JP2014065797A - 蛍光体、発光装置、および蛍光体の製造方法 - Google Patents
蛍光体、発光装置、および蛍光体の製造方法 Download PDFInfo
- Publication number
- JP2014065797A JP2014065797A JP2012211074A JP2012211074A JP2014065797A JP 2014065797 A JP2014065797 A JP 2014065797A JP 2012211074 A JP2012211074 A JP 2012211074A JP 2012211074 A JP2012211074 A JP 2012211074A JP 2014065797 A JP2014065797 A JP 2014065797A
- Authority
- JP
- Japan
- Prior art keywords
- light
- phosphor
- light emitting
- wavelength
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000010521 absorption reaction Methods 0.000 claims abstract description 31
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 6
- 229910052788 barium Inorganic materials 0.000 claims abstract description 4
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 4
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 4
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 97
- 238000010304 firing Methods 0.000 claims description 22
- 239000002994 raw material Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 150000004767 nitrides Chemical class 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 238000001354 calcination Methods 0.000 claims 1
- 238000009877 rendering Methods 0.000 abstract description 11
- 230000005284 excitation Effects 0.000 abstract description 7
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000009102 absorption Effects 0.000 description 25
- 239000013078 crystal Substances 0.000 description 20
- 230000007547 defect Effects 0.000 description 15
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 230000031700 light absorption Effects 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052582 BN Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000000295 emission spectrum Methods 0.000 description 4
- 230000005298 paramagnetic effect Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000006103 coloring component Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001362 electron spin resonance spectrum Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- WABPQHHGFIMREM-VENIDDJXSA-N lead-201 Chemical compound [201Pb] WABPQHHGFIMREM-VENIDDJXSA-N 0.000 description 1
- WABPQHHGFIMREM-AHCXROLUSA-N lead-203 Chemical compound [203Pb] WABPQHHGFIMREM-AHCXROLUSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000004762 orthosilicates Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000009103 reabsorption Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- -1 sialon Chemical compound 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/7716—Chalcogenides
- C09K11/7718—Chalcogenides with alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/65—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
- C09K11/77218—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/55—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Abstract
【解決手段】250〜500nmの波長範囲内に発光ピークを有する光で励起した際に、500〜600nmの波長範囲内に発光ピークを示し、波長560nmの光に対する吸収係数α560nmが4×10−5以下である蛍光体。この蛍光体は下記一般式(1)で表わされる。
(M1−xCe)x)2yAlzSi10−zOuNw (1)
(ここで、MはBa、Sr、Ca、Mg、Li、Na、Kのうち一つ以上を含み、0<x≦1、0.8≦y≦1.1、2≦z≦3.5、u≦1、1.8≦z−u、13≦u+w≦15である)
【選択図】図1
