JP2014024986A5 - - Google Patents
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- Publication number
- JP2014024986A5 JP2014024986A5 JP2012167360A JP2012167360A JP2014024986A5 JP 2014024986 A5 JP2014024986 A5 JP 2014024986A5 JP 2012167360 A JP2012167360 A JP 2012167360A JP 2012167360 A JP2012167360 A JP 2012167360A JP 2014024986 A5 JP2014024986 A5 JP 2014024986A5
- Authority
- JP
- Japan
- Prior art keywords
- fine particles
- average
- wax
- polyolefin resin
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012167360A JP6057589B2 (ja) | 2012-07-27 | 2012-07-27 | 微粒子及びそれを含む硬化性オルガノポリシロキサン組成物 |
| PCT/JP2013/070955 WO2014017671A1 (en) | 2012-07-27 | 2013-07-26 | Microparticles and curable organopolysiloxane composition containing the same |
| CN201380044266.XA CN104583297B (zh) | 2012-07-27 | 2013-07-26 | 微粒和包含该微粒的可固化有机聚硅氧烷组合物 |
| US14/417,476 US9227183B2 (en) | 2012-07-27 | 2013-07-26 | Microparticles and curable organopolysiloxane composition containing the same |
| KR20157004837A KR20150039791A (ko) | 2012-07-27 | 2013-07-26 | 마이크로 입자 및 이를 함유하는 경화성 오가노폴리실록산 조성물 |
| EP13750398.3A EP2877528B1 (en) | 2012-07-27 | 2013-07-26 | Microparticles and curable organopolysiloxane composition containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012167360A JP6057589B2 (ja) | 2012-07-27 | 2012-07-27 | 微粒子及びそれを含む硬化性オルガノポリシロキサン組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014024986A JP2014024986A (ja) | 2014-02-06 |
| JP2014024986A5 true JP2014024986A5 (enExample) | 2015-09-10 |
| JP6057589B2 JP6057589B2 (ja) | 2017-01-11 |
Family
ID=48998661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012167360A Active JP6057589B2 (ja) | 2012-07-27 | 2012-07-27 | 微粒子及びそれを含む硬化性オルガノポリシロキサン組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9227183B2 (enExample) |
| EP (1) | EP2877528B1 (enExample) |
| JP (1) | JP6057589B2 (enExample) |
| KR (1) | KR20150039791A (enExample) |
| CN (1) | CN104583297B (enExample) |
| WO (1) | WO2014017671A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3022803B1 (fr) * | 2014-06-27 | 2016-11-04 | Eurecat Sa | Procede pour limiter l'emission de poussieres a partir de grains de catalyseurs |
| TWI735496B (zh) * | 2015-12-22 | 2021-08-11 | 日商琳得科股份有限公司 | 硬化性組合物、硬化性組合物的製造方法、硬化物及硬化性組合物的使用方法 |
| US10800952B2 (en) * | 2016-03-09 | 2020-10-13 | Threebond Co., Ltd. | Curable resin composition, fuel cell, and sealing method |
| JP6656045B2 (ja) * | 2016-03-29 | 2020-03-04 | 信越化学工業株式会社 | 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法 |
| JP6699583B2 (ja) | 2017-02-14 | 2020-05-27 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物 |
| JP7099009B2 (ja) * | 2018-03-30 | 2022-07-12 | 住友ベークライト株式会社 | 放熱絶縁シート、および半導体装置 |
| US12404352B2 (en) | 2019-12-06 | 2025-09-02 | Nusil Technology Llc | Encapsulated catalyst for one-part organopolysiloxane systems and methods related thereto |
| JP2024002051A (ja) | 2022-06-23 | 2024-01-11 | 信越化学工業株式会社 | 硬化型シリコーン組成物、その製造方法と硬化方法、シリコーン硬化物とその製造方法、並びに［２＋２＋２］環化付加反応生成物とその製造方法 |
| EP4638603A1 (en) | 2022-12-23 | 2025-10-29 | Dow Silicones Corporation | Method of making curable thermally conductive composition |
| CN120958074A (zh) | 2023-04-27 | 2025-11-14 | 美国陶氏有机硅公司 | 可固化导热组合物 |
| WO2025025202A1 (en) | 2023-08-03 | 2025-02-06 | Dow Silicones Corporation | Curable thermally conductive composition |
