CN103831705A - Polishing apparatus and method for polishing peripheral edge of workpiece, such as glass plate, by polishing tape - Google Patents
Polishing apparatus and method for polishing peripheral edge of workpiece, such as glass plate, by polishing tape Download PDFInfo
- Publication number
- CN103831705A CN103831705A CN201310245364.1A CN201310245364A CN103831705A CN 103831705 A CN103831705 A CN 103831705A CN 201310245364 A CN201310245364 A CN 201310245364A CN 103831705 A CN103831705 A CN 103831705A
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- workpiece
- lapping
- axis
- lapping tape
- grinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/22—Accessories for producing a reciprocation of the grinding belt normal to its direction of movement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Abstract
The invention provides a polishing apparatus and method for polishing the peripheral edge of a workpiece, such as a glass plate, by a polishing tape in a highly-precise manner. The polishing apparatus comprises a first polishing part being used for polishing a straight part to be polished of the peripheral edge of the workpiece and having a first polishing axle which is horizontal; and a second polishing part being used for polishing a non-straight part to be polished of the peripheral edge of the workpiece and having a second polishing axle which is horizontal. Each of the first and second polishing parts comprises a workpiece unit used for holding the workpiece and a polishing tape unit disposed opposite to the workpiece unit across the polishing axle and used for configuring at least a part of the surface of the polishing tape, and the surface of the configured polishing tape divides multiple polishing faces. The straight part to be polished and the corresponding polishing face move relatively on the corresponding polishing axle in a contacting manner, and the non-straight part to be polished and the corresponding polishing face move relatively on the corresponding polishing axle in a contacting manner. In this way, the polishing is conducted.
Description
Technical field
The present invention relates to device and Ginding process that the workpiece such as glass plate to using grinds in cloche, the optical light filter etc. of the flat-panel screens such as mobile phone display window, liquid crystal panel, organic EL panel, plasma panel, solar panel and electronic component-use.Relate in particular to the lapping device and the Ginding process that use lapping tape to grind accurately the circumference of the workpiece such as glass plate.
Background technology
In recent years, the market of smart mobile phone, plate terminal etc. continues to expand.These electronic equipments mostly are the equipment that display exposes, and easily cause scar in the time dropping or collide.About the size of display, for example, smart mobile phone is 5 inches of left and right, and plate terminal is 6 inches～10 inches left and right, and functional mobile phone is 3 inches of left and right (transverse and longitudinal size ratio is generally the transverse and longitudinal ratio of 4: 3, is 16: 9 in the situation of widescreen).The demand of the cap assembly of the display of using for the protection of such electronic equipment continues to increase.
As the material of the cap assembly of display (display of basic display unit, slave display, camera etc.), replace the acrylic resin or the Merlon that on one side (or two-sided), apply the scratch resistance of cured film in the past, the employing of cloche in recent years increases, and makes the intensity raising of this cloche become technical task.
Glass is high-strength material (1000～2000kg/mm in theory
2), but the lower (3～20kg/mm of actual strength
2).Its reason is more, on the surface of glass etc., there is (wounds of diving) such as fine scar that naked eyes cannot observe, crackle, breaches (chipping), concentrate when produce stress in the time that effect on glass has tensile stress, thereby become damaged reason.
In order to improve the intensity of glass, various physical methods (surperficial quench etc.) and chemical method (chemical etching processing, ion-exchange etc.) are designed, in the situation that adopting these intensifying methods, importantly eliminate the fine scar of the glass that becomes Breakage Reasons.
About cloche, be generally that the glass blanket as material is cut into given size, and it is implemented various processing and is manufactured.On the end face as tangent plane of glass blanket, be formed with fine scar or crackle etc.In order to eliminate so fine scar that is formed at end face, eliminate the chamfering (light chamfering) in rib portion and bight.
In chamfering, grind the so-called C chamfering of the limit portion (boundary portion of end face and upper surface or lower surface) of the glass plate of regulation shape (rectangle etc.), or, grind the so-called R chamfering in bight (boundary portion of end face and adjacent face) etc.
In the past, C chamfering and R chamfering were used to the grinding-materials such as emery wheel, especially, in R chamfering, for example, needed grinding-material corresponding to shape according to R shape (, R1, R10 etc.), be difficult to form accurately the shape of grinding-material.In addition, be difficult to grind programming and be difficult to maintain, improve the quality by grinding the face that is polished forming.
In the past, by making the roughly disc face of discoid abrasive grinding wheel tilt and press only to remove the C chamfer machining (patent documentation 1: TOHKEMY 2000-233351 communique) of rib portion to the rib portion of glass plate.In addition, on the end face of abrasive grinding wheel, inclined plane is set, by this inclined plane is pressed only to remove the C chamfer machining (patent documentation 2: TOHKEMY 2003-231046 communique, patent documentation 3: TOHKEMY 2011-51068 communique) of rib portion to the rib portion of glass plate.
In addition, on the end face of abrasive grinding wheel, form the recess of circular-arc recess or desired shape, the end surface shape of the end face profile copy grinding emery wheel of glass plate is removed, R chamfer machining or be shaped processing (patent documentation 4: TOHKEMY 2002-59346 communique, patent documentation 5: TOHKEMY 2001-85710 communique).
In chamfer machining in the past as described above, as abrasive grinding wheel, use and metal dust is assembled to sintering and be fixed with skive diamond abrasive grain, metal bonding etc., use the different emery wheel (wheel) of grit size to carry out time processing and secondary operations.In time processing, use and adopted sieve aperture (mesh) to be of a size of the emery wheel of the diamond particles of #325～#600, the average surface roughness Ra of the glass plate end edge portion after processing is generally in the scope of 0.5 μ m～1.0 μ m.In order to reduce this surface roughness, in secondary operations, the fine finishining emery wheel that be shaped, that adopted the diamond particles that screen size is #1000～#2000 that uses the emery wheel identical cross-sectional shape used with time processing.
In addition, replace the skive of metal bonding as described above, proposition has the chamfering abrasive wheel of the fiber construct that is filled with resin between fiber, or disposes the chamfering abrasive wheel (patent documentation 6: TOHKEMY 2002-160147 communique) that screen size is the resin structure of the grinding such as carborundum, the aluminium oxide abrasive particle of #500～#2000.Limit makes this chamfering abrasive wheel (wheel) rotation, limit that emery wheel circumference that cross section is formed as concavity is pressed to the end face of glass for liquid crystal display plate etc., processes thus.Grind uniformly unevenly in order not produce processing, chamfering abrasive wheel uses with respect to the mode of the vertical line inclination predetermined angular vertical with the surface of glass plate with rotating shaft.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2000-233351 communique
Patent documentation 2: TOHKEMY 2003-231046 communique
Patent documentation 3: TOHKEMY 2011-51068 communique
Patent documentation 4: TOHKEMY 2002-59346 communique
Patent documentation 5: TOHKEMY 2001-85710 communique
Patent documentation 6: TOHKEMY 2002-160147 communique
Summary of the invention
When emery wheel as described above (wheel) is pressed and limit makes its rotation limit while carrying out chamfering to the end edge portion of glass plate, there is the problem that pore stops up and emery wheel weares and teares gradually of emery wheel.If because pore stops up and wearing and tearing cause the deterioration such as shape of the processing department of emery wheel, produce grinding scar at the circumference of glass plate, and because emery wheel and a part for the circumference of glass plate do not contact the undressed portion (processing is uneven) that produces, in addition, there is the situation that produces burn etc. due to the inequality of tonnage.
In the case of the shape of the processing department of emery wheel etc. worsens, although can repair (dressing) and refine (truing), but for skive, high forming accuracy is absolutely necessary, because the position adjustment of finishing etc. and emery wheel needs the time, therefore operating efficiency is low.In addition, due to need to emery wheel also remaining have under the states that do not use in a large number region, carry out the finishing etc. of processing department or carry out the replacing of emery wheel according to service life, therefore, exist cost to increase this problem.
In addition, in the time using emery wheel to carry out the chamfering of circumference of glass plate, exist and can apply mechanical collision when by emery wheel and machining object butt, glass plate, because breakage occurs in this collision, causes processed finished products rate to worsen this problem.
With the chamfering abrasive wheel (patent documentation 6) of the lower resin structure of the skive phase specific rigidity of metal bonding etc. in, the collision of the end edge portion to glass plate reduces, the generation of breach and scar reduces.But, the wearing and tearing aggravation of emery wheel, thus the quickening of the change of shape of processing department has also caused pore obstruction, therefore, has high this problem of finishing (or refine) frequency of emery wheel.In addition, there are the following problems: the abrasive dust of emery wheel is attached on the workpiece such as glass plate, needs decontaminating apparatus and clean operation, or install that self is dirty, and therefore device is safeguarded and expended time in.
For example, and in recent years, demand continues the thickness attenuation (, 1mm is following) of the cloche for display (glass plate) expanding, and requires more accurately circumference (rib portion and bight) to be carried out to chamfer machining.At use abrasive grinding wheel in the past, the circumference of glass plate is carried out chamfering, the precision of the machined surface obtaining is inadequate, and at the residual fine scar of circumference or breach, thereby cannot improve by grinding the intensity of glass plate.
