JP2014057060A5 - - Google Patents

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Publication number
JP2014057060A5
JP2014057060A5 JP2013183676A JP2013183676A JP2014057060A5 JP 2014057060 A5 JP2014057060 A5 JP 2014057060A5 JP 2013183676 A JP2013183676 A JP 2013183676A JP 2013183676 A JP2013183676 A JP 2013183676A JP 2014057060 A5 JP2014057060 A5 JP 2014057060A5
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JP
Japan
Prior art keywords
light emitting
emitting device
lead frame
cavity
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013183676A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014057060A (ja
JP6312999B2 (ja
Filing date
Publication date
Priority claimed from KR1020120101821A external-priority patent/KR102033928B1/ko
Application filed filed Critical
Publication of JP2014057060A publication Critical patent/JP2014057060A/ja
Publication of JP2014057060A5 publication Critical patent/JP2014057060A5/ja
Application granted granted Critical
Publication of JP6312999B2 publication Critical patent/JP6312999B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013183676A 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム Expired - Fee Related JP6312999B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0101821 2012-09-13
KR1020120101821A KR102033928B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 조명 시스템

Publications (3)

Publication Number Publication Date
JP2014057060A JP2014057060A (ja) 2014-03-27
JP2014057060A5 true JP2014057060A5 (OSRAM) 2016-10-20
JP6312999B2 JP6312999B2 (ja) 2018-04-18

Family

ID=48874933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013183676A Expired - Fee Related JP6312999B2 (ja) 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム

Country Status (5)

Country Link
US (2) US9318675B2 (OSRAM)
EP (1) EP2709174B1 (OSRAM)
JP (1) JP6312999B2 (OSRAM)
KR (1) KR102033928B1 (OSRAM)
CN (1) CN103682068B (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
DE102014101557A1 (de) * 2014-02-07 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016035508A1 (ja) * 2014-09-01 2016-03-10 シャープ株式会社 発光装置
JP6532200B2 (ja) 2014-09-04 2019-06-19 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP6862141B2 (ja) * 2015-10-14 2021-04-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び照明装置
KR20170064673A (ko) * 2015-12-02 2017-06-12 (주)포인트엔지니어링 칩기판
JP2017135148A (ja) * 2016-01-25 2017-08-03 スタンレー電気株式会社 半導体装置
JP6387973B2 (ja) 2016-01-27 2018-09-12 日亜化学工業株式会社 発光装置
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP1563909S (OSRAM) * 2016-03-24 2016-11-21
JP1563908S (OSRAM) * 2016-03-24 2016-11-21
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
US10411169B2 (en) * 2017-02-03 2019-09-10 Nichia Corporation Light emitting device having leads in resin package
US10438990B2 (en) * 2017-02-13 2019-10-08 Fuji Xerox Co., Ltd. Light-emitting component, light-emitting device, and image forming apparatus
JP6669208B2 (ja) * 2018-08-02 2020-03-18 日亜化学工業株式会社 発光装置
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
KR101970938B1 (ko) * 2019-02-11 2019-04-19 진재언 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치
US11417808B2 (en) 2019-09-12 2022-08-16 Nichia Corporation Light emitting device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832118A (ja) * 1994-07-19 1996-02-02 Rohm Co Ltd 発光ダイオード
EP1435118B1 (de) 2001-08-21 2011-11-02 OSRAM Opto Semiconductors GmbH Gehäuse für ein oberflächenmontierbares strahlungsemittierendes bauelement, oberflächenmontierbares strahlungsemittierendes bauelement und anordnung mit einer mehrzahl von oberflächenmontierbaren strahlungsemittierenden bauelementen
JP2005026401A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 発光ダイオード
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
JP2007142290A (ja) 2005-11-21 2007-06-07 Sharp Corp 発光装置
TWI284433B (en) * 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
JP5368982B2 (ja) * 2007-06-14 2013-12-18 ローム株式会社 半導体発光装置
KR20110018777A (ko) 2009-08-18 2011-02-24 삼성엘이디 주식회사 발광 다이오드 패키지
TWD139299S1 (zh) * 2009-11-11 2011-03-01 億光電子工業股份有限公司 發光二極體
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP5922326B2 (ja) * 2010-07-26 2016-05-24 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
KR101186000B1 (ko) * 2010-06-28 2012-09-25 엘지디스플레이 주식회사 발광 다이오드, 백라이트 유닛 및 이를 구비한 액정표시장치
DE102010026343A1 (de) * 2010-07-07 2012-03-29 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
DE102010027253B4 (de) * 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
US20120098006A1 (en) * 2010-10-22 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Light emitting diode package with photoresist reflector and method of manufacturing
JP2012142426A (ja) * 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
KR20120118686A (ko) * 2011-04-19 2012-10-29 엘지이노텍 주식회사 발광소자 모듈
JP2012234955A (ja) * 2011-04-28 2012-11-29 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
US8692282B2 (en) * 2011-10-27 2014-04-08 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same

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