform polishing without any contact can be performed. In addition, since the mechanical impact on one point of the work is suppressed, the occurrence of chipping and the propagation of cracks existing in the work are also suppressed, and high-precision polishing that improves the breaking strength of the work can be performed. In addition, there is no variation in strength between workpieces, and the quality can be stabilized.

  Furthermore, the first polishing tape unit includes first tilting means for tilting the longitudinal axis of the first polishing surface with respect to the first polishing axis, and the second polishing tape unit includes the second polishing tape unit. And a second tilting means for tilting the longitudinal axis of the polishing surface with respect to the second polishing axis.

  The polishing tape unit according to the present invention preferably has a polishing pad that faces the work unit and is parallel to the polishing axis, and the surface of the polishing tape disposed (movable) on the polishing pad is A polishing surface for polishing a portion to be polished of the workpiece is defined. The polishing tape disposed on the polishing pad has a predetermined width and length, and has a longitudinal axis (longitudinal axis). The longitudinal axis is equal to the running direction when the abrasive tape is run. The longitudinal axis may coincide with the polishing axis or may be inclined with respect to the polishing axis.

  For example, the longitudinal axis of the polishing surface can be inclined by θ degrees. When the polished surface is a vertical surface, θ degree is an inclination angle with respect to the horizontal plane.

  The polishing tape that defines the polishing surface has a predetermined width. In addition, the vehicle may continuously travel at a predetermined speed. When the longitudinal axis of the polishing tape is horizontal, for example, the polishing surface (polishing tape) that comes into contact with the linear side of a horizontal workpiece becomes small, and the polishing tape that has been used and wound up without polishing is used. The amount increases. Since the polishing apparatus according to the present invention has means for inclining the longitudinal axis of the polishing surface, it is highly profitable in terms of cost. That is, by tilting the longitudinal axis of the polishing surface (running direction when traveling) with respect to the polishing axis, a wide range (preferably the entire surface) of the polishing tape can be used effectively, and the running cost ( The cost of the polishing tape can be reduced. The inclination angle θ can be determined in the range of 0 ° <θ ≦ 90 °, for example, according to the length of the side portion of the workpiece such as plate glass. It is possible to deal with workpieces such as plate glass having different sizes with a polishing tape having a certain width, and the structure of the polishing tape unit can be simplified. When using a plurality of tape units, the specifications are uniform and the manufacturing cost of the polishing tape unit can be reduced. In addition, since one type of polishing tape can be used for various types of workpieces (plate glass or the like), it is not necessary to replace the tape for each workpiece, and the cycle time can be reduced. Since there are fewer types of abrasive tapes, inventory management is also easier (reducing defective inventory, volume discounts by purchasing the same type of tapes in bulk, etc.). A polishing tape having a narrow width can be used to reduce the weight of the polishing tape, and the tape can be easily replaced. Moreover, it is possible to polish a plurality of plate glasses at the same time by using a polishing tape having a certain width, and to further reduce the cycle time.

  Further, the first polishing tape unit includes first rotating means for rotating the first polishing surface about the first polishing axis, and the second polishing tape unit includes the second polishing tape unit. It includes a second rotating means for rotating the polishing surface about the second polishing axis.

  In the polishing apparatus according to the present invention, the polishing surface can be arranged vertically, and the polishing surface is rotated about the polishing axis (or a rotation axis parallel to the polishing axis), and the vertical surface is rotated. Can be tilted. By doing in this way, the linear side part of a workpiece | work can be C surface grind | polished. Since the polishing tape unit rotates, desired C-surface polishing can be performed on the side portions related to the upper surface and the lower surface of the workpiece fixed horizontally to the workpiece unit. The work unit does not need to tilt the work and can simplify the configuration. The range of the angle α at which the polishing surface of the polishing tape unit rotates about the polishing axis is preferably 90 ° in the vertical direction with the polishing surface parallel to the vertical surface being 0 ° (at this time, the polishing surface is Horizontal).

  Alternatively, the polishing tape unit may not have a rotation mechanism. In this case, in order to polish one side part (ridge part) related to the upper surface (or lower surface) of a workpiece such as a plate glass placed horizontally, the polishing surface of the polishing tape unit is a vertical surface (or a horizontal surface). On the other hand, for example, the polishing tape unit may be configured by being fixed in a state inclined by 45 degrees.

  Further, the first work unit includes a work moving means for moving the work in a horizontal direction and a direction perpendicular to the first polishing axis. By doing in this way, a linear to-be-polished part and a grinding | polishing surface can contact | abut reliably in a grinding | polishing axis line.

  Furthermore, in the polishing apparatus according to the present invention, the first work unit includes first work fixing means for pressing and fixing the work and / or adsorbing and fixing the second work unit. The second workpiece fixing means for pressing and fixing the workpiece and / or adsorbing and fixing the workpiece is included.

  A work such as plate glass placed on the work unit (first and second) is fixed to a work holding table of the work unit before the actual polishing process. As the fixing means, a suction force and a pressing force are preferably used. A workpiece such as a plate glass may be pressed and fixed from above by a fixed plate or the like, or may be fixed to the holding table by a vacuum suction method or the like. An elastic sheet such as cloth or rubber may be attached to the front surface of the holding table and the back surface of the fixed plate so that the upper surface and the lower surface of the workpiece such as plate glass are not damaged.

  By pressing the upper surface and sucking the lower surface together, the workpiece is held on the workpiece holding table with a high holding force. During the polishing process, even when pressed by the polishing surface of the polishing tape unit, the plate glass does not move and polishing can be performed efficiently.

  In addition, the first polishing tape unit includes first polishing tape running means for running the first polishing tape, and the second polishing tape unit runs second for running the second polishing tape. The polishing tape running means is included.

  A polishing apparatus according to another aspect of the present invention is a polishing apparatus having a horizontal polishing axis for polishing a linear portion to be polished at a peripheral portion of a workpiece using a polishing tape, and holds the workpiece. And a polishing tape unit for disposing at least a part of the surface of the polishing tape across the polishing unit across the polishing axis, the surface of the arranged polishing tape being a polishing surface In this case, the polishing is performed by the relative movement of the portion to be polished and the polishing surface in contact with each other along the polishing axis.

  The workpiece is made of plate glass, and the workpiece unit includes a workpiece holder for holding the workpiece, and a swinging means for swinging the workpiece holder along the polishing axis, and is linearly polished. The portion and the polishing surface move relative to each other so as to form a linear portion to be polished at the peripheral edge of the plate glass so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less. And

  Further, the polishing tape unit is a polishing tape moving means for moving the polishing surface in a horizontal direction and a direction perpendicular to the polishing axis, whereby the linear portion to be polished and the polishing surface are at the polishing axis. Abrasive tape moving means capable of abutting, an inclination means for inclining the longitudinal axis of the polishing surface with respect to the polishing axis, and a rotation means for rotating the polishing surface about the polishing axis , Including.