In view of the above problems, the object of the present invention is to provide a kind of lapping device, use the circumference (limit portion, bight etc.) of lapping tape to workpiece such as glass plates to grind, can process accurately.In addition, provide a kind of lapping device, can use lapping device and lapping tape to grind the circumference of the workpiece with various shapes.
In addition, the object of the present invention is to provide a kind of Ginding process circumference of glass plate being ground accurately in order to improve the intensity of glass plate.And provide by the method and grind and glass plate that intensity has improved.
Solve the lapping device of a mode of the present invention of above-mentioned problem, for using lapping tape to grind the circumference of workpiece, it is characterized in that, comprising: the 1st grind section, the straight line of its circumference to workpiece is polished part and grinds, and has the 1st grinding axis of level; With the 2nd grind section, the non-rectilinear of its circumference to workpiece is polished part and grinds, and has the 2nd grinding axis of level, and the 1st grind section comprises: for the 1st work cell of holding workpiece; With to grind axis across the 1st relative with the 1st work cell and for configuring the 1st lapping tape unit at least a portion surface of the 1st lapping tape, the 2nd grind section comprises: for the 2nd work cell of holding workpiece; With to grind axis across the 2nd relative with the 2nd work cell and for configuring the 2nd lapping tape unit at least a portion surface of the 2nd lapping tape, in the 1st grind section, the surface of the 1st lapping tape configuring marks off the 1st abradant surface, straight line is polished part and the 1st abradant surface grinds on axis and relatively moves the 1st contiguously, grind thus, in the 2nd grind section, the surface of the 2nd lapping tape configuring marks off the 2nd abradant surface, non-rectilinear is polished part and the 2nd abradant surface grinds on axis and relatively moves the 2nd contiguously, grinds thus.
By forming in the above described manner, can use the straight line of the circumference of lapping tape to workpiece to be polished the bight that part, the limit portion (rib portion) of glass plate of for example rectangle and the non-rectilinear of the circumference of workpiece be polished the glass plate of part, for example rectangle by lapping device and grind.In addition, by forming in the above described manner, for example, can be by the 1st lapping tape and the 2nd lapping tape (can be identical) be configured on lapping device, for example, the part that is polished to various shapes (, rectilinear form and have the shape of regulation curvature) is ground.The circumference that lapping device of the present invention can be the sheet workpiece below 1mm to thickness grinds accurately.Workpiece can be glass plate, can be also the plate that the crystalline materials such as silicon form.The present invention especially in the intensity in order to improve the plate being formed by the crystalline material enbrittling, circumference is ground aspect effective.Workpiece can be the plate being made up of the crystalline material not enbrittling, and can be also the plate being made up of the metal material such as stainless steel or aluminium.
Lapping device of the present invention is preferably, and in order to carry out Automatic continuous grinding in the scope from the 1st grind section to the 2 grind section, can comprise workpiece supply unit.Workpiece supply unit is preferably, and has the upper surface for adsorbing workpiece and the arm mechanism carried.The arm mechanism of workpiece supply unit also rotates and configures workpiece in work cell.For example, as shown in figure 15, about the workpiece W of rectangle, the foursquare cornerwise intersection point that is center C 1 or the minor face that comprises workpiece by cornerwise intersection point of workpiece is centered by center C 2, makes workpiece rotation (each 90 degree, or each 180 degree).By thering is workpiece supply unit, for example, can grind continuously and automatically the circumference entirety of the workpiece including four end faces of the workpiece of rectangle (or eight limits of upper surface, lower surface) and four bights.
Lapping device of the present invention is preferably, and the circumference of the workpiece being made up of glass plate is ground.In the time that the circumference of the workpiece being made up of glass plate is ground, in the 1st grind section of lapping device, straight line is polished part and the 1st abradant surface relatively moves, be formed as to make the straight line of circumference of glass plate be polished part, average surface roughness Ra is below 20nm, and maximum valley depth Rv is below 200nm, in the 2nd grind section of lapping device, non-rectilinear is polished part and the 2nd abradant surface relatively moves, be formed as to make the non-rectilinear of circumference of glass plate be polished part, average surface roughness Ra is below 20nm, and maximum valley depth Rv is below 200nm.
Lapping device of the present invention is configured to, and the circumference of glass plate is ground to improve to the mechanical strength of glass plate.As shown in figure 16, (A) recess forming in the time that the circumference (rib portion, bight) of first type surface (upper surface, lower surface) and end face has cutting blanket as the glass plate W of grinding charge and protuberance and (B) crackle etc.The sharp-pointed protuberance that is formed at rib portion becomes the starting point of breach, and crackle becomes the starting point of the destruction of glass plate.Lapping device of the present invention grinds circumference accurately so that crackle producing while manufacturing glass plate etc. can not be expanded and be eliminated, thereby has improved the intensity of glass plate.In order to form the high-precision surface characteristic of the intensity that can improve glass plate, abradant surface is made up of, can not make abradant surface and be polished part to relatively move in the mode that is polished part formation scar or breach lapping tape.
Particularly, the 1st work cell comprises: the 1st workpiece for holding workpiece keeps platform; With for making the 1st workpiece keep platform to grind the swing mechanism of axis oscillating along the above-mentioned the 1st.
In lapping device of the present invention, by make straight line be polished part with respect to static abradant surface flatly, move back and forth (swing) with predetermined stroke and grind.By making work cell miniaturization, lighting, and configure balancer etc., can reduce the vibration while swing.Thus, can reduce the generation of the scar of the face that is polished being caused by vibration, can be accurately on face, carry out fine finishining level and smooth being polished.Can be, the position of abradant surface be static, and the lapping tape that forms abradant surface moves.
In lapping device of the present invention, the scope (stroke) that the abradant surface (relatively) of maintained glass plate and lapping tape unit swings by workpiece holding unit is preferably the scope at positive and negative 1～200mm.Thus, be difficult to produce the deviation (limit of collapsing) of amount of grinding.
In addition, the 2nd work cell comprises on the pedestal of level: directions X movable stage, its with can along continuous straight runs and along and the 2nd grind the mobile mode of direction (directions X) that axis is vertical and arrange; Y-direction movable stage, it is for can be along the Y-direction movable stage arranging with the mobile mode of the direction (Y-direction) of the 2nd grinding shaft line parallel, and has integratedly the slot part extending along directions X; Keep platform with the 2nd workpiece, its by being arranged on integratedly the 1st vertical axis on directions X movable stage by horizontal supporting rotatably, the 2nd workpiece keeps platform to have the 2nd vertical axis, the 2nd vertical axis is the 2nd vertical axis that keeps the surface of platform vertically to extend from the 2nd workpiece, and can be positioned at slidably the above-mentioned slot part of above-mentioned Y-direction movable stage, workpiece remains on above-mentioned the 2nd workpiece and keeps on platform, the non-rectilinear portion of being polished is by the movement of the 1st vertical axis and above-mentioned the 2nd vertical axis, and limit is carried out yaw motion edge the above-mentioned the 2nd and ground axis oscillating.
In the 2nd grind section, also carry out yaw action limit with respect to static abradant surface at horizontal plane inner edge and move back and forth to grind with predetermined stroke by making non-rectilinear be polished part.Now, yaw motion can be determined according to (or wishing the curvature forming) such as being polished curvature partly, the reciprocating track of level is with to grind axis consistent, therefore, can make non-rectilinear be polished part limit and smooth abradant surface grinds on butt limit successively.
Preferably the position of two vertical axis is by servomotor etc. and by Synchronization Control.By synchronously controlling the position x of directions X of the 1st vertical axis and the position x ' of the directions X of the 2nd vertical axis, the position y of Y-direction, can make the non-rectilinear such as bight of glass plate be polished part and be formed as desired R shape (for example, R1, R10 etc.).
Even preferably a kind of lapping tape, also can grind the part that is polished with various curvature.Do not need to make grinding-material (emery wheel etc.) according to R shape, can in cutting down cost, form high-precision polished surface in the bight of workpiece.
In addition, the 1st lapping tape unit has the 1st lapping tape travel mechanism for making the 1st abradant surface along continuous straight runs and moving along the direction vertical with the 1st grinding axis, thus, straight line is polished part and the 1st abradant surface can grind butt on axis the above-mentioned the 1st, the 2nd lapping tape unit has the 2nd lapping tape travel mechanism for making the 2nd abradant surface along continuous straight runs and moving along the direction vertical with the 2nd grinding axis, thus, non-rectilinear is polished part at least a portion and the 2nd abradant surface can grind butt on axis the 2nd.
By thering is detent mechanism as described above, for example, can make the limit portion entirety of workpiece of rectangle grinding on axis and smooth abradant surface butt, can carry out not only having an end in contact, grind uniformly.In addition, due to the mechanical collision that can suppress any of workpiece, thus also can suppress the generation of breach and be present in the expansion of the crackle on workpiece, thus the high-precision grinding that can improve the breakdown strength of workpiece.In addition, the intensity of each workpiece does not have deviation, can stabilizing quality.
