JP2014029972A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2014029972A JP2014029972A JP2012187676A JP2012187676A JP2014029972A JP 2014029972 A JP2014029972 A JP 2014029972A JP 2012187676 A JP2012187676 A JP 2012187676A JP 2012187676 A JP2012187676 A JP 2012187676A JP 2014029972 A JP2014029972 A JP 2014029972A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- strip
- conductor
- connection pad
- element connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
半導体素子の電極と半導体素子接続パッドとを強固に接続するとともに、隣接する半導体素子接続パッド間の電気的な絶縁性が良好な配線基板を提供すること。
【解決手段】
半導体素子Sの搭載部1aを有する絶縁基板1と、絶縁基板1の上面に半導体素子Sの外周辺に直角方向に延在するよう並設された複数の帯状配線導体4と、帯状配線導体4上に帯状配線導体4と同じ幅で突起状に形成された導体層から成る半導体素子接続パッド5と、半導体素子接続パッド5を露出させるスリット状の開口部3aを有するソルダーレジスト層3とを具備する配線基板10であって、半導体素子接続パッド5は帯状配線導体4上に側面が露出するように被着された半田濡れ性に劣る第1の導体層7と、第1の導体層7上に被着された半田濡れ性に優れる第2の導体層8とから成る。
【選択図】図1
Description
1a 搭載部
3 ソルダーレジスト層
3a スリット状の開口部
4 帯状配線導体
5 半導体素子接続パッド
7 第1の導体層
8 第2の導体層
10 配線基板
S 半導体素子
Claims (3)
- 上面中央部に半導体素子が搭載される搭載部を有する絶縁基板と、該絶縁基板の上面に前記搭載部の外周部を前記半導体素子の外周辺に直角な方向に延在するように並設された複数の帯状配線導体と、前記外周部における前記帯状配線導体上に、前記帯状配線導体と同じ幅で突起状に形成された導体層から成る半導体素子接続パッドと、前記絶縁基板の上面に被着されており、前記半導体素子接続パッドを前記帯状配線導体の一部とともに露出させるように前記外周辺に沿う方向に延びるスリット状の開口部を有するソルダーレジスト層とを具備して成る配線基板であって、前記半導体素子接続パッドは、前記帯状配線導体上に側面が露出するように被着された半田濡れ性に劣る第1の導体層と、該第1の導体層上に被着された半田濡れ性に優れる第2の導体層とから成ることを特徴とする配線基板。
- 前記第1の導体層がニッケルめっき層であるとともに前記第2の導体層が金めっき層であることを特徴とする請求項1に記載の配線基板。
- 少なくとも前記開口部内に露出する前記帯状配線導体の表面に、酸化皮膜が形成されていることを特徴とする請求項1または2に記載の配線基板。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012187676A JP5942074B2 (ja) | 2012-06-29 | 2012-08-28 | 配線基板 |
CN201310244318.XA CN103515348A (zh) | 2012-06-29 | 2013-06-19 | 布线基板 |
TW102122118A TW201409624A (zh) | 2012-06-29 | 2013-06-21 | 配線基板 |
KR1020130073064A KR20140002511A (ko) | 2012-06-29 | 2013-06-25 | 배선 기판 |
US13/929,238 US20140001637A1 (en) | 2012-06-29 | 2013-06-27 | Wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012146360 | 2012-06-29 | ||
JP2012146360 | 2012-06-29 | ||
JP2012187676A JP5942074B2 (ja) | 2012-06-29 | 2012-08-28 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014029972A true JP2014029972A (ja) | 2014-02-13 |
JP5942074B2 JP5942074B2 (ja) | 2016-06-29 |
Family
ID=49777260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012187676A Expired - Fee Related JP5942074B2 (ja) | 2012-06-29 | 2012-08-28 | 配線基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140001637A1 (ja) |
JP (1) | JP5942074B2 (ja) |
KR (1) | KR20140002511A (ja) |
CN (1) | CN103515348A (ja) |
TW (1) | TW201409624A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020161564A (ja) * | 2019-03-25 | 2020-10-01 | 大口マテリアル株式会社 | 半導体素子搭載用基板 |
JP2020167207A (ja) * | 2019-03-28 | 2020-10-08 | 大口マテリアル株式会社 | 半導体素子搭載用部品、リードフレーム及び半導体素子搭載用基板 |
JP2021027073A (ja) * | 2019-07-31 | 2021-02-22 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014110473A1 (de) | 2014-07-24 | 2016-01-28 | Osram Opto Semiconductors Gmbh | Träger für ein elektrisches Bauelement |
TWI641097B (zh) * | 2016-08-12 | 2018-11-11 | 南茂科技股份有限公司 | 半導體封裝 |
KR102493591B1 (ko) * | 2018-06-26 | 2023-01-31 | 교세라 가부시키가이샤 | 배선 기판 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0964522A (ja) * | 1995-08-18 | 1997-03-07 | Sony Corp | プリント配線板及びその製造方法 |
JP2010206169A (ja) * | 2009-02-27 | 2010-09-16 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2012009586A (ja) * | 2010-06-24 | 2012-01-12 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及び配線基板の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100216839B1 (ko) * | 1996-04-01 | 1999-09-01 | 김규현 | Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조 |
TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
JP3910363B2 (ja) * | 2000-12-28 | 2007-04-25 | 富士通株式会社 | 外部接続端子 |
JP2004095923A (ja) * | 2002-09-02 | 2004-03-25 | Murata Mfg Co Ltd | 実装基板およびこの実装基板を用いた電子デバイス |
US8026128B2 (en) * | 2004-11-10 | 2011-09-27 | Stats Chippac, Ltd. | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
-
2012
- 2012-08-28 JP JP2012187676A patent/JP5942074B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-19 CN CN201310244318.XA patent/CN103515348A/zh active Pending
- 2013-06-21 TW TW102122118A patent/TW201409624A/zh unknown
- 2013-06-25 KR KR1020130073064A patent/KR20140002511A/ko not_active Application Discontinuation
- 2013-06-27 US US13/929,238 patent/US20140001637A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0964522A (ja) * | 1995-08-18 | 1997-03-07 | Sony Corp | プリント配線板及びその製造方法 |
JP2010206169A (ja) * | 2009-02-27 | 2010-09-16 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2012009586A (ja) * | 2010-06-24 | 2012-01-12 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及び配線基板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020161564A (ja) * | 2019-03-25 | 2020-10-01 | 大口マテリアル株式会社 | 半導体素子搭載用基板 |
JP2020167207A (ja) * | 2019-03-28 | 2020-10-08 | 大口マテリアル株式会社 | 半導体素子搭載用部品、リードフレーム及び半導体素子搭載用基板 |
JP2021027073A (ja) * | 2019-07-31 | 2021-02-22 | 日亜化学工業株式会社 | 発光装置 |
JP7368696B2 (ja) | 2019-07-31 | 2023-10-25 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20140002511A (ko) | 2014-01-08 |
US20140001637A1 (en) | 2014-01-02 |
CN103515348A (zh) | 2014-01-15 |
JP5942074B2 (ja) | 2016-06-29 |
TW201409624A (zh) | 2014-03-01 |
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