  Further, the work unit includes a work moving means for moving the work in a horizontal direction and a direction perpendicular to the polishing axis.

  By comprising in this way, using a polishing tape, it is possible to perform a desired C-surface polishing on a linear part to be polished of a workpiece, such as a side portion of a rectangular plate glass, using the polishing tape. It can be set as a polisher. Moreover, it can be set as the grinding | polishing apparatus which can grind | polish the edge part or end surface of plate glass with high precision so that the intensity | strength of plate glass may be improved.

  Another aspect of the polishing apparatus according to the present invention is a polishing apparatus having a horizontal polishing axis for polishing a non-linear portion to be polished at the peripheral edge of a workpiece using a polishing tape. A polishing unit including: a workpiece unit for holding a workpiece; and a polishing tape unit for disposing at least a part of the surface of the polishing tape across the polishing axis across the polishing axis. The surface defines a polishing surface, and polishing is performed by the relative movement of the non-linear polished portion and the polishing surface in contact with the polishing axis.

  In addition, the workpiece is made of plate glass, and the workpiece unit is arranged on a horizontal base so as to be movable in a horizontal direction and a direction perpendicular to the polishing axis (X direction), and a direction parallel to the polishing axis. A Y-direction movable stage provided so as to be movable in the (Y-direction), a Y-direction movable stage integrally having a groove extending in the X direction, and a first provided integrally with the X-direction movable stage. A workpiece holding table horizontally supported rotatably by a vertical axis, the workpiece holding table being a second vertical axis extending vertically from the surface of the workpiece holding table, and in the groove portion of the Y-direction movable stage The workpiece is held by the workpiece holder, and the non-linear polished portion is moved by the movement of the first vertical axis and the second vertical axis. The polishing axis while swinging The surface to be polished and the polished surface are non-linearly polished at the peripheral edge of the plate glass, the average surface roughness Ra is 20 nm or less, and the maximum valley depth Rv is 200 nm. Relative movement to form below

  By comprising in this way, it can be set as the polisher which grind | polishes (for example, R surface grinding | polishing of a corner | angular part) of the nonlinear to-be-polished part of workpiece | works, such as plate glass, using a polishing tape. When polishing a portion to be polished having an R shape with different curvatures (for example, R1, R10, etc.), the work unit swings on the polishing axis while swinging according to the shape, so it corresponds to the R shape. Thus, it is possible to perform highly accurate polishing without having to change the polishing material (grinding stone or the like).

  The polishing tape used in the polishing apparatus according to the present invention is formed by applying a solution in which abrasive grains are dispersed in a resin binder to the surface of a plastic base film, and slitting the dried and cured sheet to the required width. And wound on a reel.

  As the base film, a plastic film made of synthetic resin having flexibility is used. Specifically, from polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate and polybutylene naphthalate, polyolefin resins such as polyethylene and polypropylene, acrylic resins mainly composed of polyvinyl alcohol or methacryl alcohol, etc. The resulting film is used as a substrate film.

As abrasive grains (abrasive particles), alumina (Al ₂ O ₃ ), cerium oxide (CeO ₂ ), silica (SiO ₂ ), diamond, silicon carbide (SiC), chromium oxide (Cr ₂ O ₃ ), zirconia (ZrO) ₂ ), cubic boron nitride (cBN) and the like and mixtures thereof can be used.

  The average particle diameter of the abrasive grains is preferably in the range of 0.2 μm or more (# 20000) or 3 μm or less (# 4000). If the average particle size exceeds 3 μm, relatively large scratches and chips on the end face before polishing can be removed, but fine scratches and chips on the finished surface are newly generated, and sufficient strength cannot be imparted to the plate glass. It is not preferable. When the average particle size is less than 0.2 μm, the polishing efficiency is extremely lowered and the productivity is deteriorated, so that it is not industrially practical.

  Furthermore, the present invention provides a method for polishing the peripheral portion of a workpiece so as to improve the strength of the workpiece made of plate glass using the polishing apparatus described above. In this method, a linear portion to be polished or a non-linear portion to be polished is polished using a polishing tape, and the average surface roughness Ra is 20 nm or less and the maximum is obtained. The polishing step comprises forming the valley depth Rv to 200 nm or less, and the polishing tape is formed by adhering abrasive grains having a predetermined particle size to the base film with a resin binder.

  In order to impart sufficient mechanical strength to the plate glass, it is effective to form a finished surface having the above-described surface roughness Ra and maximum valley depth Rv at the peripheral edge of the plate glass. Polished sheet glass so that the peripheral edge has the above-mentioned surface properties can prevent cracks originating from fine scratches and chips on the peripheral edge, and can be prevented from being damaged by mechanical stress or heat shock. . Moreover, the process yield of a post process can be improved and the reliability of the product in which plate glass was incorporated can be improved.

  By carrying out the polishing apparatus or the polishing method of the present invention, a cover glass for a flat display such as a panel of a smart phone or a tablet terminal, a liquid crystal panel, an organic EL panel, a plasma panel, a solar battery panel, and other electronic parts. It is possible to remove the latent scratches on the side and / or corners of the plate glass used for the production of glass and the like to form a highly accurate surface property and to impart high mechanical strength to the plate glass. By producing a cover glass using the plate glass according to the present invention and adopting it for a portable terminal or the like, the production yield in the production process of various products can be improved, and the quality of the product in which the plate glass is incorporated can be improved. Can be improved.

  Further, according to the polishing apparatus and the polishing method of the present invention, the side part, the end face, the corner part, the ridge part of the corner part, etc. of the workpiece such as plate glass can be polished, and the polishing material is matched to the shape of the object to be polished. There is no need to make. Moreover, since the polishing tape can be used efficiently, the quality can be improved while reducing the cost.