And, lapping device of the present invention is characterised in that, the 1st lapping tape unit comprises the 1st leaning device that the length axes for making the 1st abradant surface tilts with respect to the 1st grinding axis, and the 2nd lapping tape unit comprises the 2nd leaning device that the length axes for making the 2nd abradant surface tilts with respect to the 2nd grinding axis.
Lapping tape of the present invention unit preferably have relatively configure with work cell, with the polishing pad of grinding shaft line parallel, the surface that (can movably) be disposed at the lapping tape on this polishing pad marks off for the abradant surface that part is ground that is polished to workpiece.The lapping tape being disposed on polishing pad has Rack and length, and has the axis (length axes) of length direction.This length axes is identical with moving direction in the time that lapping tape moves.This length axes can be consistent with grinding axis, also can tilt with respect to grinding axis.
Can make the length axes of the abradant surface for example θ degree that tilts.In the situation that abradant surface is vertical guide, θ degree is angle of inclination with respect to the horizontal plane.
The lapping tape that marks off abradant surface has Rack.In addition, there is the situation with fixing speed continuous moving.In the time making the length axes level of lapping tape, for example, less with the abradant surface (lapping tape) of the limit portion butt of the linearity of the workpiece of level, grind and just use the amount of the lapping tape finishing and collected to increase.Lapping device of the present invention has the mechanism that the length axes of abradant surface is tilted, and therefore aspect cost, has superiority.; tilt with respect to grinding axis by the length axes (being moving direction while movement) that makes abradant surface; (the preferred whole surface) in a big way that can effectively use lapping tape, can reduce operating cost (cost of lapping tape).According to the length of the limit portion of the workpiece such as glass plate, can determine the angle θ of inclination in for example scope of 0 degree < θ≤90 degree.The workpiece such as the different glass plate of size can be tackled with the lapping tape of fixed width, thereby the structure of lapping tape unit can be simplified.Using when multiple lapping tapes unit, uniform specification, can reduce the manufacturing cost of lapping tape unit.In addition, owing to tackling in various workpieces (glass plate etc.) with a kind of lapping tape, so without to each workpiece replacing lapping tape, can reduce duty cycle.Owing to can reducing the kind of lapping tape, so easily carry out stock control (bad stock's minimizing is concentrated and bought band of the same race and bring volume discount etc.).Use lapping tape in a narrow margin, can make lapping tape lighting, the exchanging operation of band becomes easy.In addition, can use the multiple glass plates of lapping tape simultaneous grinding of fixed width, thereby can seek the further minimizing of duty cycle.
And the 1st lapping tape unit comprises the 1st rotating mechanism for the 1st abradant surface is rotated centered by the 1st grinding axis, the 2nd lapping tape unit comprises for making the 2nd abradant surface grind by the 2nd the 2nd rotating mechanism rotating centered by axis.
Lapping device of the present invention can by abradant surface vertical configure, in addition, can make abradant surface rotate centered by the axis pivot center of grinding shaft line parallel (or with) and tilt with respect to vertical guide to grind.Thus, can carry out the grinding of C face to the straight line portion of workpiece.Due to lapping tape unit rotational, so can carry out desired C face grinding to being flatly fixed on the upper surface of the workpiece in work cell and the limit portion of lower surface.Work cell does not need to make workpiece inclination etc., can simplified structure.The abradant surface of lapping tape unit is preferably by the scope of grinding the angle [alpha] of rotating centered by axis, when the abradant surface take parallel with vertical guide is when 0 spends, is 90 degree (now, abradant surface level) on above-below direction to the maximum.
Or lapping tape unit can not have rotating mechanism.In this situation, for a limit portion (rib portion) of the upper surface (or lower surface) to workpiece such as the glass plates of flatly placing carries out the grinding of C face, the abradant surface of lapping tape unit can be fixed with for example state of 45 degree that tilts with respect to vertical guide (or horizontal plane), thereby be formed lapping tape unit.
And lapping device of the present invention is characterised in that, the 1st work cell comprise for make workpiece along continuous straight runs and along and the 1st grind the workpiece movable mechanism that direction that axis is vertical moves.Thus, straight line be polished part and abradant surface can be on grinding axis butt reliably.
And, lapping device of the present invention is characterised in that, the 1st work cell comprises that, for pushing and the 1st workpiece fixed mechanism fixation workpiece and/or absorption fixation workpiece, the 2nd work cell comprises for pushing and the 2nd workpiece fixed mechanism fixation workpiece and/or absorption fixation workpiece.
Being placed on the workpiece that the workpiece such as glass plate in work cell (the 1st, the 2nd) are fixed on work cell before actual milled processed keeps on platform.As fixed mechanism, preferably use attraction and pushing force.The workpiece such as glass plate can be pushed from top and be fixed by fixed head etc., also can are fixed on and be kept on platform by vacuum suction method etc.Keeping the surface of platform and the back side of fixed head to paste the flexure strips such as dry goods or rubber, to make can not produce scar at upper surface and the lower surface of the workpiece such as glass plate.
Pushing upper surface adsorbs lower surface simultaneously, thus, with high confining force, workpiece is remained on to workpiece and keeps on platform.In milled processed, can make glass plate also can not grind expeditiously movably in the time of the abradant surface pushing that is polished tape cell.
In addition, lapping device of the present invention is characterised in that, the 1st lapping tape unit comprises the 1st lapping tape travel mechanism for the 1st lapping tape is moved, and the 2nd lapping tape unit comprises the 2nd lapping tape travel mechanism for the 2nd lapping tape is moved.
The lapping device of other modes of the present invention is the lapping device that the straight line for using the circumference of lapping tape to workpiece is polished part grinding axis that grind, that have level, it is characterized in that, comprising: for the work cell of holding workpiece; With relative with work cell and for configuring the lapping tape unit at least a portion surface of lapping tape across grinding axis, the surface of the lapping tape configuring marks off abradant surface, straight line is polished part and abradant surface relatively moves contiguously on grinding axis, grinds thus.
In addition, it is characterized in that, workpiece is made up of glass plate, and work cell comprises: the workpiece for holding workpiece keeps platform; With for making workpiece keep platform along grinding the swing mechanism of axis oscillating, straight line is polished part and abradant surface relatively moves, be formed as to make the straight line of circumference of glass plate be polished part, average surface roughness Ra is that the following and maximum valley depth Rv of 20nm is below 200nm.
And, it is characterized in that, lapping tape unit comprises: lapping tape travel mechanism, and it is the lapping tape travel mechanism for making abradant surface along continuous straight runs and moving along the direction vertical with grinding axis, thus, straight line be polished part and above-mentioned abradant surface can grinding axis on butt; Leaning device, it tilts with respect to grinding axis for making the length axes of abradant surface; And rotating mechanism, it for rotating abradant surface centered by grinding axis.
And work cell comprises the workpiece movable mechanism for workpiece is moved to horizontal direction and to the direction vertical with grinding axis.
By forming in the above described manner, the straight line that can become the limit portion etc., the workpiece that use the glass plate of lapping tape to rectangle is polished part and carries out the lapping device that desired C face grinds.Limit portion or the end face that can become glass plate in addition, grind the lapping device of the intensity that improves glass plate accurately.
The lapping device of another other modes of the present invention is the lapping device that the non-rectilinear for using the circumference of lapping tape to workpiece is polished part grinding axis that grind, that have level, it is characterized in that, comprising: for the work cell of holding workpiece; With relative with work cell and for configuring the lapping tape unit at least a portion surface of lapping tape across grinding axis, the surface of the lapping tape configuring marks off abradant surface, non-rectilinear is polished part and abradant surface relatively moves contiguously on grinding axis, grinds thus.
In addition, it is characterized in that, workpiece is made up of glass plate, and work cell has on the pedestal of level: directions X movable stage, and it is can along continuous straight runs and edge direction (directions X) the mobile mode vertical with grinding axis arranging, Y-direction movable stage, it is for can be along the Y-direction movable stage arranging with the mobile mode of the direction (Y-direction) of grinding shaft line parallel, and has integratedly the slot part extending along directions X, keep platform with workpiece, its by being arranged on integratedly the 1st vertical axis on directions X movable stage by horizontal supporting rotatably, workpiece keeps platform to have the 2nd vertical axis, the 2nd vertical axis is the 2nd vertical axis that keeps the surface of platform vertically to extend from this workpiece, and can be positioned at slidably the slot part of Y-direction movable stage, workpiece remains on workpiece and keeps on platform, the non-rectilinear portion of being polished is by the movement of the 1st vertical axis and the 2nd vertical axis, the above-mentioned grinding axis oscillating in yaw motion edge is carried out on limit, non-rectilinear is polished part and abradant surface relatively moves, be formed as to make the non-rectilinear of circumference of glass plate be polished part, average surface roughness Ra is below 20nm, and maximum valley depth Rv is below 200nm.
