JP2014057061A5 - - Google Patents

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Publication number
JP2014057061A5
JP2014057061A5 JP2013183878A JP2013183878A JP2014057061A5 JP 2014057061 A5 JP2014057061 A5 JP 2014057061A5 JP 2013183878 A JP2013183878 A JP 2013183878A JP 2013183878 A JP2013183878 A JP 2013183878A JP 2014057061 A5 JP2014057061 A5 JP 2014057061A5
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JP
Japan
Prior art keywords
light emitting
molding member
emitting device
emitting chip
chip
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JP2013183878A
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English (en)
Japanese (ja)
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JP2014057061A (ja
JP6283483B2 (ja
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Priority claimed from KR1020120101820A external-priority patent/KR101997243B1/ko
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Publication of JP2014057061A publication Critical patent/JP2014057061A/ja
Publication of JP2014057061A5 publication Critical patent/JP2014057061A5/ja
Application granted granted Critical
Publication of JP6283483B2 publication Critical patent/JP6283483B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013183878A 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム Expired - Fee Related JP6283483B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0101820 2012-09-13
KR1020120101820A KR101997243B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 조명 시스템

Publications (3)

Publication Number Publication Date
JP2014057061A JP2014057061A (ja) 2014-03-27
JP2014057061A5 true JP2014057061A5 (OSRAM) 2016-10-20
JP6283483B2 JP6283483B2 (ja) 2018-02-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013183878A Expired - Fee Related JP6283483B2 (ja) 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム

Country Status (5)