FIG. 1 is a diagram schematically showing a workpiece according to one embodiment. 2A is a partial cross-sectional view of the work, and FIG. 2B is a plan view of the work. FIG. 3 is an abbreviated front view schematically showing the polishing apparatus 1 of one embodiment according to the present invention. FIG. 4A is a plan view schematically showing a polishing portion of one embodiment according to the present invention. FIG. 4B is a plan view schematically showing the positioning mechanism of the polishing tape unit of one aspect according to the present invention. FIG. 5 is a partially omitted side view taken along the line X-X ′ of FIG. 4A schematically showing a rotating mechanism of the polishing tape unit of one embodiment according to the present invention. FIG. 6 is a partially omitted front view schematically showing the tilting mechanism of the polishing tape unit of one embodiment according to the present invention. FIG. 7 is a plan view schematically showing the swinging mechanism of the work unit according to one aspect of the present invention. FIG. 8 is a plan view schematically showing a workpiece moving mechanism of the workpiece unit according to one aspect of the present invention. FIG. 9 is a plan view schematically showing a polishing portion according to another aspect of the present invention. FIG. 10A is a plan view schematically showing a work unit of another aspect according to the present invention. FIG. 10B is a side view schematically showing a work unit of another aspect according to the present invention. FIG. 11 is a diagram schematically illustrating a method of polishing a workpiece side (ridge) using a grindstone. FIG. 12 is an enlarged photograph of the polished surface of the example and the comparative example. FIG. 13 is an enlarged photograph of the polished surface of another comparative example. FIG. 14 is a diagram schematically showing an edge strength test method. FIG. 15 is a diagram showing centers C1 and C2 of a workpiece such as a rectangular plate glass. FIG. 16 shows (A) a side observation image and (B) a top surface observation image of a plate glass as a workpiece.

  Various features of the present invention will now be described with reference to the drawings, together with preferred embodiments not intended to limit the invention. The drawings are simplified for illustrative purposes, and the scales do not necessarily coincide.

  FIG. 1 schematically shows a workpiece W that is an object to be polished. The workpiece W may be a glass plate, a stainless plate, an aluminum plate, a silicon plate used as a solar cell substrate, or the like. The workpiece may be rectangular or other shapes. The workpiece W has a side portion (ridge portion) at the boundary portion between the upper surface or the lower surface (main surface) and the end surface, and has a corner portion (corner portion) at the boundary portion between one end surface and the adjacent end surface. . The end face and the corner may be cut out from the base plate (as-sliced) or may be subjected to rough polishing.

  2A shows a partial cross section of a workpiece W1 having at least two sides chamfered, and FIG. 2 shows a workpiece W2 having four corners chamfered. By polishing the sides or corners, workpieces W1 and W2 having finished surfaces S1, S1 'or S2, S2', S2 ", S2" 'are obtained.

  The workpiece W may be made of plate glass. In order to improve the strength of the plate glass, it is important to polish the peripheral portion to remove scratches and chipping, and to reduce the surface roughness and maximum valley depth of the finished surface S1 or S2 or the like. In order to impart high mechanical strength to the plate glass W, it is preferable that the finished surface S1 or the like or S2 or the like is formed so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv of the roughness curve is 200 nm or less. .

  FIG. 3 schematically shows a polishing apparatus 1 according to one embodiment of the present invention. The polishing apparatus 1 includes a work table 10 placed on a base 2, a work transport unit 20 that transports the work W according to a flow direction Wf of the work W, a first polishing unit 30, a second polishing unit 40, And a table 50 on which the workpiece W12 for which the polishing process has been completed is placed. The first polishing unit 30 is configured to polish a linear portion to be polished, and the second polishing unit 40 is configured to polish a non-linear portion to be polished. The number and combination of these polishing parts need not be limited to this.

  FIG. 4A schematically shows the first polishing unit 30. The first polishing unit 30 includes a polishing tape unit 300 and a work unit 350 that are disposed on the horizontal base 2 so as to face each other with the horizontal polishing axis A interposed therebetween.

  The polishing tape unit 300 includes a polishing tape unit stage 301 provided on the base 2 so as to be movable in the A1 direction which is a horizontal direction and a direction perpendicular to the polishing axis A. The stage 301 can be reciprocated in the A1 direction by a motor 302 and LM guides 303 and 304 for extrusion control provided between the stage 301 and the base 2. On the stage 301, support columns 305, 306, and 307 extend in the vertical direction. The connecting block 311 can be moved in the vertical direction along the column 305 by the LM guide 309 and the single-axis robot 310 provided in parallel to the column 305. Two shafts 312, 312 ′ (FIG. 5) preferably pass through the connecting block 311 so as to be slidable in the horizontal direction. A connecting member 313 is attached to the distal ends of the shafts 312 and 312 '. The connecting member 313 is rotatably connected to an extension arm 314 ′ integrated with the rotating arm 314 by a pivot pin 316. The rotating arm 314 (and the extension arm 314 ′) and the rotating arm 315 have a substantially bilaterally symmetric shape, and the polishing tape T is attached via the connecting jigs 330 and 331, the plate 317, and the inclined plate 318. A polishing head 319 that is a box to be accommodated and arranged is held from the left and right. The rotating arms 314 (314 ') and 315 are attached to the support columns 306 and 307 so as to be rotatable about the axis A2. The axis A2 is parallel to the polishing axis A.

  The polishing head 319 is configured such that a roll for disposing the polishing tape T is rotatably disposed in a box having a bottom surface and a side surface. The top surface of the polishing head 319 preferably comprises a lid that can be opened and closed. The polishing head 319 includes a pad member (polishing pad) 324, and a polishing tape supplied by a roll is disposed on the pad member 324. The polishing tape T is supplied from the supply roll 321 and taken up by the take-up roll 322. The supply roll 321 is connected to a torque motor (not shown) in order to give an appropriate tension to the polishing tape T. The take-up roll 322 is connected to a stepping motor (not shown) and takes up the polishing tape T supplied from the supply roll 321. A stopper roller for applying an appropriate tension to the polishing tape T, an auxiliary roller for appropriately arranging the polishing tape T on the pad member 324, and the like may be further provided. The polishing tape T disposed on the polishing pad 324 defines a polishing surface 320 having a predetermined length and width according to the shape of the surface of the polishing pad 324 (for example, a flat rectangle).

  The pad member 324 is preferably selected appropriately in order to form a highly accurate surface texture on the portion to be polished of the workpiece W. If the elasticity of the pad member 324 is too large (for example, the Shore A hardness is less than 20), the finished surface of the workpiece W (for example, the side portion) of the workpiece W will be tilted, and the linearity of the edge portion will be easily lost. . Further, when the average particle size of the abrasive grains contained on the surface of the polishing tape T is 1 μm or less (# 8000), the polishing rate is drastically reduced with a pad member such as a foamed resin plate having high elasticity, which is not practical. . When the elasticity is small (for example, the Shore A hardness exceeds 90), the straightness of the edge portion of the finished surface is sufficient, but removal of scratches and chips generated on the workpiece due to mechanical impact tends to be insufficient.