Description
(M1−xCex)2yAlzSi10−zOuNw (1)
(ここで、
MはBa、Sr、Ca、Mg、Li、Na、およびKからなる群から選択される金属元素であり、
0<x≦1、
0.8≦y≦1.1、
2≦z≦3.5
u≦1、
1.8≦z−u、
13≦u+w≦15
である)
で表わされることを特徴とするものである。
(M1−xCex)2yAlzSi10−zOuNw (1)
(ここで、
MはBa、Sr、Ca、Mg、Li、Na、およびKからなる群から選択される金属元素であり、好ましくはSrであり、
0<x≦1、好ましくは0.001≦x≦0.5、
0.8≦y≦1.1、好ましくは0.85≦y≦1.06、
2≦z≦3.5、好ましくは2.5≦z≦3.3、
u≦1、好ましくは0.001≦u≦0.8、
1.8≦z−u、好ましくは2.0≦z−u、
13≦u+w≦15、好ましくは13.2≦u+w≦14.2、
である)
光吸収係数 = 光散乱係数×吸収率2/2/反射率
=3.96/粒径/密度*吸収率2/(1−吸収率)
Ce4+/Ce = 3.96/d/ρ×{Ry2/(1−Ry)−Rr2/(1−Rr)}×104
図2に示す発光装置においては、基材200の上に、リード201、202およびパッケージカップ203が配置されている。基材200およびパッケージカップ203は樹脂性である。パッケージカップ203は、上部が底部より広い凹部105を有しており、この凹部の側面は反射面204として作用する。
Sr原料、Ce原料、Si原料、およびAl原料として、Sr3N2、CeO2、Si3N4、およびAlNを用意し、バキュームグローブボックス中でそれぞれ秤量した。Sr3N2、CeCl2、Si3N4およびAlNの配合質量は、それぞれ2.993g、0.155g、5.262g、および1.537gとした。配合された原料粉体を、遊星ボールミルを用いて乾式混合した。
各焼成において、窒化ホウ素製の鞘を用いずに焼成を行ったほかは実施例1と同様の操作を行い、比較例1の蛍光体を得た。
得られた蛍光体の組成分析を行ったところ、以下の通りであった。
得られた蛍光体の常磁性欠陥を測定したところ、実施例1および比較例1の蛍光体について、それぞれ1.8×10−5spins/gおよび4.3×10−5spins/gであった。
これらの蛍光体を発光波長450nmに分光したキセノンランプで励起した場合の発光スペクトルを図4に示す。図4中、450nm近傍の半値幅の狭い発光は、励起光の反射であり、蛍光体の発光ではない。554nmをピーク波長として高い発光強度が確認され、実施例1の蛍光体は比較例1の蛍光体よりも高い発光強度が観測された。また、瞬間マルチチャンネル分光計により求めた半値幅は115nmであった。半値幅は発光装置から発せられる白色光の演色性の指標のひとつとなり、一般的に半値幅が広いほど演色性の高い白色光が得られやすい。半値幅が115nmであるので、実施例1の蛍光体を用いることで演色性に優れた白色光が得られやすいことが示される。
光吸収係数 = 光散乱係数*吸収率2/2/反射率
= 3.96/粒径/密度*吸収率2/(1−吸収率)
102 Si原子またはAl原子
103 O原子またはN原子
200 基材
201 リード
202 リード
203 パッケージカップ
204 反射面
205 凹部
206 発光チップ
207、108 ボンディングワイヤー
209 蛍光発光層
210 蛍光体
211 樹脂層
301 絶縁基板
302 発光素子
303 ボンディングワイヤー
304 内側透明樹脂層
305 蛍光発光層
306 外側透明樹脂層
307 蛍光体
308 樹脂層。
Claims (12)
- 250〜500nmの波長範囲内に発光ピークを有する光で励起した際に、500〜600nmの波長範囲内に発光ピークを示し、波長560nmの光に対する吸収係数α560nmが4×10−5以下であり、かつ下記一般式(1):
(M1−xCex)2yAlzSi10−zOuNw (1)
(ここで、
MはBa、Sr、Ca、Mg、Li、Na、およびKからなる群から選択される金属元素であり、
0<x≦1、
0.8≦y≦1.1、
2≦z≦3.5
u≦1、
1.8≦z−u、
13≦u+w≦15
である)
で表わされることを特徴とする蛍光体。 - MがSrである、請求項1に記載の蛍光体。
- 波長560nmの光に対する吸収係数α560nmと波長430nmの光に対する吸収係数α430nmの比α560nm/α430nmが5.5以下である、請求項1〜3のいずれか1項に記載の蛍光体。
- 250〜500nmの波長範囲内に発光ピークを有する光を発する発光素子と、
前記発光素子からの光を受けて黄色発光する蛍光体を含有する蛍光発光層と
を具備し、前記黄色発光蛍光体が、請求項1〜3のいずれか1項に記載の蛍光体であることを特徴とする発光装置。 - 前記蛍光発光層が、緑色発光する蛍光体および赤色発光する蛍光体をさらに含有する、請求項4に記載の発光装置。
- 250〜400nmの波長範囲内に発光ピークを有する光を発する発光素子と、
前記発光素子からの光を受けて黄色発光する蛍光体と前記発光素子からの光を受けて青色発光する蛍光体とを含有する蛍光発光層と
を具備し、前記黄色発光蛍光体が、請求項1〜5のいずれか1項に記載の蛍光体であることを特徴とする発光装置。 - 請求項1〜5のいずれか1項に記載の蛍光体の製造方法であって、
Mの窒化物および炭化物から選択されるM原料と、Alの窒化物、酸化物および炭化物から選択されるAl原料と、Siの窒化物、酸化物および炭化物から選択されるSi原料と、Ceの酸化物、窒化物および炭酸塩から選択されるCe原料とを混合して混合物を得る工程と、
前記混合物を焼成する工程と
を具備することを特徴とする製造方法。 - 前記混合物の焼成は、5気圧以上の圧力下、1500〜2000℃で行なわれることを特徴とする請求項9に記載の方法。
- 前記混合物の焼成は、窒素雰囲気中で行なわれることを特徴とする請求項7または8に記載の方法。
- 前記原料の混合物を蓋付きるつぼに投入して焼成する、請求項7−9のいずれか1項に記載の方法。
- 前記るつぼを、さらに蓋付きの外套容器内に配置したうえで焼成を行う、請求項10に記載の方法。
- 焼成後に生成物を洗浄する工程をさらに具備する、請求項7−11のいずれか1項に記載の方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012211074A JP5746672B2 (ja) | 2012-09-25 | 2012-09-25 | 蛍光体、発光装置、および蛍光体の製造方法 |
TW102108826A TW201412944A (zh) | 2012-09-25 | 2013-03-13 | 螢光物質,發光裝置與製造螢光物質的方法 |
EP13159292.5A EP2711410A1 (en) | 2012-09-25 | 2013-03-14 | Fluorescent substance, light-emitting device and method for producing fluorescent substance |