By forming in the above described manner, can become and use lapping tape the non-rectilinear of the workpiece such as glass plate to be polished partly to the lapping device that grinds (for example, the R face in bight grinds).When thering is being polished part and grinding of R shape that curvature is different (for example, R1, R10 etc.), work cell is carried out yaw motion limit according to this shape limit and is swung on grinding axis, therefore, do not need, according to R alteration of form grinding-material (emery wheel etc.), can carry out high-precision grinding.
The lapping tape that the lapping device of the invention described above uses forms as described below: make abrasive particle be scattered in resinoid bond and the solution that obtains at the surface-coated of plastic base material film, sheet material after dry, curing is cut into necessary width, and be wound up on reel.
As base material film, use the plastic plastic foil with flexibility.Particularly, as base material film, use the film being formed by the polyolefin resins such as the polyester resins such as PETG, polybutylene terephthalate (PBT), PEN, PBN, polyethylene, polypropylene, acrylic resin take polyvinyl alcohol or methylallyl alcohol as principal component etc.
As abrasive particle (abrasive grains), can use aluminium oxide (Al
2o
3), cerium oxide (CeO
2), silica (SiO
2), diamond, carborundum (SiC), chromium oxide (Cr
2o
3), zirconia (ZrO
2), cubic boron nitride (cBN) etc. and composition thereof.
The average grain diameter of abrasive particle is preferably more than 0.2 μ m in the scope of (#20000), (#4000) below 3 μ m.If average grain diameter exceedes 3 μ m, although can remove larger scar and the breach of the end face before grinding, can on polished surface, newly produce fine scar and breach, cannot give sufficient intensity to glass plate, therefore not preferred.If average grain diameter less than 0.2 μ m, grinding efficiency is extreme low and productivity worsens, therefore, industrial impracticable.
And, the invention provides a kind of Ginding process, use above-mentioned lapping device, for the intensity that improves the workpiece being made up of glass plate is ground the circumference of this workpiece.The method comprises following operation: the straight line of the circumference of use lapping tape to workpiece is polished part and grinds or the non-rectilinear of workpiece is polished partly and is ground, be formed as to make being polished part, average surface roughness Ra is that the following and maximum valley depth Rv of 20nm is the grinding step below 200nm, and lapping tape is that the abrasive particle that fixedly has a regulation particle diameter by resinoid bond on base material film forms.
For glass plate being given to sufficient mechanical strength, effectively, form the polished surface of above-mentioned surface roughness Ra and maximum valley depth Rv at the circumference of glass plate.The mode that has an above-mentioned surface characteristic with circumference is ground the glass plate forming can prevent the generation take the fine scar of circumference and breach as the crackle of starting point, and can prevent the breakage being caused by mechanical stress or thermal shock.In addition, can improve the processed finished products rate of subsequent handling, improve the reliability of the product that is assembled with glass plate.
Invention effect
By implementing lapping device of the present invention or Ginding process, can remove the limit portion of glass plate that the manufacture of cloche, the cloche of other electronic component-uses etc. that the flat-panel screens such as the panel, liquid crystal panel, organic EL panel, plasma panel, solar battery panel of smart mobile phone or plate terminal use uses and/or the latent wound in bight and form high-precision surface characteristic, thereby can give high mechanical properties to glass plate.Use glass plate of the present invention to manufacture cloche, and employing in mobile terminal etc., thus, can improve the fabrication yield in the manufacturing process of various products, can raising group enter to have the quality of the product of this glass plate.
In addition, according to lapping device of the present invention, Ginding process, can grind the rib portion in the limit portion of the workpiece such as glass plate, end face, bight, bight etc., not need to make grinding-material according to grinding charge shape.In addition, owing to can using expeditiously lapping tape, so can reduce costs and improve quality.
Accompanying drawing explanation
Fig. 1 is the figure that schematically represents the workpiece of a mode.
(A) of Fig. 2 is the partial sectional view of workpiece, and (B) of Fig. 2 is the top view of workpiece.
Fig. 3 is the abridged front view that schematically represents the lapping device 1 of a mode of the present invention.
Fig. 4 A is the top view that schematically represents the grind section of a mode of the present invention.
Fig. 4 B is the top view that schematically represents the detent mechanism of the lapping tape unit of a mode of the present invention.
Fig. 5 be schematically represent the lapping tape unit of a mode of the present invention rotating mechanism, omit side view along the part of the X-X ' line of Fig. 4 A.
Fig. 6 is that front view is omitted in the part that schematically represents the leaning device of the lapping tape unit of a mode of the present invention.
Fig. 7 is the top view that schematically represents the swing mechanism of the work cell of a mode of the present invention.
Fig. 8 is the top view that schematically represents the workpiece movable mechanism of the work cell of a mode of the present invention.
Fig. 9 is the top view that schematically represents the grind section of other modes of the present invention.
Figure 10 A is the top view that schematically represents the work cell of other modes of the present invention.
Figure 10 B is the side view that schematically represents the work cell of other modes of the present invention.
Figure 11 is the figure that has schematically represented to use the Ginding process of the workpiece limit portion (rib portion) of emery wheel.
Figure 12 is the enlarged photograph of the face that is polished of embodiment and comparative example.
Figure 13 is the enlarged photograph of the face that is polished of other comparative examples.
Figure 14 is the figure that schematically represents the method for edge strength test.
Figure 15 is the center C 1 that represents the workpiece such as rectangular glass plate, the figure of C2.
Figure 16 be as (A) side of the glass plate of workpiece observe picture and (B) upper surface observe picture.
Description of reference numerals
W part
T lapping tape
A grinds axis
1 lapping device
2 pedestals
10 workpiece mounting tables 1
20 supply units
30 the 1st grind section
40 the 2nd grind section
50 workpiece mounting tables 2
300 lapping tape unit 1
300 ' lapping tape unit 2
350 unit 1
400 work cell 2
The specific embodiment
Below, with reference to the accompanying drawings of various features of the present invention with the present invention is not formed the preferred embodiment of restriction.For convenience of explanation, simplifying accompanying drawing and size also may not be consistent.
Fig. 1 schematically shows the workpiece W as grinding charge.Silicon plate that workpiece W can be glass plate, corrosion resistant plate, aluminium sheet, use as solar cell substrate etc.Workpiece can be rectangle, can be also other shapes.Workpiece W has limit portion (rib portion) at upper surface or lower surface (first type surface) with the boundary portion of end face, in addition, has bight (corner part) in the boundary portion of an end face and adjacent face.End face and bight can be the states (as slice: cutting state) that maintenance cuts out from blanket, also can implement rough lapping.
(A) of Fig. 2 shows at least two limit portions has carried out the partial cross section of the workpiece W1 of so-called C chamfering, and (B) of Fig. 2 shows four bights has carried out the workpiece W2 of so-called R chamfering.Grind by opposite side portion or bight, can obtain thering is polished surface S1, S1 ', or S2, S2 ', S2 ", S2 ' " workpiece W1, W2.
Workpiece W can be made up of glass plate.In order to improve the intensity of glass plate, importantly circumference is ground to remove scar or breach, and reduce surface roughness and the maximum valley depth of polished surface S1 etc. or S2 etc.In order to give high mechanical properties to glass plate W, preferred polished surface S1 etc. or S2 etc. are formed as, and average surface roughness Ra is that 20nm is following, the maximum valley depth Rv of roughness curve is below 200nm.
Fig. 3 schematically shows the lapping device 1 of a mode of the present invention.Lapping device 1 is made up of following part: be configured in mounting table 10 on pedestal 2, workpiece W; According to the workpiece supply unit 20 of the moving direction Wf conveying workpieces W of workpiece W; The 1st grind section 30; The 2nd grind section 40; And for placing the mounting table 50 of the workpiece W12 after milled processed finishes.The 1st grind section 30 is configured to straight line is polished partly and is ground, and the 2nd grind section 40 is configured to non-rectilinear is polished partly and is ground.The quantity of these grind section and combination can be not limited to this.
Fig. 4 A schematically shows the 1st grind section 30.The 1st grind section 30 by the pedestal 2 in level across the grinding axis A of level and relatively lapping tape unit 300 and the work cell 350 of configuration form.
Lapping tape unit 300 comprises lapping tape cell operation platform 301, and this lapping tape cell operation platform 301 is with can along continuous straight runs and be that the mode that A1 direction moves is arranged on pedestal 2 along the direction vertical with grinding axis A.Workbench 301 can by be arranged between workbench 301 and pedestal 2, move back and forth along A1 direction for motor 302, the LM guide portion 303,304 of releasing control.On workbench 301, pillar 305,306,307 extends along vertical.Connecting block 311 can move in vertical along pillar 305 by the LM guide portion 309 and single-shaft mechanical arm (robot) 310 that arrange abreast with pillar 305.Preferably two axles 312,312 ' (Fig. 5) can run through connecting block 311 by along continuous straight runs slidably.At axle 312,312 ' front end, connecting member 313 is installed.Connecting member 313 can be attached on the extension arm 314 ' with cursor 314 one rotationally by axle fulcrum post 316.Cursor 314 (and extension arm 314 ') and cursor 315 have roughly symmetrical shape, via fastening means 330,331, plate 317 and hang plate 318, the casing that is kept for storage, configuration lapping tape T from left and right is grinding head 319.Cursor 314 (314 '), 315 is arranged on pillar 306,307 in the mode that can rotate centered by axle A2.Axle A2 is parallel with grinding axis A.