  For example, a foamed resin plate having a Shore A hardness of 20 to 50 can be used as the pad member 324 in order to reduce mechanical impact. By contacting the work surface with the polishing surface 320 formed of the polishing tape T via the pad member 324 having elasticity, the mechanical impact can be reduced, and even if the shape of the part to be polished changes with polishing. Easy to follow.

  Alternatively, as the pad member 324, a combination of the above foamed resin plate and a rubber plate having a Shore A hardness in the range of 80 to 90 can be used. By doing so, even when an abrasive tape having an extremely small average particle diameter (for example, 1 μm or less) is used, high-precision surface properties (Ra, Rv) are obtained without slowing the polishing rate very much. A finished surface having excellent edge linearity can be formed.

  The pad member 324 may not have elasticity such as MC nylon. When the pad member 324 does not have elasticity, it is preferable to perform pressure control so that a mechanical shock does not occur.

  The surface of the pad member 324 may be a convex curved surface that is not flat. This is because the contact of the end portion (for example, both ends of the side portion) of the portion to be polished with the polishing tape T (polishing surface) is limited and the polishing tape T can be polished while being protected.

  By using a flexible polishing tape and an elastic pad member to perform C-surface polishing of the peripheral edge of the workpiece W, generally, the finished surface (S1, FIG. 2) has an edge portion (the upper surface or the lower surface and the finished surface). The boundary portion of the surface S1 is formed into a curved surface having a R-shaped cross section, and no new scratches or chips are formed on the new edge portion.

  During the polishing process, the polishing tape T may be stationary, and may be continuously or intermittently run. When polishing is completed in a short time, the polishing tape T is used in a stationary state without running, and after polishing, the surface of the new polishing tape T is supplied to the pad member as a polishing surface for the next polishing. It's okay. This is because the cost can be reduced by doing so. When polishing takes a long time, it is preferable to run the polishing tape continuously or intermittently in order to continuously supply a stable polishing surface, that is, the surface of the polishing tape containing abrasive grains. This is because the polishing efficiency can be increased.

  The pressing force for pressing the polishing surface 320 defined by the polishing tape T disposed on the pad member 324 against the side or end surface of the workpiece W such as a plate glass is small in the initial polishing depending on the state of the workpiece W. You may gradually increase as you progress. For example, in the case of plate glass, there are sharp portions at the corners and end faces of the as-slice, and when a strong pressing force is applied from the initial stage of polishing, the polishing tape T on the polishing surface 320 is damaged by the sharp portions, or the polishing tape T May be damaged. By adjusting the pressing force, polishing can be performed while protecting the polishing tape surface.

  The work unit 350 includes a horizontal work holding table 351 for holding the work W horizontally. Prior to the polishing process, the workpiece W is preferably placed on the workpiece holder 351 across the polishing axis A (by the workpiece transfer unit 20).

  FIG. 4B shows a positioning mechanism in the first polishing section of the polishing apparatus of the present invention. The polishing tape unit stage 301 is moved in the A1 direction by the motor 302 (FIG. 4A) and the LM guides 303 and 304 (same as above), and at least one end face (or side part) of the work W placed on the work holding table 351. A part contacts the polishing surface 320. Further, when pressed by the polishing surface 320, the entire one end surface (side portion) contacts the polishing surface 320 at the polishing axis A. At this time, the polishing axis A may coincide with the rotation axis A2.

  Since the workpiece W thus positioned is fixed to the workpiece holder 351 and subjected to a polishing process, uniform polishing without any contact is performed on one end surface (side portion) of the rectangular workpiece. be able to.

  FIG. 5 shows a side view taken along line X-X ′ of FIG. The pivoting arm 314 and the extension arm 314 'are shown integrally for the sake of simplicity, and the polishing head 319 is shown in broken lines. A rotation arm 314 (314 ′) that holds the polishing head 319 via the connection jig 330, the plate 317, and the inclined plate 318 is centered on the rotation axis A2 (preferably located on the polishing surface 320). It is attached to the support | pillar 306 so that rotation is possible. On the opposite side of the polishing head 319, an arm 315 is attached to the support column 307 (FIG. 4A). The shapes of the rotating arm and the connecting jig are not particularly limited, and can be appropriately selected so as to hold the polishing head 319 and a member (plate, motor, etc.) integral with the polishing head 319.

  As described above, the pivot arm 314 (314 ′) is pivotally attached to the connection member 313 by the pivot pin 316, and the shafts 312 and 312 ′ penetrating the connection block 311 are fixed to the rear end of the connection member 313. The connecting block 311 can be moved in the vertical direction along the support column 305 by the LM guide 309 and the single-axis robot 310.

  As the connecting block 311 moves upward along the column 305, the shafts 312 and 312 ′ integrated with the connecting member 313 are pulled out in the right direction in the drawing, and the rotating arm 314 (314 ′) is rotated about the rotation axis A2. And the polishing head 319 held by the rotating arm rotates about the rotation axis A2, so that the polishing surface 320 can be inclined by α degrees with respect to the vertical surface. The range of the angle α is not limited to the illustrated example, and can be arbitrarily determined according to the vertical movement distance of the connection block 311, the lengths of the shafts 312 and 312 ′, and the like. The range of the angle α is preferably −90 degrees ≦ α ≦ 90 degrees with respect to the vertical plane including the rotation axis A2.

  As described above, when the polishing surface 320 of the polishing head 319 is inclined with respect to the vertical plane by the angle α, one side portion (ridge portion) of the upper surface of the workpiece W (not shown) held horizontally by the workpiece unit. The desired C surface polishing can be performed.

  Similarly, when the connecting block 311 moves downward along the support column 305, the polishing surface 320 contacts the side (ridge) of the lower surface of the workpiece W (not shown) held horizontally by the workpiece unit. The desired C surface polishing can be performed in contact.

  FIG. 6 shows an inclination mechanism of the polishing tape unit 300 according to the present invention. As described above, the connecting jigs 330 and 331 integrated with the rotating arms 314 and 314 ′ (FIGS. 4A and 5) integrally hold the plate 317. An inclined plate 318 is attached to the plate 317 by an axial support pin 325 so as to be rotatable around an axis A7 (FIG. 5) penetrating the axial support pin 325. The lower surface of the polishing head 319 is integrally connected to the flat upper end (FIG. 4A) of the inclined plate 318. The plate 317 is provided with guide grooves 326a, 326b, 326c, and 326d that form a circular arc centered on the pivot pin 325 (axis A7). Fixing jigs 327 a, 327 b, 327 c, and 327 d provided integrally with the inclined plate 318 slide in the guide grooves 326 a, 326 b, 326 c, and 326 d according to the rotation of the inclined plate 318, respectively. Thus, the inclined plate 318 can be fixed to the plate 317.