Country Link
US (1) US9541254B2 (OSRAM)
EP (1) EP2709175B1 (OSRAM)
JP (1) JP6283483B2 (OSRAM)
KR (1) KR101997243B1 (OSRAM)
CN (1) CN103682036B (OSRAM)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101973613B1 (ko) * 2012-09-13 2019-04-29 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
JP6237181B2 (ja) 2013-12-06 2017-11-29 日亜化学工業株式会社 発光装置の製造方法
JP6191453B2 (ja) * 2013-12-27 2017-09-06 日亜化学工業株式会社 発光装置
TWI735232B (zh) * 2014-07-23 2021-08-01 新加坡商海特根微光學公司 光發射器或光偵測器模組及製造一光發射器或光偵測器模組之方法
KR102170218B1 (ko) * 2014-08-05 2020-10-26 엘지이노텍 주식회사 발광소자 패키지
JP6398626B2 (ja) * 2014-11-07 2018-10-03 日亜化学工業株式会社 発光装置の製造方法
KR20160083279A (ko) * 2014-12-30 2016-07-12 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조 방법
KR102335106B1 (ko) 2015-06-19 2021-12-03 삼성전자 주식회사 발광 소자 패키지 및 그 제조 방법
US10797209B2 (en) * 2016-02-05 2020-10-06 Maven Optronics Co., Ltd. Light emitting device with beam shaping structure and manufacturing method of the same
TWI583028B (zh) * 2016-02-05 2017-05-11 行家光電股份有限公司 具有光形調整結構之發光裝置及其製造方法
KR102528300B1 (ko) * 2016-03-10 2023-05-04 삼성디스플레이 주식회사 디스플레이 장치
KR102559840B1 (ko) * 2016-04-20 2023-07-27 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
KR102486308B1 (ko) * 2016-06-10 2023-01-10 삼성전자주식회사 디스플레이 모듈 및 이에 대한 코팅방법
JP6866580B2 (ja) * 2016-06-29 2021-04-28 日亜化学工業株式会社 発光装置及び光源
TWI626771B (zh) * 2016-07-26 2018-06-11 宏齊科技股份有限公司 發光二極體單元和薄型平面光源模組
CN110050353B (zh) 2016-12-15 2022-09-20 亮锐控股有限公司 具有高近场对比率的led模块
WO2018108734A1 (en) * 2016-12-15 2018-06-21 Lumileds Holding B.V. Led module with high near field contrast ratio
JP2018097351A (ja) * 2016-12-15 2018-06-21 パナソニックＩｐマネジメント株式会社 発光素子及び発光素子の製造方法
KR102680862B1 (ko) 2016-12-16 2024-07-03 삼성전자주식회사 반도체 발광장치
US20200013932A1 (en) * 2017-01-24 2020-01-09 Lg Innotek Co., Ltd. Semiconductor device package
KR102362004B1 (ko) * 2017-03-24 2022-02-15 엘지이노텍 주식회사 반도체 소자 패키지
DE102017105035B4 (de) * 2017-03-09 2024-09-26 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierendes bauteil und verfahren zum herstellen eines lichtemittierenden bauteils
CN109087982B (zh) * 2017-06-14 2021-04-30 光宝光电(常州)有限公司 紫外线发光二极管封装结构及其制造方法
US12274102B2 (en) * 2017-06-14 2025-04-08 Lite-On Opto Technology (Changzhou) Co., Ltd. Package structure
KR102388371B1 (ko) * 2017-06-19 2022-04-19 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
KR102464033B1 (ko) * 2017-09-19 2022-11-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체소자패키지
KR20200065074A (ko) * 2017-10-19 2020-06-08 루미레즈 엘엘씨 발광 디바이스 패키지
KR102481647B1 (ko) * 2018-01-31 2022-12-28 삼성전자주식회사 Led 모듈 및 조명 장치
TW201939768A (zh) * 2018-03-16 2019-10-01 聯京光電股份有限公司 光電封裝體
KR102555234B1 (ko) * 2018-04-27 2023-07-14 주식회사 루멘스 플렉시블 엘이디 조명 장치
TWI713237B (zh) * 2018-08-01 2020-12-11 大陸商光寶光電（常州）有限公司 發光二極體封裝結構
US11189764B2 (en) * 2018-11-22 2021-11-30 Nichia Corporation Light-emitting device and manufacturing method thereof
WO2020137855A1 (ja) 2018-12-28 2020-07-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US12199218B2 (en) * 2019-03-14 2025-01-14 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
CN112310056B (zh) 2019-08-02 2024-06-18 日亚化学工业株式会社 发光装置和面发光光源
US11916155B2 (en) * 2020-05-22 2024-02-27 Lite-On Opto Technology (Changzhou) Co., Ltd. Optoelectronic package having second encapsulant cover first encapsulant and photonic devices
JP7208548B2 (ja) * 2020-06-04 2023-01-19 日亜化学工業株式会社 面状光源および面状光源の製造方法
JP7277791B2 (ja) 2020-08-31 2023-05-19 日亜化学工業株式会社 発光装置および面状光源
JP7534210B2 (ja) * 2020-12-22 2024-08-14 サンコール株式会社 紫外線ｌｅｄユニット
CN114843253A (zh) * 2021-02-02 2022-08-02 光宝科技股份有限公司 发光装置
CN113285004A (zh) * 2021-05-25 2021-08-20 深圳市同一方光电技术有限公司 发光装置及发光装置制作方法
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2169733B1 (de) 1997-09-29 2017-07-19 OSRAM Opto Semiconductors GmbH Halbleiterlichtquelle
JP2002043625A (ja) * 2000-07-19 2002-02-08 Koha Co Ltd Ｌｅｄ装置
US20020017652A1 (en) 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
JP2004111882A (ja) * 2002-09-20 2004-04-08 Toyoda Gosei Co Ltd 発光装置
JP2007288050A (ja) * 2006-04-19 2007-11-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
CN102800786B (zh) * 2006-04-24 2015-09-16 克利公司 发光二极管和显示元件
TWI325644B (en) * 2007-01-03 2010-06-01 Chipmos Technologies Inc Chip package and manufacturing thereof
JP2008218511A (ja) * 2007-02-28 2008-09-18 Toyoda Gosei Co Ltd 半導体発光装置及びその製造方法
DE102007029369A1 (de) 2007-06-26 2009-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
JP2009038188A (ja) * 2007-08-01 2009-02-19 Toyoda Gosei Co Ltd 表示装置用ｌｅｄランプ及びｌｅｄ表示装置
JP5151301B2 (ja) * 2007-08-06 2013-02-27 日亜化学工業株式会社 半導体発光素子及びその製造方法
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
DE102010003321A1 (de) 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
DE102010026343A1 (de) * 2010-07-07 2012-03-29 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
DE102010038396B4 (de) * 2010-07-26 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Leuchtvorrichung damit
JP5886584B2 (ja) * 2010-11-05 2016-03-16 ローム株式会社 半導体発光装置
CN201956347U (zh) * 2010-11-30 2011-08-31 浙江彩虹光电有限公司 大功率led
CN102148298B (zh) * 2010-12-28 2013-01-23 广州市鸿利光电股份有限公司 多点点胶工艺及led器件
CN201918426U (zh) * 2010-12-28 2011-08-03 广州市鸿利光电股份有限公司 一种大功率led

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