The roller that can rotate that grinding head 319 is configured for configuration lapping tape T in the casing with bottom surface and side forms.Preferably the end face of grinding head 319 is made up of the lid that can open and close.Grinding head 319 has liner component (polishing pad) 324, and the lapping tape of supplying with by roller is configured on liner component 324.Lapping tape T supplies with and is wound roller 322 from donor rollers 321 and reels.In order to give moderate tension to lapping tape T, donor rollers 321 is connected with torque motor (not shown).Take up roll 322 is connected with stepping motor (not shown), the lapping tape T that reels and supply with from donor rollers 321.Can also be configured for to lapping tape T give the stopping roller (stopper roller) of moderate tension, for lapping tape T being suitably configured in to help roll on liner component 324 etc.For example, according to the surface configuration of polishing pad 324 (, smooth rectangle), the lapping tape T being configured on polishing pad 324 marks off the abradant surface 320 with specific length and width.
In order to form high-precision surface characteristic being polished in part of workpiece W, preferably liner component 324 is suitably selected.If for example, the elasticity of liner component 324 excessive (, Xiao A hardness less than 20), the polished surface limit of collapsing that is polished part (for example limit portion) of workpiece W, easily loses the linearity of edge part.In addition, be below 1 μ m (#8000) in the case of being contained in the average grain diameter of lip-deep abrasive particle of lapping tape T, the liner components such as the foamed resin plate that elasticity is large can make grinding rate sharply slack-off and impracticable.For example, in the situation that elasticity is little (, Xiao A hardness exceedes 90), the linearity of the edge part of polished surface is abundant, but is not easy to remove fully the scar and the breach that on workpiece, produce because of mechanical collision.
For example, as liner component 324, in order to relax mechanical collision, can use the foamed resin plate of Xiao A hardness in 20 to 50 scopes.Via thering is flexible liner component 324, by the abradant surface being formed by lapping tape T 320 and workpiece butt, thus, can relax mechanical collision, grind and in the case of to be polished the shape of portion also easily servo-actuated changing.
Or, as liner component 324, also can use the material that the rubber slab in 80 to 90 scopes combines by foamed resin plate as described above and Xiao A hardness.Thus, even use the average grain diameter of abrasive particle extremely fine (for example, 1 μ m is following) lapping tape, can not make grinding rate too slow yet, can form the polished surface of the linearity excellence (Ra, Rv), edge part that there is high-precision surface characteristic.
The surface of liner component 324 can be the curved surface of uneven convex.Its reason is, can limit and be polished the end (for example, the two ends of limit portion etc.) of part and contacting of lapping tape T (abradant surface), thereby can grind on protection lapping tape T limit, limit.
Use has the lapping tape of flexibility and has flexible liner component carries out the C face grinding of the circumference of workpiece W, thus, at polished surface (S1, Fig. 2), edge part (boundary portion of upper surface or lower surface and machined surface S1) is generally formed as the curved surface of cross section circular shape, can not form new scar and breach at new edge part.
In milled processed, lapping tape T can be inactive state, also can move continuously or intermittently.Grind in situation about just finishing at short notice, can not make lapping tape T move and use with inactive state, after grinding, for next time grinds, the surface of new lapping tape T is supplied to liner component as abradant surface.Thus, can reduce costs.Expend in long situation in grinding, for supply with continual and steady abradant surface, comprise abrasive particle the surface of lapping tape, preferably make lapping tape move continuously or intermittently.Thus, can improve grinding efficiency.
About for by the pushing force of the abradant surface 320 limit portions to workpiece W such as glass plates that marked off by the lapping tape T being configured on liner component 324 or end face pushing, can be according to the state of workpiece W, less in grinding initial stage, increase gradually along with the carrying out of grinding.For example, the in the situation that of glass plate, on the cutting bight of state and end face, there is acute angle portion, if just apply strong pushing force from grinding initial stage, exist due to the acute angle portion lapping tape T to abradant surface 320 to cause the situation of scar, lapping tape T breakage.By regulating pushing force, can limit protection lapping tape Surface Edge grind.
Fig. 4 B illustrates the detent mechanism in the 1st grind section of lapping device of the present invention.Lapping tape cell operation platform 301 moves along A1 direction by motor 302 (Fig. 4 A) and LM guide portion 303,304 (Fig. 4 A), is placed at least a portion and abradant surface 320 butts that workpiece keeps an end face (or limit portion) of the workpiece W on platform 351.By further pushing to abradant surface 320, an end face (limit portion) entirety is being ground on axis A and abradant surface 320 butts.Now, grinding axis A can be consistent with pivot center A2.
The workpiece W being positioned is like this fixed on workpiece and keeps on platform 351 and carry out milled processed, and therefore, an end face (limit portion) that can carry out the workpiece to rectangle carries out only having an end in contact, grinds uniformly.
Fig. 5 shows X-X ' the line side view after a part of Fig. 4 A is omitted.In order to simplify, to illustrate integratedly cursor 314 and extension arm 314 ', and illustrate grinding head 319 with dotted line.Keep the cursor 314 (314 ') of grinding head 319 to be arranged on pillar 306 in the mode that can rotate centered by pivot center A2 (being preferably placed on abradant surface 320) via fastening means 330, plate 317, hang plate 318.In the opposition side across grinding head 319, arm 315 is arranged on (Fig. 4 A) on pillar 307.The shape of cursor and fastening means is not particularly limited, and can carry out suitably selecting to keep grinding head 319 and the parts (plate, motor etc.) with grinding head 319 one.
As mentioned above, cursor 314 (314 ') is articulated on connecting member 313 by axle fulcrum post 316, be fixed with the axle 312,312 ' that connecting block 311 is run through in the rear end of connecting member 313, connecting block 311 is by LM guide portion 309 and single-shaft mechanical arm 310 and can move in vertical along pillar 305.
Along with connecting block 311 is moved upward along pillar 305, draw to the right of accompanying drawing with the axle 312,312 ' of connecting member 313 one, cursor 314 (314 ') rotate rotation axis A2 rotate, remain on grinding head 319 on the cursor rotation axis A2 that rotates and rotate, abradant surface 320 can tilt alpha degree with respect to vertical guide.The scope of angle [alpha] is not limited to illustrated example, can determine arbitrarily according to the displacement of the vertical of connecting block 311 and axle 312,312 ' length etc.The scope of preferred angle alpha is that, with respect to the vertical guide that comprises pivot center A2 ,-90 degree≤α≤90 are spent.
Like this, the abradant surface 320 of grinding head 319 is with respect to vertical guide tilt angle alpha, thus, can carry out desired C face grinding to a limit portion (rib portion) of the upper surface that is flatly held in the workpiece W (not shown) in work cell.
Similarly, by connecting block 311 is moved downwards along pillar 305, abradant surface 320 can be flatly held in the workpiece W (not shown) in work cell lower surface limit portion (rib portion) butt and carry out desired C face and grind.
Fig. 6 shows the leaning device of lapping tape of the present invention unit 300.As mentioned above, with fastening means 330,331 holding plate 317 integratedly of cursor 314,314 ' (Fig. 4 A, Fig. 5) one.Hang plate 318 can be arranged on plate 317 around the axis A7 (Fig. 5) that axle fulcrum post 325 is run through rotationally by axle fulcrum post 325.The smooth upper end (Fig. 4 A) of the lower surface of grinding head 319 and hang plate 318 links integratedly.On plate 317, be provided with guiding groove 326a, 326b, 326c, the 326d of the circular arc that forms the circle centered by axle fulcrum post 325 (axis A7).Setting tool 327a, the 327b, 327c, the 327d that are arranged on integratedly on hang plate 318 slide respectively along with the rotation of hang plate 318 in guiding groove 326a, 326b, 326c, 326d, can hang plate 318 be fixed on to optional position with respect to plate 317.
In the time that hang plate does not rotate, the length axes A3 of the abradant surface 320 being formed by the surface of lapping tape T is with to grind axis A (workpiece be polished that part contacts with abradant surface and for grinding the track relatively moving) consistent.In the time that hang plate 318 rotates, the length axes A3 of abradant surface 320 is for example to length axes A3 ' cant angle theta.The scope of angle θ is preferably, 0 degree < θ≤90 degree.
Fig. 7 illustrates the swing mechanism that workpiece in work cell 350 of the present invention, holding workpiece W keeps platform 351.
Keep in the groove 357a of lower surface of platform 351 being arranged at workpiece, be inserted with from the upper surface vertical of timing belt wheel 354a the bar 356a that extends.In addition, in the groove 357b of lower surface that is arranged at balancer 358b, be inserted with from the upper surface vertical of timing belt wheel 354b the bar 356b that extends, in the groove 357c of lower surface that is arranged at balancer 358c, be inserted with from the upper surface vertical of timing belt wheel 354c the bar 356c that extends.