  When the inclined plate does not rotate, the longitudinal axis A3 of the polishing surface 320 formed by the surface of the polishing tape T is the polishing axis A (the locus in which the part to be polished and the polishing surface of the workpiece are in contact with each other and moved relative to each other for polishing). ). When the inclined plate 318 rotates, the longitudinal axis A3 of the polishing surface 320 is inclined by θ, for example, toward the longitudinal axis A3 ′. The range of the angle θ is preferably 0 degree <θ ≦ 90 degrees.

  FIG. 7 shows a swing mechanism of a work holding base 351 for holding a work W in the work unit 350 according to the present invention.

  The workpiece holding unit 350 is horizontally mounted on the top of a support column (not shown) extending vertically on the base 2 and has a fixed plate 359 having LM rails 360a and 360b parallel to the polishing axis A on the upper surface. Have Below the fixed plate 359 are provided timing pulleys 354a, 354b, 354c, and 353a, 353b, 353c, 353d that are driven in conjunction with a motor 352 and a timing belt 355. Above the fixed plate 359, a work holding base 351 is horizontally mounted integrally with LM blocks 361a, 361b, 361c, 361d that can swing on the LM rails 360a, 360b. Similarly, a balancer (weight) 358b is mounted integrally with the LM blocks 362a and 362b swingable on the LM rails 360a and 360b above the fixed plate 359, and the balancer is integrated with the LM blocks 363a and 363b. A (weight) 358c is placed.

  A rod 356a extending vertically from the upper surface of the timing pulley 354a is inserted into a groove 357a provided on the lower surface of the work holding table 351. Further, a rod 356b extending vertically from the upper surface of the timing pulley 354b is inserted into the groove 357b provided on the lower surface of the balancer 358b, and the groove 357c provided on the lower surface of the balancer 358c is vertically inserted from the upper surface of the timing pulley 354c. An extending rod 356c is inserted.

  By driving the motor 352, the timing pulleys 354a, 354b, and 354c are rotated, and the rods 356a, 356b, and 356c are rotated in synchronization with each other, so that the workpiece holder 351 and the balancers 358b and 358c are respectively along the polishing axis A. Swing.

  Here, the work holding table 351 is configured to sufficiently suppress the vibration of the work W held horizontally by a fixing means (not shown). When the work holding base 351 moves to the left in the drawing, the balancers 358b and 358c each move to the right. When the work holder 351 moves to the right in the drawing, the balancers 358b and 358c move to the left. By doing in this way, the vibration at the time of the workpiece | work holding stand 351 swinging is canceled, and highly accurate grinding | polishing can be performed.

  In order to suppress vibration, the swing mechanism may be configured such that a plurality of (for example, two) work holding bases 351 are provided adjacent to each other and swing in the opposite direction along the polishing axis A in synchronization. Good. In this case, since the vibration is canceled by the plurality of work holding bases, a balancer becomes unnecessary.

  Polishing is performed by moving the object to be polished (plate glass) relative to the polishing body (polishing surface) according to the force to press the polishing surface (polishing tape T), the flexibility and elasticity of the pad member, and the strength of the plate glass. However, the object to be polished is not damaged during polishing. Since the relative movement between the part to be polished and the polishing surface (the surface of the polishing tape) during polishing is performed along the polishing axis while suppressing vibrations, a highly accurate surface texture is applied so as to improve the strength of the plate glass. It can be given to the polished surface (finished surface S1, etc., FIG. 2).

  FIG. 8 shows a positioning mechanism according to another aspect of the polishing apparatus of the present invention. The work holding base 351 ′ of the work unit 350 has a groove 334 on its upper surface, and a rod 333 that can move in the direction of the drive axis A <b> 1 ′ of the motor 332 is positioned in the groove 334.

  As shown in FIG. 8A, when the workpiece W is placed without straddling the polishing axis A, the rod 333 driven by the motor 332 pushes the workpiece W in the A1 direction toward the polishing axis A. In this way, the polishing surface of the polishing tape unit and the portion to be polished of the workpiece W can reliably contact each other on the polishing axis A.

  FIG. 9 shows a second polishing unit 40 according to the polishing apparatus 1 (FIG. 3) of the present invention. The second polishing unit 40 includes a polishing tape unit 300 ′ and a work unit 400 having a work holding base 401 on which the work W is arranged, facing the polishing tape unit 300 ′ across the polishing axis A. Comprising. The polishing tape unit 300 ′ preferably has the same configuration as that of the polishing tape unit 300. The polishing axis A may coincide with the first polishing portion. Further, it may have a horizontal polishing axis A ′ that does not coincide with the first polishing axis A.

  A work unit 400 is shown in FIGS. 10A and 10B. In FIG. 10A, the workpiece W and the workpiece holding base 401 are indicated by broken lines.

  The work unit 400 is mounted on a support plate 402, 402 ′ that extends vertically upward from the horizontal base 2 and on a support plate 404 that extends horizontally upward from the upper surface of the fixed plate 403. It has the fixed plate 405 mounted horizontally.

  An X-direction movable stage 413 is mounted on the fixed plate 405 so as to be reciprocally movable in the X direction by a servo motor 414 and a single-axis movable unit 408. An X-direction movable plate 406 is integrally attached on the X-direction movable stage 413. An axis A4 made of a shaft member extends vertically from the upper surface of the X-direction movable plate 406, and supports the work holding base 401 horizontally so as to be rotatable.

  On the fixed plate 405, a Y-direction movable stage 407 having a hole 429 is attached by a linear guide 409 so as to be reciprocally movable in the Y direction. A Y-direction movable plate 410 is integrally provided on the Y-direction movable stage 407, and a guide member 411 having a guide groove 412 is integrally attached thereon. An axis A5 composed of a rod (or pin) extending vertically from the lower surface of the work holding base 401 is slidably positioned in a guide groove 412 formed in the X direction.

  Timing pulleys 422 and 424 that are driven by a motor 420 and a timing belt 423 are provided between the plate 403 and the plate 405, and the timing pulley is provided between the timing pulley 422 and the Y-direction movable stage 407. A rotating member 425 that can rotate in synchronization with 422 is provided. A rod 427 extending vertically upward from the upper surface of the rotating member 425 is inserted into the hole 429 of the Y-direction movable stage 407.