| WO2025065334A1 (en) | 2023-09-27 | 2025-04-03 | Dow Silicones Corporation | Thermally conductive silicone composition |
| WO2025065336A1 (en) | 2023-09-27 | 2025-04-03 | Dow Silicones Corporation | Curable silicone composition |
| WO2025129486A1 (en) | 2023-12-20 | 2025-06-26 | Dow Silicones Corporation | Silicone composition |
| WO2025166614A2 (en) | 2024-02-07 | 2025-08-14 | Dow Silicones Corporation | Method of making curable thermally conductive composition |
| CN119177024B (zh) * | 2024-11-25 | 2025-06-06 | 杭州之江有机硅化工有限公司 | 一种有机硅胶组合物、有机硅胶及其制备方法和应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4766176A (en) | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| US4784879A (en) | 1987-07-20 | 1988-11-15 | Dow Corning Corporation | Method for preparing a microencapsulated compound of a platinum group metal |
| US4874667A (en) | 1987-07-20 | 1989-10-17 | Dow Corning Corporation | Microencapsulated platinum-group metals and compounds thereof |
| CA1338201C (en) | 1988-04-08 | 1996-04-02 | Dow Corning Corporation | Method for microencapsulating a compound of a platinum group metal |
| JPH0214244A (ja) * | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| EP0363006A3 (en) | 1988-09-02 | 1991-01-09 | Dow Corning Corporation | A method for curing storage stable organosiloxane compositions containing microencapsulated ingredients |
| JPH0436355A (ja) * | 1990-05-31 | 1992-02-06 | Toray Dow Corning Silicone Co Ltd | シリコーンゴム組成物 |
| JP2948942B2 (ja) * | 1990-10-30 | 1999-09-13 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーンゴムスポンジ形成性組成物 |
| US5229363A (en) * | 1991-02-19 | 1993-07-20 | Merck & Co., Inc. | Cyclic hexapeptide compounds |
| JP3073884B2 (ja) | 1993-05-10 | 2000-08-07 | 信越化学工業株式会社 | 加熱硬化型シリコーンエラストマー組成物 |
| US5494750A (en) * | 1993-05-10 | 1996-02-27 | Shin-Etsu Chemical Co., Ltd. | Heat-curable silicone elastomer composition |
| JP3022091B2 (ja) | 1993-09-06 | 2000-03-15 | 信越化学工業株式会社 | 加熱硬化型シリコーンエラストマー組成物 |
| US6140446A (en) * | 1997-11-18 | 2000-10-31 | Shin-Etsu Chemical Co., Ltd. | Hydrosilylation catalysts and silicone compositions using the same |
| JP3500992B2 (ja) | 1997-11-19 | 2004-02-23 | 信越化学工業株式会社 | オルガノポリシロキサン組成物 |
| AU3666799A (en) * | 1998-04-27 | 1999-11-16 | Dow Chemical Company, The | Encapsulated active materials |
| JP4399692B2 (ja) * | 2000-08-31 | 2010-01-20 | 三菱化学株式会社 | ポリエチレンワックス変性オルガノポリシロキサンを含有するトナー組成物 |
| JP3593317B2 (ja) * | 2001-03-05 | 2004-11-24 | 独立行政法人 科学技術振興機構 | マイクロカプセル化金属触媒 |
| JP4733933B2 (ja) * | 2004-06-18 | 2011-07-27 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物 |
| DE102005031683A1 (de) | 2005-07-05 | 2007-01-25 | Dihart Ag | Maschinenwerkzeug |
| WO2007032481A1 (ja) * | 2005-09-15 | 2007-03-22 | Nihon Handa Co., Ltd. | 熱硬化性シリコーンゴム組成物、電子部品および電子機器 |
| GB0905488D0 (en) * | 2009-03-31 | 2009-05-13 | Dow Corning | Organopolysiloxane compositions and their production |
-
2012
- 2012-07-27 JP JP2012167360A patent/JP6057589B2/ja active Active
-
2013
- 2013-07-26 CN CN201380044266.XA patent/CN104583297B/zh not_active Expired - Fee Related
- 2013-07-26 WO PCT/JP2013/070955 patent/WO2014017671A1/en not_active Ceased
- 2013-07-26 EP EP13750398.3A patent/EP2877528B1/en not_active Not-in-force
- 2013-07-26 US US14/417,476 patent/US9227183B2/en active Active
- 2013-07-26 KR KR20157004837A patent/KR20150039791A/ko not_active Ceased