By the driving of motor 352, timing belt wheel 354a, 354b, 354c rotation, bar 356a, 356b, 356c synchronously rotate, and thus, workpiece keeps platform 351, balancer 358b, 358c to swing along grinding axis A respectively.
At this, workpiece keeps platform 351 to be configured to the vibration that can fully suppress the workpiece W flatly keeping by fixed mechanism (not shown).When workpiece keep platform 351 to the left of accompanying drawing when mobile, balancer 358b, 358c move to right respectively.When workpiece keeps platform 351 while moving to the right of accompanying drawing, balancer 358b, 358c respectively left direction move.Thus, can eliminate workpiece and keep the vibration of platform 351 while swinging, thereby can carry out high-precision grinding.
In order to suppress vibration, swing mechanism can be configured to, and is adjacent to arrange many (for example two) workpiece and keeps platform 351, and it is synchronously swung round about along grinding axis A.In this situation, can keep platform to eliminate vibration by many workpiece, therefore not need balancer.
According to the intensity of flexibility, elasticity and the glass plate of the power of pushing abradant surface (lapping tape T), liner component, carry out milled processed even if make to be polished body (glass plate) with respect to abrasive body (abradant surface) is mobile, be polished body and also can in grinding, do not occur damaged.When grinding be polished part and abradant surface (surface of lapping tape) relatively move suppress vibration and carry out along grinding the mode of axis, so can give high-precision surface characteristic to improve the intensity of glass plate to being polished face (polished surface S1 etc., Fig. 2).
Fig. 8 illustrates the detent mechanism of other modes of lapping device of the present invention.The workpiece of work cell 350 keeps platform 351 ' to have groove 334 at upper surface, and the bar 333 that can move along the driving shaft A1 ' direction of motor 332 is positioned at this groove.
As shown in Fig. 8 (A), at workpiece W not across grind axis A and place in the situation that, the bar 333 driving by motor 332 by workpiece W along A1 direction towards grinding axis A release.Thus, being polished part and can grinding on axis A butt reliably of the abradant surface of lapping tape unit and workpiece W.
Fig. 9 illustrates the 2nd grind section 40 of lapping device 1 of the present invention (Fig. 3).The 2nd grind section 40 comprises lapping tape unit 300 ' and forms with work cell 400, and wherein, this work cell 400 relatively configures across grinding axis A and lapping tape unit 300 ', and the workpiece having for configuring workpiece W keeps platform 401.Lapping tape unit 300 ' preferably has the structure identical with lapping tape unit 300.Grinding axis A can be consistent with the 1st grind section.In addition, also can have with the 1st and grind the grinding axis A ' of the inconsistent level of axis A.
Figure 10 A, Figure 10 B illustrate work cell 400.In Figure 10 A, dot workpiece W and workpiece and keep platform 401.
Directions X movable stage 413 is installed on fixed head 405, and it can move back and forth along directions X by servomotor 414 and single shaft mobile unit 408.Directions X movable platen 406 is installed integratedly on directions X movable stage 413.The axle A4 being formed by spindle unit from the upper surface vertical of directions X movable platen 406 extend, make workpiece keep platform 401 can flatly support rotatably this workpiece and keep platform 401.
In addition, the Y-direction movable stage 407 with hole 429 is installed on fixed head 405, it can move back and forth along Y-direction by straight line guide portion 409.On Y-direction movable stage 407, be provided with integratedly Y-direction movable platen 410, the guide member 411 with guiding groove 412 is installed integratedly on Y-direction movable platen 410.By keep from workpiece platform 401 lower surface vertical the axle A5 that forms of the bar (or pin) that extends can be positioned at slidably the guiding groove 412 forming along directions X.
Between plate 403 and plate 405, be provided with by motor 420 and timing belt 423 and the timing belt wheel 422,424 driving linkedly, between timing belt wheel 422 and Y-direction movable stage 407, be provided with the rotary part 425 that can synchronously rotate with timing belt wheel 422.The bar 427 extending to vertical top from the upper surface of rotary part 425 is inserted in the hole 429 of Y-direction movable stage 407.
By the driving of motor 420, in the time that timing belt wheel 422 rotates via timing belt 423, rotary part 425 synchronously rotates with belt wheel 422.In the time that rotary part 425 rotates, the bar 427 of one rotates, and on one side in the interior movement in hole 429 being arranged on Y-direction movable stage 407, movable stage 407 is moved back and forth on one side with fixed journey system along Y-direction.Along with moving back and forth of Y-direction movable stage 407, plate 410 and the guide member 411 of one move back and forth along Y-direction, and the vertical axis A 5 in guiding groove 412 moves to Y-direction.With vertical axis A 5 to the movement of Y-direction accordingly, the position y of the Y-direction of vertical axis A 5 is passed to servomotor 414 via sequence controller, by servomotor 414, vertical axis A 4 is synchronously polished part (having the bight of regulation curvature) to the non-rectilinear of workpiece W and is positioned at the position x that grinds directions X on axis A, vertical axis A 4 and moves.By the movement to directions X of vertical axis A 4, the workpiece that level remains in this vertical axis A 4 rotatably keeps platform 401 to move to directions X, keeps the vertical axis A 5 of platform 401 one to move to directions X in the interior slip of groove 412 with workpiece.The motion of vertical axis A 5 is movement combinations of directions X and Y-direction, becomes the motion of rotating around vertical axis A 4.For example, can be, vertical axis A 5 centered by the center C take oscillating stroke, major diameter moves on the oval circumference of 2d.
Like this, vertical axis A 4 moves to directions X, and vertical axis A 5 moves to directions X and Y-direction, thus, workpiece keeps platform 401 yaw motion edges, limit to grind axis A swinging, and can make the non-rectilinear such as bight of the workpiece of rectangle be polished part limit and abradant surface grinds on butt limit successively.
By using servomotor to carry out Position Control, can easily control the non-rectilinear grinding on axis A and be polished yaw partly, the stroke of swing, thereby can carry out the R face grinding of desired curvature.Grind owing to can workpiece being swung according to the shape that is polished part of workpiece, so do not need to make abrasive material (emery wheel etc.) according to the shape that is polished part of workpiece.
Replace said structure, also can carry out by servomotor 2 axle controls of X-axis and Y-axis.Or, also can replace the control based on servomotor, control the position of two above-mentioned vertical axis by cam control.In this situation, can replace servomotor, with carrying out constituent apparatus for the cam that makes timing belt wheel that vertical axis A 4 moves to directions X and synchronize with the movement of the Y-direction of vertical axis A 5.
The abradant surface 320 ' of lapping tape unit 300 ', with respect to vertical guide tilt alpha degree, thus, also can carry out the grinding of the rib portion of the upper surface (or lower surface) in the bight of workpiece W.
Lapping device of the present invention preferably comprises the control device (not shown) for controlling each unit.
Lapping device of the present invention can carry out dry grinding and wet lapping.In order to carry out wet lapping, preferably have for for feedwater or be added with water feeder and the water pipe (not shown) of the aqueous solution of surfactant.By to abradant surface or Workpiece supply water etc., can improve grinding efficiency, in addition, can rinse lapping rejects.Lapping device can also have the air nozzle for spraying air.This be because can anti-sealing or lapping rejects be attached in work cell etc.In addition, for the burn of the workpiece that prevents from being formed by metal material, preferably there is feeder and the oil filling pipe (not shown) of supplying with processing oil.
Lapping device of the present invention can comprise to the straight line of above-mentioned workpiece is polished part the 1st grind section of grinding and the non-rectilinear of workpiece is polished the 2nd grind section that part grinds and is formed.Thus, can grind the circumference entirety of glass plate by a lapping device.In addition, owing to using lapping tape to grind, thus can on polished surface, form high-precision surface characteristic, thus the quality of grinding charge can be improved.Owing to can using lapping tape to grind the workpiece of various shapes, so can reduce costs, the lapping rejects producing when grinding is few, also easily carries out the maintenance of device.
In addition, lapping device of the present invention can be made up of the 1st above-mentioned grind section and the either party of the 2nd grind section.
Embodiment 1
Use the limit portion (rib portion) of lapping device of the present invention to workpiece to grind.As workpiece, use the rectangular soda-lime glass of length 70mm, width 40mm, thickness 0.8mm.8 limits of the upper surface of this glass plate and lower surface are polished and are formed as polished surface (S1 etc., Fig. 2).In grinding, the length axes of the abradant surface of lapping tape unit is with respect to grinding axis inclination 10 degree (θ=10 °).In addition, abradant surface is with respect to vertical guide inclination 45 degree (α=45 °).Like this, limit portion of glass plate and abradant surface butt, along grinding axis oscillating, glass plate and abradant surface relatively move work cell, grind thus.The amount of grinding that C face grinds is 50 μ m, in order to realize fixing amount of grinding, according to the reciprocal time (1 back and forth=1 passage) of surperficial abrasive particle diameter adjustment glass plate that is contained in lapping tape.Abradant surface and grinding shaft line parallel, lapping tape does not move.In addition, limit is supplied with a small amount of waterside to abradant surface and is ground.
