JP2014049477A5 - - Google Patents

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Publication number
JP2014049477A5
JP2014049477A5 JP2012188799A JP2012188799A JP2014049477A5 JP 2014049477 A5 JP2014049477 A5 JP 2014049477A5 JP 2012188799 A JP2012188799 A JP 2012188799A JP 2012188799 A JP2012188799 A JP 2012188799A JP 2014049477 A5 JP2014049477 A5 JP 2014049477A5
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JP
Japan
Prior art keywords
substrate
pad
electronic component
resin layer
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012188799A
Other languages
English (en)
Japanese (ja)
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JP2014049477A (ja
JP5951414B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012188799A priority Critical patent/JP5951414B2/ja
Priority claimed from JP2012188799A external-priority patent/JP5951414B2/ja
Priority to US13/969,814 priority patent/US9036362B2/en
Publication of JP2014049477A publication Critical patent/JP2014049477A/ja
Publication of JP2014049477A5 publication Critical patent/JP2014049477A5/ja
Application granted granted Critical
Publication of JP5951414B2 publication Critical patent/JP5951414B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012188799A 2012-08-29 2012-08-29 電子部品内蔵基板及び電子部品内蔵基板の製造方法 Active JP5951414B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012188799A JP5951414B2 (ja) 2012-08-29 2012-08-29 電子部品内蔵基板及び電子部品内蔵基板の製造方法
US13/969,814 US9036362B2 (en) 2012-08-29 2013-08-19 Electronic component incorporated substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012188799A JP5951414B2 (ja) 2012-08-29 2012-08-29 電子部品内蔵基板及び電子部品内蔵基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014049477A JP2014049477A (ja) 2014-03-17
JP2014049477A5 true JP2014049477A5 (enExample) 2015-09-24
JP5951414B2 JP5951414B2 (ja) 2016-07-13

Family

ID=50187323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012188799A Active JP5951414B2 (ja) 2012-08-29 2012-08-29 電子部品内蔵基板及び電子部品内蔵基板の製造方法

Country Status (2)

Country Link
US (1) US9036362B2 (enExample)
JP (1) JP5951414B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140353824A1 (en) * 2013-05-29 2014-12-04 Huawei Technologies Co., Ltd. Package-on-package structure
KR20150025129A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
KR20150033937A (ko) 2013-09-25 2015-04-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제작 방법
JP6130312B2 (ja) * 2014-02-10 2017-05-17 新光電気工業株式会社 半導体装置及びその製造方法
US9679862B2 (en) * 2014-11-28 2017-06-13 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device having conductive bumps of varying heights
US9502368B2 (en) * 2014-12-16 2016-11-22 Intel Corporation Picture frame stiffeners for microelectronic packages
US20160190056A1 (en) * 2014-12-29 2016-06-30 SooSan Park Integrated circuit packaging system with package-on-package mechanism and method of manufacture thereof
JP6444269B2 (ja) * 2015-06-19 2018-12-26 新光電気工業株式会社 電子部品装置及びその製造方法
EP3376537A4 (en) * 2015-11-11 2019-04-17 KYOCERA Corporation PACKAGING FOR AN ELECTRONIC COMPONENT
KR101799668B1 (ko) * 2016-04-07 2017-11-20 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
JP7251951B2 (ja) 2018-11-13 2023-04-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
US12310132B2 (en) 2019-05-15 2025-05-20 Sony Semiconductor Solutions Corporation Semiconductor package, semiconductor package manufacturing method, and electronic device
JP7421357B2 (ja) * 2020-02-05 2024-01-24 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法
US12148867B2 (en) * 2021-01-15 2024-11-19 Foshan Nationstar Optoelectronics Co., Ltd Light-emitting device and displayer
JP2022140870A (ja) 2021-03-15 2022-09-29 株式会社村田製作所 回路モジュール
CN119325180B (zh) * 2023-07-17 2025-10-10 庆鼎精密电子（淮安）有限公司 电路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217340A (ja) * 2000-02-01 2001-08-10 Nec Corp 半導体装置及びその製造方法
US7145226B2 (en) * 2003-06-30 2006-12-05 Intel Corporation Scalable microelectronic package using conductive risers
JP4182140B2 (ja) * 2005-12-14 2008-11-19 新光電気工業株式会社 チップ内蔵基板
EP1962342A4 (en) * 2005-12-14 2010-09-01 Shinko Electric Ind Co SUBSTRATE WITH BUILT-IN CHIP AND METHOD FOR PRODUCING THE SUBSTRATE WITH BUILT-IN CHIP
JP2009135398A (ja) * 2007-11-29 2009-06-18 Ibiden Co Ltd 組合せ基板
KR101711045B1 (ko) * 2010-12-02 2017-03-02 삼성전자 주식회사 적층 패키지 구조물

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