JP2014098186A - 銀粉 - Google Patents

銀粉 Download PDF

Info

Publication number
JP2014098186A
JP2014098186A JP2012250319A JP2012250319A JP2014098186A JP 2014098186 A JP2014098186 A JP 2014098186A JP 2012250319 A JP2012250319 A JP 2012250319A JP 2012250319 A JP2012250319 A JP 2012250319A JP 2014098186 A JP2014098186 A JP 2014098186A
Authority
JP
Japan
Prior art keywords
silver
silver powder
particles
powder
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012250319A
Other languages
English (en)
Japanese (ja)
Inventor
Keisuke Miyanohara
啓祐 宮之原
Toshikazu Matsuyama
敏和 松山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2012250319A priority Critical patent/JP2014098186A/ja
Priority to KR1020147036880A priority patent/KR20150028970A/ko
Priority to PCT/JP2013/076687 priority patent/WO2014077043A1/fr
Priority to CN201380041950.2A priority patent/CN104520031A/zh
Publication of JP2014098186A publication Critical patent/JP2014098186A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2012250319A 2012-11-14 2012-11-14 銀粉 Pending JP2014098186A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012250319A JP2014098186A (ja) 2012-11-14 2012-11-14 銀粉
KR1020147036880A KR20150028970A (ko) 2012-11-14 2013-10-01 은분
PCT/JP2013/076687 WO2014077043A1 (fr) 2012-11-14 2013-10-01 Poudre d'argent
CN201380041950.2A CN104520031A (zh) 2012-11-14 2013-10-01 银粉

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012250319A JP2014098186A (ja) 2012-11-14 2012-11-14 銀粉

Publications (1)

Publication Number Publication Date
JP2014098186A true JP2014098186A (ja) 2014-05-29

Family

ID=50730964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012250319A Pending JP2014098186A (ja) 2012-11-14 2012-11-14 銀粉

Country Status (4)

Country Link
JP (1) JP2014098186A (fr)
KR (1) KR20150028970A (fr)
CN (1) CN104520031A (fr)
WO (1) WO2014077043A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016108646A (ja) * 2014-12-03 2016-06-20 住友金属鉱山株式会社 コバルト粉の製造方法
JP2017508888A (ja) * 2014-08-12 2017-03-30 シュゾー スマート アドバンスト コーティング テクノロジーズ カンパニー リミテッド 金属粉末の調製方法
KR20170088345A (ko) 2014-11-21 2017-08-01 닛신 엔지니어링 가부시키가이샤 은 미립자

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104722775B (zh) * 2015-03-11 2016-09-07 浙江大学 一种二维中空钯纳米晶及其制备方法
JP6404261B2 (ja) * 2016-05-17 2018-10-10 トクセン工業株式会社 銀粉
CN107983946B (zh) * 2016-10-26 2019-12-06 中国科学院苏州纳米技术与纳米仿生研究所 一种降低银粉比表面积的方法
CN114743716A (zh) * 2022-04-15 2022-07-12 北京大学深圳研究生院 一种可低温烧结银粉及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126614A1 (fr) * 2005-05-25 2006-11-30 Nihon Handa Co., Ltd. Composition d’argent sous forme de pâte, procédé de fabrication idoine, procédé de fabrication d’argent massif, argent massif, procédé de collage, et procédé de fabrication de carte à circuit
WO2007037440A1 (fr) * 2005-09-29 2007-04-05 Alpha Scientific, Corporation Poudre conductrice et procédé servant à produire celle-ci, pâte de poudre conductrice et procédé servant à produire la pâte de poudre conductrice
WO2008013274A1 (fr) * 2006-07-28 2008-01-31 Mitsubishi Materials Corporation Fines particules d'argent et procédés et matériel pour leur production
JP2011021255A (ja) * 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
JP2012077372A (ja) * 2010-10-06 2012-04-19 Sumitomo Metal Mining Co Ltd 銀粉及びその製造方法
JP2013139589A (ja) * 2011-12-28 2013-07-18 Toda Kogyo Corp 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330529A (ja) * 2004-05-19 2005-12-02 Dowa Mining Co Ltd 球状銀粉およびその製造方法
JP2007291513A (ja) * 2006-03-30 2007-11-08 Mitsui Mining & Smelting Co Ltd 銀粒子
CN102290117B (zh) * 2011-04-25 2013-03-06 深圳市唯特偶新材料股份有限公司 一种低温烧结纳米银浆及其制备方法
CN102407341B (zh) * 2011-10-27 2015-04-01 浙江光达电子科技有限公司 一种表面改性粒径混合银粉的制备方法以及表面改性粒径混合银粉

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006126614A1 (fr) * 2005-05-25 2006-11-30 Nihon Handa Co., Ltd. Composition d’argent sous forme de pâte, procédé de fabrication idoine, procédé de fabrication d’argent massif, argent massif, procédé de collage, et procédé de fabrication de carte à circuit
WO2007037440A1 (fr) * 2005-09-29 2007-04-05 Alpha Scientific, Corporation Poudre conductrice et procédé servant à produire celle-ci, pâte de poudre conductrice et procédé servant à produire la pâte de poudre conductrice
WO2008013274A1 (fr) * 2006-07-28 2008-01-31 Mitsubishi Materials Corporation Fines particules d'argent et procédés et matériel pour leur production
JP2011021255A (ja) * 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
JP2012077372A (ja) * 2010-10-06 2012-04-19 Sumitomo Metal Mining Co Ltd 銀粉及びその製造方法
JP2013139589A (ja) * 2011-12-28 2013-07-18 Toda Kogyo Corp 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017508888A (ja) * 2014-08-12 2017-03-30 シュゾー スマート アドバンスト コーティング テクノロジーズ カンパニー リミテッド 金属粉末の調製方法
KR20170088345A (ko) 2014-11-21 2017-08-01 닛신 엔지니어링 가부시키가이샤 은 미립자
US10144060B2 (en) 2014-11-21 2018-12-04 Nisshin Engineering Inc. Silver nanoparticles
JP2016108646A (ja) * 2014-12-03 2016-06-20 住友金属鉱山株式会社 コバルト粉の製造方法

Also Published As

Publication number Publication date
CN104520031A (zh) 2015-04-15
WO2014077043A1 (fr) 2014-05-22
KR20150028970A (ko) 2015-03-17

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