  When the timing pulley 422 rotates through the timing belt 423 by driving the motor 420, the rotating member 425 rotates in synchronization with the pulley 422. When the rotating member 425 rotates, the integral rod 427 rotates and moves in a hole 429 provided in the Y-direction movable stage 407, while reciprocating the movable stage 407 with a constant stroke. As the Y-direction movable stage 407 reciprocates, the integral plate 410 and the guide member 411 reciprocate in the Y direction, and the vertical axis A5 in the guide groove 412 moves in the Y direction. Corresponding to the movement of the vertical axis A5 in the Y direction, the position y of the vertical axis A5 in the Y direction is transmitted to the servo motor 414 via the sequencer. The servo motor 414 synchronizes the vertical axis A4 and A non-linear polished portion (a corner portion having a predetermined curvature) of W is moved to a position x in the X direction of the vertical axis A4 located on the polishing axis A. By the movement of the vertical axis A4 in the X direction, the work holding base 401 horizontally held rotatably on the vertical axis A4 moves in the X direction, and the vertical axis A5 integrated with the work holding base 401 is moved into the groove 412. To move in the X direction. The movement of the vertical axis A5 is a combination of movements in the X direction and the Y direction, and is a movement that rotates around the vertical axis A4. For example, the vertical axis A5 may move on the circumference of an ellipse whose center is the center C of the swing stroke and whose major axis is 2d.

  As described above, the vertical axis A4 moves in the X direction and the vertical axis A5 moves in the X direction and the Y direction, so that the workpiece holding base 401 swings along the polishing axis A while swinging, and is rectangular. It is possible to perform polishing while sequentially bringing a non-linear portion to be polished such as a corner of the workpiece into contact with the polishing surface.

  By performing position control using a servo motor, the swinging and swinging strokes of the non-linear portion to be polished on the polishing axis A can be easily controlled, and R-surface polishing with a desired curvature can be performed. It can be carried out. Since the workpiece can be swung along the shape of the portion to be polished of the workpiece and polishing can be performed, it is not necessary to prepare an abrasive (grinding stone or the like) according to the shape of the portion to be polished of the workpiece.

  Instead of the above configuration, two-axis control of the X axis and the Y axis may be performed by a servo motor. Alternatively, the positions of the two vertical axes may be controlled by cam control instead of control by the servo motor. In that case, the apparatus can be configured by using a timing pulley for moving the vertical axis A4 in the X direction instead of the servo motor and a cam synchronized with the movement of the vertical axis A5 in the Y direction.

  By polishing the polishing surface 320 ′ of the polishing tape unit 300 ′ by α degrees with respect to the vertical surface, it is possible to polish the ridge portion related to the upper surface (or the lower surface) of the corner portion of the workpiece W.

  The polishing apparatus according to the present invention preferably includes a control device (not shown) for controlling each unit.

  The polishing apparatus according to the present invention can polish either dry or wet. Preferably, in order to perform wet polishing, a water supply machine and a water pipe (not shown) for supplying an aqueous solution to which water or a surfactant is added are provided. By supplying water or the like to the polishing surface or workpiece, polishing efficiency can be improved, or polishing debris can be washed away. The polishing apparatus may include an air nozzle for injecting air. This is because it is possible to prevent water and polishing scraps from adhering to the work unit and the like. In addition, preferably, in order to prevent the workpiece made of the metal material from being burned, a supply machine and a pipe (not shown) for supplying processing oil are provided.

  The polishing apparatus according to the present invention may include a first polishing unit that polishes a linear portion to be polished of the workpiece and a second polishing unit that polishes a non-linear portion to be polished of the workpiece. By doing in this way, the whole peripheral part of sheet glass can be grind | polished with one grinding | polishing apparatus. Moreover, since it grind | polishes using an abrasive tape, a highly accurate surface property can be formed in a finished surface and the quality of a to-be-polished object can be improved. Since the workpieces of various shapes can be polished using the polishing tape, the cost can be reduced, the generation of polishing waste during polishing is small, and the maintenance of the apparatus is easy.

  In addition, the polishing apparatus according to the present invention may include either the first polishing unit or the second polishing unit.

Example 1
The side part (ridge part) of the workpiece was polished using the polishing apparatus according to the present invention. A rectangular soda lime glass having a length of 70 mm, a width of 40 mm, and a thickness of 0.8 mm was used as a workpiece. Eight sides related to the upper and lower surfaces of this plate glass were polished to form finished surfaces (S1, etc., FIG. 2). In polishing, the longitudinal axis of the polishing surface of the polishing tape unit was tilted 10 degrees with respect to the polishing axis (θ = 10 °). Further, the polished surface was inclined 45 degrees with respect to the vertical plane (α = 45 °). In this way, one side portion of the plate glass and the polishing surface were in contact with each other, the work unit was swung along the polishing axis, and the plate glass and the polishing surface were moved relative to each other to perform polishing. The polishing amount for C-side polishing was 50 μm, and the number of plate glass reciprocations (1 reciprocation = 1 pass) was adjusted according to the abrasive grain size contained in the surface of the polishing tape in order to obtain a constant polishing amount. The polishing surface was parallel to the polishing axis and the polishing tape was not run. Polishing was performed while supplying a small amount of water to the polishing surface.

  The other polishing conditions of Example 1 are as follows.

Polishing conditions (one side)
Stroke length (L) of plate glass reciprocating movement: 150 mm
Polishing tape width: 30mm
Abrasive tape pressure (thrust): 15N

  GC (green carborundum) # 4000 (SiC: average abrasive grain size 3 μm) was used as the polishing tape, and a foamed resin pad having a Shore A hardness of 30 was used as the pad member. The number of round trips of the plate glass was 21 passes.

Example 2
In the manufacturing method of Example 2, GC # 6000 (average abrasive grain size 2 μm) was used as the polishing tape. The number of round trips of the plate glass was 24 passes. Other conditions were the same as in Example 1.

Example 3
In the manufacturing method of Example 3, GC # 10000 (average abrasive grain size 0.5 μm) was used as the polishing tape. As the pad member, a rubber plate having a Shore A hardness of 80 and a foamed resin plate having a Shore A hardness of 30 were used. The number of round trips of the plate glass was 31 passes. Other conditions were the same as in Example 1.

Comparative Example 1
In the manufacturing method of Comparative Example 1, GC # 1000 (average abrasive grain size 16 μm) was used as the polishing tape. The number of round trips of the plate glass was 7 passes. Other conditions were the same as in Example 1.

Comparative Example 2
In the manufacturing method of Comparative Example 2, GC # 2000 (average abrasive grain size 9 μm) was used as the polishing tape. The number of round trips of the plate glass was 11 passes. Other conditions were the same as in Example 1.