KR20130028596A KR101487592B1 (ko) | 2012-09-25 | 2013-03-18 | 형광 물질, 발광 장치 및 형광 물질의 제조 방법 |
US13/845,554 US8987986B2 (en) | 2012-09-25 | 2013-03-18 | Fluorescent substance, light-emitting device and method for producing fluorescent substance |
CN201310086523.8A CN103666470A (zh) | 2012-09-25 | 2013-03-19 | 荧光物质、发光器件以及用于生产荧光物质的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012211074A JP5746672B2 (ja) | 2012-09-25 | 2012-09-25 | 蛍光体、発光装置、および蛍光体の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014065797A true JP2014065797A (ja) | 2014-04-17 |
JP2014065797A5 JP2014065797A5 (ja) | 2014-05-29 |
JP5746672B2 JP5746672B2 (ja) | 2015-07-08 |
Family
ID=47891468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012211074A Expired - Fee Related JP5746672B2 (ja) | 2012-09-25 | 2012-09-25 | 蛍光体、発光装置、および蛍光体の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8987986B2 (ja) |
EP (1) | EP2711410A1 (ja) |
JP (1) | JP5746672B2 (ja) |
KR (1) | KR101487592B1 (ja) |
CN (1) | CN103666470A (ja) |
TW (1) | TW201412944A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5762929B2 (ja) * | 2011-11-16 | 2015-08-12 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
JP6081235B2 (ja) | 2013-03-07 | 2017-02-15 | 株式会社東芝 | 白色発光装置 |
JP2014181260A (ja) * | 2013-03-18 | 2014-09-29 | Toshiba Corp | 蛍光体、発光装置、および蛍光体の製造方法 |
JP2015157919A (ja) * | 2014-02-25 | 2015-09-03 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
JP2015187250A (ja) * | 2014-03-12 | 2015-10-29 | 株式会社東芝 | 蛍光体、その製造方法、およびその蛍光体を用いた発光装置 |
JP2016060844A (ja) * | 2014-09-18 | 2016-04-25 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
JP2016060891A (ja) * | 2014-09-22 | 2016-04-25 | 株式会社東芝 | 蛍光体、蛍光体の製造方法、およびそれを用いた発光装置 |
US9528876B2 (en) | 2014-09-29 | 2016-12-27 | Innovative Science Tools, Inc. | Solid state broad band near-infrared light source |
DE102021116016A1 (de) * | 2020-06-29 | 2021-12-30 | Panasonic Intellectual Property Management Co., Ltd. | Wellenlängenumwandlungsvorrichtung, projektor und fluoreszierendes keramikelement |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007037059A1 (ja) * | 2005-09-27 | 2007-04-05 | Dowa Electronics Co., Ltd. | 蛍光体およびその製造方法、並びに該蛍光体を用いた発光装置 |
WO2011024296A1 (ja) * | 2009-08-28 | 2011-03-03 | 株式会社 東芝 | 蛍光体の製造方法およびそれにより製造された蛍光体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10146719A1 (de) * | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
CN1839193B (zh) * | 2003-08-22 | 2010-05-05 | 独立行政法人物质·材料研究机构 | 氧氮化物荧光体和发光器具 |
US7524437B2 (en) * | 2005-03-04 | 2009-04-28 | Dowa Electronics Materials Co., Ltd. | Phosphor and manufacturing method of the same, and light emitting device using the phosphor |
JP4932248B2 (ja) | 2005-12-21 | 2012-05-16 | Necライティング株式会社 | 黄色発光蛍光体、それを用いた白色発光素子、およびそれを用いた照明装置 |
WO2007105631A1 (ja) * | 2006-03-10 | 2007-09-20 | Kabushiki Kaisha Toshiba | 蛍光体および発光装置 |
US8469760B2 (en) | 2006-03-31 | 2013-06-25 | Dowa Electronics Materials Co., Ltd. | Light emitting device and method for producing same |
JP4911578B2 (ja) * | 2006-06-06 | 2012-04-04 | シャープ株式会社 | 酸窒化物蛍光体および発光装置 |