Other grinding conditions of embodiment 1 are as follows.
Grinding condition (1 limit)
The reciprocating haul distance (L) of glass plate: 150mm
The width of lapping tape: 30mm
The pushing force (thrust) of lapping tape: 15N
As lapping tape, use GC (green silicon carbide) #4000 (SiC: average abrasive grain diameter 3 μ m), as liner component, use the Foamex liner of Xiao A hardness 30.The reciprocal time of glass plate is 21 passages.
In the manufacture method of embodiment 2, as lapping tape, (average abrasive grain diameter 2 μ m) to use GC#6000.The reciprocal time of glass plate is 24 passages.Other conditions are identical with embodiment 1.
Embodiment 3
In the manufacture method of embodiment 3, as lapping tape, (average abrasive grain diameter 0.5 μ m) to use GC#10000.As liner component, use the rubber slab of Xiao A hardness 80 and the foamed resin plate of Xiao A hardness 30.The reciprocal time of glass plate is 31 passages.Other conditions are identical with embodiment 1.
Comparative example 1
In the manufacture method of comparative example 1, as lapping tape, (average abrasive grain diameter 16 μ m) to use GC#1000.The reciprocal time of glass plate is 7 passages.Other conditions are identical with embodiment 1.
Comparative example 2
In the manufacture method of comparative example 2, as lapping tape, (average abrasive grain diameter 9 μ m) to use GC#2000.The reciprocal time of glass plate is 11 passages.Other conditions are identical with embodiment 1.
Comparative example 3
In the manufacture method of comparative example 3, as lapping tape, (average abrasive grain diameter 5 μ m) to use GC#3000.The reciprocal time of glass plate is 17 passages.Other conditions are identical with embodiment 1.
Comparative example 4
In the manufacture method of comparative example 4, use that (average grain diameter 14～22 μ are the metal emery wheel 500 forming that bonds m) by the diamond abrasive grain of screen size #1000.As shown in figure 11, the rib portion of the first type surface (upper surface and lower surface) of configuration emery wheel and glass plate, by making emery wheel rotate to carry out the chamfer grinding of rib portion.
Embodiment, the average surface roughness Ra of comparative example and the maximum valley depth Rv of roughness curve that carry out as described above smooth grinding have been shown in following table 1.Measure average surface roughness Ra and maximum valley depth Rv by surface roughness meter (name of product NewView5000:Zygo company system).
Table 1
According to the manufacture method of embodiment 1 to 3, can obtain being polished the glass plate that is partly formed as high-precision polished surface (average surface roughness Ra:1.7nm～11.5nm, maximum valley depth Rv:32nm～162nm).Back and forth passage number of times is 20 times to 30 times left and right, and grinding rate is also abundant.The maximum valley depth of the polished surface of the glass plate obtaining by the manufacture method of comparative example exceedes 1000nm more.
Figure 12 shows the enlarged photograph of the polished surface of embodiment, comparative example.Left side is the optical photograph based on digital microscope (name of product VHX500:KEYENCE company system), and right side is the optical photograph based on surface roughness meter (name of product NewView5000:Zygo company system).(A) being the polished surface of comparative example 1, is (B) polished surface of comparative example 2, is (C) polished surface of embodiment 1, is (D) polished surface of embodiment 3.
(A) of comparative example, the concave-convex surface of (B) are more, insufficient as the surface characteristic of polished surface.Embodiment (C), (D) become the high-precision polished surface that there is no concavo-convex and scar, and the linearity of edge part is also excellent.Owing to using lapping tape, so polished surface has curved surface.
Figure 13 is the enlarged photograph of the polished surface of the glass plate that obtains by the manufacture method of comparative example 4.There is grinding marks (emery wheel vestige) on surface, observe more scar.Owing to grinding by emery wheel, so polished surface can not be formed as curved surface.
The edge strength (MPa) of the each glass plate to embodiment, comparative example is measured.Edge strength refers to the intensity of the end edge portion of glass.Based on normal temperature bending strength test method (JISR1601), 4 Apparatus for Bending at low-temp edge intensity that use market to sell are measured.Figure 14 schematically shows the method for edge strength test (4 bendings).Being divided into 10mm, support tool at load Tool Room is spaced apart under the condition that 30mm, load speed are 5mm/min and tests.
In table 1, record each 10 glass plates of embodiment, comparative example have been tested and the mean value of the edge strength that obtains.By lapping device of the present invention, form the glass plate of polished surface about using the grinding that comprises fine abrasive particle on surface to bring abrasive tip edge, can reduce significantly average surface roughness Ra and the maximum valley depth Rv value of machined surface, its result is, compare with the processing of being undertaken by emery wheel in the past, edge strength has improved more than 3 times.Like this, because the edge strength of glass plate of the present invention significantly improves, so using in the manufacturing process of product of this glass plate, can prevent glass plate because mechanical stress or thermal shock produce damaged situation.In addition, glass plate is also difficult to breakage being assembled into after product, can improve the reliability of product.
Embodiment 4
Use lapping device of the present invention to grind the bight of glass plate.This glass plate uses the glass plate of having implemented in advance the R shape processing (rough lapping) of regulation by emery wheel.Use the lapping tape identical with embodiment 1.Pressure is 1N, and reciprocal time is 5 passages.
Embodiment 5
Grind in bight to (cutting state) glass plate of not implementing rough lapping.About lapping tape, with D#600, (30 μ m) have implemented, after R shape processing (rough lapping), to use the lapping tape identical with embodiment 1.
In embodiment 4,5, also can obtain high-precision polished surface (average surface roughness Ra: approximately 1.5nm～12nm, maximum valley depth Rv: approximately 30nm～165nm).
For those skilled in the art, can in the situation that not departing from thought of the present invention and mode, carry out various corrections.Therefore, certainly, mode of the present invention is only to illustrate, and not delimit the scope of the invention.
Claims (21)
1. a lapping device, for using lapping tape to grind the circumference of workpiece, is characterized in that, comprising:
The 1st grind section, the straight line of its circumference to described workpiece is polished part and grinds, and has the 1st grinding axis of level; With
The 2nd grind section, the non-rectilinear of its circumference to described workpiece is polished part and grinds, and has the 2nd grinding axis of level,
Described the 1st grind section comprises: for keeping the 1st work cell of described workpiece; With to grind axis across the described the 1st relative with described the 1st work cell and for configuring the 1st lapping tape unit at least a portion surface of the 1st lapping tape,
Described the 2nd grind section comprises: for keeping the 2nd work cell of described workpiece; With to grind axis across the described the 2nd relative with described the 2nd work cell and for configuring the 2nd lapping tape unit at least a portion surface of the 2nd lapping tape,
In described the 1st grind section, the surface of the 1st described configured lapping tape marks off the 1st abradant surface, and described straight line is polished part and described the 1st abradant surface grinds on axis and relatively moves the described the 1st contiguously, grind thus,
In described the 2nd grind section, the surface of the 2nd described configured lapping tape marks off the 2nd abradant surface, and described non-rectilinear is polished part and described the 2nd abradant surface grinds on axis and relatively moves the described the 2nd contiguously, grinds thus.
2. lapping device as claimed in claim 1, is characterized in that,
Described workpiece is made up of glass plate,
In described the 1st grind section, described straight line is polished part and described the 1st abradant surface relatively moves, be formed as to make the straight line of circumference of described glass plate be polished part, average surface roughness Ra be 200nm below and maximum valley depth Rv be below 20nm,
In described the 2nd grind section, described non-rectilinear is polished part and described the 2nd abradant surface relatively moves, be formed as to make the non-rectilinear of circumference of described glass plate be polished part, average surface roughness Ra is that the following and maximum valley depth Rv of 20nm is below 200nm.
3. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st work cell comprises:
Keep platform for the 1st workpiece that keeps described workpiece; With
For making described the 1st workpiece keep the swing mechanism of platform along described the 1st grinding axis oscillating.
4. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 2nd work cell has on the pedestal of level:
Directions X movable stage, its with can along continuous straight runs and along and the described the 2nd to grind the direction that axis is vertical be that the mode that directions X moves arranges;
Y-direction movable stage, its for can along with the direction of described the 2nd grinding shaft line parallel be the Y-direction movable stage that mode that Y-direction moves arranges, and there is integratedly the slot part extending along directions X; With
The 2nd workpiece keeps platform, its by being arranged on integratedly the 1st vertical axis on described directions X movable stage by horizontal supporting rotatably,
Described the 2nd workpiece keeps platform to have the 2nd vertical axis, and the 2nd vertical axis is the 2nd vertical axis that keeps the surface of platform vertically to extend from the 2nd workpiece, and can be positioned at slidably the described slot part of described Y-direction movable stage,
Described workpiece remains on described the 2nd workpiece and keeps on platform,
Described non-rectilinear is polished portion by the movement of described the 1st vertical axis and described the 2nd vertical axis, and limit is carried out described in yaw motion edge the 2nd and ground axis oscillating.
5. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st lapping tape unit has the 1st lapping tape travel mechanism for making described the 1st abradant surface along continuous straight runs and moving along the direction vertical with described the 1st grinding axis, thus, described straight line is polished part and described the 1st abradant surface can grind butt on axis the described the 1st
Described the 2nd lapping tape unit has the 2nd lapping tape travel mechanism for making described the 2nd abradant surface along continuous straight runs and moving along the direction vertical with described the 2nd grinding axis, thus, described non-rectilinear is polished part at least a portion and described the 2nd abradant surface can grind butt on axis the described the 2nd.
6. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st lapping tape unit comprises the 1st leaning device that the length axes for making described the 1st abradant surface tilts with respect to described the 1st grinding axis,
Described the 2nd lapping tape unit comprises the 2nd leaning device that the length axes for making described the 2nd abradant surface tilts with respect to described the 2nd grinding axis.
7. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st lapping tape unit comprises the 1st rotating mechanism for described the 1st abradant surface is rotated centered by described the 1st grinding axis,
Described the 2nd lapping tape unit comprises for making described the 2nd abradant surface grind by the described the 2nd the 2nd rotating mechanism rotating centered by axis.
8. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st work cell comprises the workpiece movable mechanism for making described workpiece along continuous straight runs and moving along the direction vertical with described the 1st grinding axis.
9. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st work cell comprises for pushing and fix the 1st workpiece fixed mechanism described workpiece and/or that adsorb and fix described workpiece,
Described the 2nd work cell comprises for pushing and fix the 2nd workpiece fixed mechanism described workpiece and/or that adsorb and fix described workpiece.
10. lapping device as claimed in claim 1 or 2, is characterized in that,
Described the 1st lapping tape unit comprises the 1st lapping tape travel mechanism for described the 1st lapping tape is moved,
Described the 2nd lapping tape unit comprises the 2nd lapping tape travel mechanism for described the 2nd lapping tape is moved.
11. 1 kinds of lapping devices, grind for using the straight line of the circumference of lapping tape to workpiece to be polished part, and have the grinding axis of level, it is characterized in that, comprising:
For keeping the work cell of described workpiece; With
It is relative with described work cell and for configuring the lapping tape unit at least a portion surface of lapping tape across described grinding axis,
The surface of described configured lapping tape marks off abradant surface, and described straight line is polished part and described abradant surface relatively moves contiguously on described grinding axis, grinds thus.
12. lapping devices as claimed in claim 11, is characterized in that,
Described workpiece is made up of glass plate,
Described work cell comprises:
Keep platform for the workpiece that keeps described workpiece; With
For making described workpiece keep the swing mechanism of platform along described grinding axis oscillating,
Described straight line is polished part and described abradant surface relatively moves, be formed as to make the straight line of circumference of described glass plate be polished part, average surface roughness Ra be 20nm below and maximum valley depth Rv be below 200nm.
13. lapping devices as described in claim 11 or 12, is characterized in that,
Described lapping tape unit comprises:
Lapping tape travel mechanism, it is the lapping tape travel mechanism for making described abradant surface along continuous straight runs and moving along the direction vertical with described grinding axis, thus, described straight line be polished part and described abradant surface can be on described grinding axis butt;
Leaning device, it is for making the length axes of described abradant surface tilt with respect to described grinding axis; With
Rotating mechanism, it for rotating described abradant surface centered by described grinding axis.
14. lapping devices as described in claim 11 or 12, is characterized in that,
Described work cell comprises the workpiece movable mechanism for making described workpiece along continuous straight runs and moving along the direction vertical with described grinding axis.
15. 1 kinds of lapping tapes, use in the lapping device described in any one in claim 11 to 14.
16. 1 kinds of lapping devices, grind for using the non-rectilinear of the circumference of lapping tape to workpiece to be polished part, and have the grinding axis of level, it is characterized in that, comprising:
For keeping the work cell of described workpiece; With
It is relative with described work cell and for configuring the lapping tape unit at least a portion surface of lapping tape across described grinding axis,
The surface of described configured lapping tape marks off abradant surface, and described non-rectilinear is polished part and described abradant surface relatively moves contiguously on described grinding axis, grinds thus.
17. lapping devices as claimed in claim 16, is characterized in that,
Described workpiece is made up of glass plate,
Described work cell has on the pedestal of level:
Directions X movable stage, it is with can along continuous straight runs and be that the mode that directions X moves arranges along the direction vertical with described grinding axis;
Y-direction movable stage, its for can along with the direction of described grinding shaft line parallel be the Y-direction movable stage that mode that Y-direction moves arranges, and there is integratedly the slot part extending along directions X; With
Workpiece keeps platform, its by being arranged on integratedly the 1st vertical axis on described directions X movable stage by horizontal supporting rotatably,
Described workpiece keeps platform to have the 2nd vertical axis, and the 2nd vertical axis is the 2nd vertical axis that keeps the surface of platform vertically to extend from this workpiece, and can be positioned at slidably the described slot part of described Y-direction movable stage,
Described workpiece remains on described workpiece and keeps on platform,
Described non-rectilinear is polished portion by the movement of described the 1st vertical axis and described the 2nd vertical axis, and limit carries out grinding axis oscillating described in yaw motion edge,
Described non-rectilinear is polished part and described abradant surface relatively moves, be formed as to make the non-rectilinear of circumference of described glass plate be polished part, average surface roughness Ra be 20nm below and maximum valley depth Rv be below 200nm.
18. 1 kinds of lapping tapes use in the lapping device described in claim 16 or 17, consist of the scope of the particle diameter of described abrasive particle more than 0.2 μ m, below 3 μ m on base material film resinoid bond bonded-abrasive.
19. 1 kinds of Ginding process, right to use requires the device described in 11, in order to improve the intensity of the workpiece being formed by glass plate, the circumference of this workpiece ground,
Described method comprises following grinding step: the straight line of the circumference of use lapping tape to described workpiece is polished part and grinds, and is polished part and is formed as described in making, and average surface roughness Ra is below 20nm and maximum valley depth Rv is below 200nm,
Described lapping tape is to consist of resinoid bond bonded-abrasive on base material film,
The scope of the particle diameter of described abrasive particle more than 0.2 μ m, below 3 μ m.
20. 1 kinds of Ginding process, right to use requires the device described in 16, in order to improve the intensity of the workpiece being formed by glass plate, the circumference of this workpiece ground,
Described method comprises following grinding step: the non-rectilinear of the circumference of use lapping tape to described workpiece is polished part and grinds, and is polished part and is formed as described in making, and average surface roughness Ra is below 20nm and maximum valley depth Rv is below 200nm,
The abrasive particle that described lapping tape is fixed on this base material by base material with by resinoid bond forms,
The scope of the particle diameter of described abrasive particle more than 0.2 μ m, below 3 μ m.
21. 1 kinds of glass plates, at least a portion of its circumference is ground by the Ginding process of claim 19 or 20.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-258219 | 2012-11-27 | ||
| JP2012258219A JP6190108B2 (en) | 2012-11-27 | 2012-11-27 | Polishing apparatus and polishing method for polishing peripheral edge of workpiece such as plate glass with polishing tape |
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| CN103831705A true CN103831705A (en) | 2014-06-04 |
| CN103831705B CN103831705B (en) | 2018-07-17 |
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| CN201310245364.1A Active CN103831705B (en) | 2012-11-27 | 2013-06-17 | By the grinding device and method that grind the peripheral part of the workpiece such as belt grinding glass plate |
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| Country | Link |
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| JP (1) | JP6190108B2 (en) |
| KR (1) | KR102059203B1 (en) |
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| CN111745504A (en) * | 2020-05-20 | 2020-10-09 | 深圳市裕展精密科技有限公司 | Polishing mechanism, polishing device and polishing method |
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| KR102607582B1 (en) * | 2016-08-30 | 2023-11-30 | 삼성디스플레이 주식회사 | Cover window, display device including a cover window, and method of manufacturing a cover window |
| CN108857694A (en) * | 2018-07-20 | 2018-11-23 | 皖西学院 | A kind of photovoltaic panel grinding apparatus based on photovoltaic power generation apparatus manufacture |
| JPWO2022137894A1 (en) * | 2020-12-22 | 2022-06-30 | ||
| CN113001345B (en) * | 2021-02-26 | 2022-05-06 | 浙江大学山东工业技术研究院 | Panel processing is with automatic equipment of polishing |
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Also Published As
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| JP2014104526A (en) | 2014-06-09 |
| JP6190108B2 (en) | 2017-08-30 |
| TWI603810B (en) | 2017-11-01 |
| TW201420267A (en) | 2014-06-01 |
| CN103831705B (en) | 2018-07-17 |
| KR20140067886A (en) | 2014-06-05 |
| KR102059203B1 (en) | 2019-12-24 |
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