Comparative Example 3
In the manufacturing method of Comparative Example 3, GC # 3000 (average abrasive grain size 5 μm) was used as the polishing tape. The number of round trips of the plate glass was 17 passes. Other conditions were the same as in Example 1.

Comparative Example 4
In the manufacturing method of Comparative Example 4, a grindstone 500 in which diamond abrasive grains having a mesh size of # 1000 (average particle diameter of 14 to 22 μm) were metal bonded was used. As shown in FIG. 11, the ridges on the main surfaces (upper surface and lower surface) of the grindstone and the plate glass were arranged, and the chamfering of the ridges was performed by rotating the grindstone.

  Table 1 below shows the average surface roughness Ra and the maximum valley depth Rv of the roughness curve and the examples polished and polished as described above. The average surface roughness Ra and the maximum valley depth Rv were measured with a surface roughness meter (product name NewView 5000: manufactured by Zygo).

  By the manufacturing method of Examples 1 to 3, a plate glass in which a portion to be polished is formed on a highly accurate finished surface (average surface roughness Ra: 1.7 nm to 11.5 nm, maximum valley depth Rv: 32 nm to 162 nm) Obtained. The number of reciprocating passes was about 20 to 30, and the polishing rate was sufficient. As for the finishing surface of the plate glass by the manufacturing method of a comparative example, there were many whose maximum valley depth exceeded 1000 nm.

  The enlarged photograph of the finished surface of an Example and a comparative example is shown by FIG. The left side is an optical photograph by a digital microscope (product name VHX500: manufactured by KEYENCE), and the right side is a surface roughness meter (product name NewView 5000: manufactured by Zygo). (A) is Comparative Example 1, (B) is Comparative Example 2, (C) is Example 1, and (D) is the finished surface according to Example 3.

  (A) and (B) according to the comparative example were insufficient as surface properties of the finished surface with many surface irregularities. (C) and (D) according to the examples had a highly accurate finished surface free from irregularities and scratches, and were excellent in edge portion linearity. By using the polishing tape, the finished surface had a curved surface.

  FIG. 13 is an enlarged photograph of the finished surface of the plate glass obtained by the manufacturing method of Comparative Example 4. There were polishing marks (wheel marks) on the surface, and many scratches were seen. As a result of polishing with a grindstone, the finished surface was not formed into a curved surface.

  The edge strength (MPa) of each plate glass of the example and the comparative example was measured. Edge strength refers to the strength of the edge of the glass. The edge strength was measured using a commercially available four-point bending tester based on a room temperature bending strength test method (JIS R1601). An edge strength test (four-point bending) method is schematically shown in FIG. The test was performed under the conditions of a load jig interval of 10 mm, a support jig interval of 30 mm, and a load speed of 5 mm / min.

  Table 1 lists the values obtained by averaging ten edge glasses obtained by testing ten plate glasses of Examples and Comparative Examples. The plate glass formed on the finished surface by polishing the edge using a polishing tape containing fine abrasive grains on the surface by the polishing apparatus according to the present invention has an average surface roughness Ra and a maximum valley depth of the finished surface. As a result of being able to significantly reduce the Rv value, the edge strength was improved by 3 times or more as compared with the processing with the conventional grindstone. Thus, since the plate glass according to the present invention has significantly improved edge strength, it can prevent the plate glass from being damaged by mechanical stress or heat shock in the manufacturing process of the product using the plate glass. It is. Moreover, it is difficult to break even after the plate glass is incorporated into the product, and the reliability of the product can be improved.

Example 4
The corner | angular part of plate glass was grind | polished using the grinding | polishing apparatus which concerns on this invention. The plate glass used in advance was subjected to predetermined R-shaped processing (rough polishing) with a grindstone. The same abrasive tape as in Example 1 was used. The pressure was 1N and the number of reciprocations was 5 passes.

Example 5
The corners of the plate glass that was not coarsely polished (as sliced) were polished. The polishing tape used was the same polishing tape as in Example 1 after R-shaped processing (coarse polishing) with D # 600 (30 μm).

  Even in Examples 4 and 5, a highly accurate finished surface (average surface roughness Ra: about 1.5 nm to 12 nm, maximum valley depth Rv: about 30 nm to 165 nm) was obtained.

  Those skilled in the art will appreciate that many different modifications are possible without departing from the spirit and aspects of the invention. Accordingly, it goes without saying that the embodiments of the present invention are merely examples, and do not limit the scope of the present invention.

W Work T Polishing tape A Polishing axis 1 Polishing device 2 Base 10 Work stand 1
20 Work Transfer Unit 30 First Polishing Unit 40 Second Polishing Unit 50 Work Place 2
300 Abrasive tape unit 1
300 'polishing tape unit 2
350 Work unit 1
400 work unit 2

Claims (21)

A polishing apparatus for polishing a peripheral portion of a work using a polishing tape,
A first polishing section having a horizontal first polishing axis for polishing a linear portion to be polished at the peripheral edge of the workpiece;
A second polishing section having a horizontal second polishing axis for polishing a non-linear portion to be polished at the peripheral edge of the workpiece,
The first polishing unit has a first work unit for holding the work, and at least one of the first polishing tapes facing the first work unit across the first polishing axis. A first polishing tape unit for disposing the surface of the part,
The second polishing unit has a second work unit for holding the work and at least one second polishing tape facing the second work unit across the second polishing axis. A second polishing tape unit for disposing the surface of the part,
In the first polishing portion, the surface of the arranged first polishing tape defines a first polishing surface, and the linear portion to be polished and the first polishing surface are in contact with each other. Polishing is performed by relative movement in the polishing axis of 1,
In the second polishing portion, the surface of the second polishing tape disposed defines a second polishing surface, and the non-linear polished portion and the second polishing surface are in contact with each other. Polishing is performed by relative movement in the second polishing axis.
A polishing apparatus characterized by that. The workpiece is made of plate glass,
In the first polishing portion, the linear portion to be polished and the first polishing surface are linear portions to be polished at the peripheral portion of the plate glass, and the average surface roughness Ra is 200 nm or less and the maximum Relative movement so that the valley depth Rv is 20 nm or less,
In the second polishing portion, the non-linear polished portion and the second polishing surface are non-linear polished portions at the peripheral edge of the plate glass, and the average surface roughness Ra is 20 nm or less, And relative movement so that the maximum valley depth Rv is 200 nm or less.
The polishing apparatus according to claim 1. The first work unit is
A first work holding table for holding the work;
Rocking means for rocking the first work holder along the first polishing axis.
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The second work unit is on a horizontal base,
An X-direction movable stage provided to be movable in a horizontal direction and a direction (X direction) perpendicular to the second polishing axis;
A Y-direction movable stage provided so as to be movable in a direction parallel to the second polishing axis (Y-direction), and a Y-direction movable stage integrally having a groove extending in the X-direction;
A second work holding table horizontally supported rotatably by a first vertical shaft provided integrally with the X-direction movable stage,
The second workpiece holding table is a second vertical axis extending vertically from the surface of the second workpiece holding table, and is slidably positioned in the groove portion of the Y-direction movable stage. With a vertical axis of
The workpiece is held on the second workpiece holder;
The non-linear polished portion swings along the second polishing axis while swinging by the movement of the first vertical axis and the second vertical axis.
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first polishing tape unit has first polishing tape moving means for moving the first polishing surface in a horizontal direction and a direction perpendicular to the first polishing axis, whereby the straight line A portion to be polished and the first polishing surface can abut on the first polishing axis,
The second polishing tape unit includes second polishing tape moving means for moving the second polishing surface in a horizontal direction and a direction perpendicular to the second polishing axis, thereby At least a part of the straight portion to be polished and the second polishing surface can abut on the second polishing axis;
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first polishing tape unit includes first tilting means for tilting a longitudinal axis of the first polishing surface with respect to the first polishing axis;
The second polishing tape unit includes second tilting means for tilting the longitudinal axis of the second polishing surface with respect to the second polishing axis;
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first polishing tape unit includes first rotating means for rotating the first polishing surface about the first polishing axis;
The second polishing tape unit includes second rotating means for rotating the second polishing surface about the second polishing axis;
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first work unit includes a work moving means for moving the work in a horizontal direction and a direction perpendicular to the first polishing axis.
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first work unit includes first work fixing means for pressing and fixing the work and / or adsorbing and fixing;
The second work unit includes second work fixing means for pressing and fixing the work and / or adsorbing and fixing the work.
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that The first polishing tape unit includes a first polishing tape running means for running the first polishing tape;
The second polishing tape unit includes second polishing tape running means for running the second polishing tape;
The polishing apparatus according to claim 1, wherein the polishing apparatus is characterized in that A polishing apparatus having a horizontal polishing axis for polishing a linear portion to be polished at a peripheral edge of a work using a polishing tape,
A work unit for holding the work;
A polishing tape unit for disposing at least a part of the surface of the polishing tape across the polishing axis and facing the work unit;
The surface of the arranged polishing tape defines a polishing surface, and polishing is performed by the relative movement in the polishing axis in contact with the linear portion to be polished and the polishing surface.
A polishing apparatus characterized by that. The workpiece is made of plate glass,
The work unit is
A work holding table for holding the work;
Rocking means for rocking the workpiece holding table along the polishing axis,
The linear portion to be polished and the polishing surface form a linear portion to be polished at the peripheral edge of the plate glass so that the average surface roughness Ra is 20 nm or less and the maximum valley depth Rv is 200 nm or less. Move relative to
The polishing apparatus according to claim 11. The polishing tape unit is
A polishing tape moving means for moving the polishing surface in a horizontal direction and a direction perpendicular to the polishing axis, whereby the linear portion to be polished and the polishing surface abut on the polishing axis. Abrasive tape moving means capable of
Inclining means for inclining the longitudinal axis of the polishing surface with respect to the polishing axis;
Rotation means for rotating the polishing surface about the polishing axis,
The polishing apparatus according to claim 11 or 12, characterized in that: The work unit includes a work moving means for moving the work in a horizontal direction and a direction perpendicular to the polishing axis.
The polishing apparatus according to claim 11 or 12, characterized in that:   A polishing tape used in the polishing apparatus according to claim 11. A polishing apparatus having a horizontal polishing axis for polishing a non-linear portion to be polished at a peripheral edge of a workpiece using a polishing tape,
A work unit for holding the work;
A polishing tape unit for disposing at least a part of the surface of the polishing tape across the polishing axis and facing the work unit;
The surface of the arranged polishing tape defines a polishing surface, and polishing is performed by the relative movement in the polishing axis line in contact with the non-linear polished portion and the polishing surface.
A polishing apparatus characterized by that. The workpiece is made of plate glass,
The work unit is on a horizontal base,
An X-direction movable stage provided so as to be movable in a horizontal direction and a direction (X direction) perpendicular to the polishing axis;
A Y-direction movable stage provided so as to be movable in a direction (Y direction) parallel to the polishing axis, the Y-direction movable stage integrally having a groove extending in the X direction;
A workpiece holder that is horizontally supported rotatably by a first vertical shaft provided integrally with the X-direction movable stage,
The work holding table has a second vertical axis that extends vertically from the surface of the work holding table, and is slidably positioned in the groove of the Y-direction movable stage. ,
The workpiece is held on the workpiece holder;
The non-linear polished portion swings along the polishing axis while swinging by the movement of the first vertical axis and the second vertical axis,
The non-linear portion to be polished and the polishing surface form a non-linear portion to be polished at the peripheral edge of the plate glass with an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm or less. Move relative to
The polishing apparatus according to claim 16.   18. A polishing tape used in the polishing apparatus according to claim 16 or 17, wherein abrasive grains are fixed to a base film with a resin binder, wherein the abrasive grains have a particle size of 0.2 μm or more and 3 μm. Abrasive tape in the following range. A method for polishing a peripheral portion of a workpiece using the apparatus according to claim 11 so as to improve the strength of the workpiece made of plate glass,
Polishing is performed by polishing a linear portion to be polished at the peripheral edge of the workpiece using a polishing tape, and forming the portion to be polished to have an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm or less. Process,
The polishing tape is formed by fixing abrasive grains to a base film with a resin binder,
The grain size of the abrasive grains is in the range of 0.2 μm or more and 3 μm or less.
Polishing method. A method for polishing a peripheral portion of a workpiece so as to improve the strength of the workpiece made of plate glass using the apparatus according to claim 16,
A non-linear portion to be polished at the periphery of the workpiece is polished using a polishing tape, and the portion to be polished is formed to have an average surface roughness Ra of 20 nm or less and a maximum valley depth Rv of 200 nm or less. Polishing process,
The polishing tape comprises a base material and abrasive grains fixed to the base material with a binder resin,
The grain size of the abrasive grains is in the range of 0.2 μm or more and 3 μm or less.
Polishing method.   A plate glass in which at least a part of a peripheral edge is polished by the polishing method according to claim 19 or 20.