JP5378644B2 (ja) * | 2006-09-29 | 2013-12-25 | Dowaホールディングス株式会社 | 窒化物蛍光体または酸窒化物蛍光体の製造方法 |
JP5592602B2 (ja) | 2008-07-31 | 2014-09-17 | 株式会社東芝 | 蛍光体およびそれを用いた発光装置 |
JP5127965B2 (ja) | 2010-09-02 | 2013-01-23 | 株式会社東芝 | 蛍光体およびそれを用いた発光装置 |
JP5851214B2 (ja) * | 2011-11-16 | 2016-02-03 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
JP5762929B2 (ja) * | 2011-11-16 | 2015-08-12 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
-
2012
- 2012-09-25 JP JP2012211074A patent/JP5746672B2/ja not_active Expired - Fee Related
-
2013
- 2013-03-13 TW TW102108826A patent/TW201412944A/zh unknown
- 2013-03-14 EP EP13159292.5A patent/EP2711410A1/en not_active Withdrawn
- 2013-03-18 KR KR20130028596A patent/KR101487592B1/ko active IP Right Grant
- 2013-03-18 US US13/845,554 patent/US8987986B2/en active Active
- 2013-03-19 CN CN201310086523.8A patent/CN103666470A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007037059A1 (ja) * | 2005-09-27 | 2007-04-05 | Dowa Electronics Co., Ltd. | 蛍光体およびその製造方法、並びに該蛍光体を用いた発光装置 |
WO2011024296A1 (ja) * | 2009-08-28 | 2011-03-03 | 株式会社 東芝 | 蛍光体の製造方法およびそれにより製造された蛍光体 |
Also Published As
Publication number | Publication date |
---|---|
EP2711410A1 (en) | 2014-03-26 |
US8987986B2 (en) | 2015-03-24 |
KR101487592B1 (ko) | 2015-01-29 |
JP5746672B2 (ja) | 2015-07-08 |
KR20140039956A (ko) | 2014-04-02 |
CN103666470A (zh) | 2014-03-26 |
TW201412944A (zh) | 2014-04-01 |
US20140084782A1 (en) | 2014-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5746672B2 (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
JP5586499B2 (ja) | 蛍光体の製造方法 | |
JP5129392B2 (ja) | 蛍光体の製造方法およびそれにより製造された蛍光体 | |
JP4836229B2 (ja) | 蛍光体および発光装置 | |
JP5762929B2 (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
US9068116B2 (en) | Luminescent material | |
KR20140113350A (ko) | 형광체 및 그것을 사용한 발광 장치 | |
JP2015157919A (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
JP6285100B2 (ja) | 蛍光体および発光装置 | |
JP2014224182A (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
JP6546304B2 (ja) | 蛍光体および発光装置 | |
JP2014181260A (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
US20160083648A1 (en) | Phosphor, method for producing the same, and light-emitting device using the same | |
JP2014177601A (ja) | 黄色発光蛍光体およびそれを用いた発光装置 | |
JP2014224184A (ja) | 蛍光体および発光装置 | |
JP2016060844A (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
JP2017036392A (ja) | 蛍光体、発光装置、および蛍光体の製造方法 | |
JP2014122304A (ja) | 黄色蛍光体およびその製造方法 | |
JP2008266385A (ja) | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140226 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140226 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140827 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140912 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150306 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150325 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150410 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150508 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5746672 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |