JP2014022751A - 磁気接合、磁気メモリ、改善された特性を有する磁気接合を提供するための方法、及びシステム - Google Patents

磁気接合、磁気メモリ、改善された特性を有する磁気接合を提供するための方法、及びシステム Download PDF

Info

Publication number
JP2014022751A
JP2014022751A JP2013150526A JP2013150526A JP2014022751A JP 2014022751 A JP2014022751 A JP 2014022751A JP 2013150526 A JP2013150526 A JP 2013150526A JP 2013150526 A JP2013150526 A JP 2013150526A JP 2014022751 A JP2014022751 A JP 2014022751A
Authority
JP
Japan
Prior art keywords
film
magnetic
magnetic junction
additional
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013150526A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014022751A5 (https=
Inventor
Park Chang-Man
チャン−マン・パク
William Erickson Dustin
ダスティン・ウィリアム・エリクソン
Tawfik Crawnbi Mohammed
モハマド・トウフィック・クロウンビ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2014022751A publication Critical patent/JP2014022751A/ja
Publication of JP2014022751A5 publication Critical patent/JP2014022751A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Drying Of Semiconductors (AREA)
JP2013150526A 2012-07-20 2013-07-19 磁気接合、磁気メモリ、改善された特性を有する磁気接合を提供するための方法、及びシステム Pending JP2014022751A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/553,965 2012-07-20
US13/553,965 US9129690B2 (en) 2012-07-20 2012-07-20 Method and system for providing magnetic junctions having improved characteristics

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019010149A Division JP2019071480A (ja) 2012-07-20 2019-01-24 磁気メモリを製造するための装置及び磁気接合を提供するための方法

Publications (2)

Publication Number Publication Date
JP2014022751A true JP2014022751A (ja) 2014-02-03
JP2014022751A5 JP2014022751A5 (https=) 2016-09-01

Family

ID=49946433

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013150526A Pending JP2014022751A (ja) 2012-07-20 2013-07-19 磁気接合、磁気メモリ、改善された特性を有する磁気接合を提供するための方法、及びシステム
JP2019010149A Pending JP2019071480A (ja) 2012-07-20 2019-01-24 磁気メモリを製造するための装置及び磁気接合を提供するための方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019010149A Pending JP2019071480A (ja) 2012-07-20 2019-01-24 磁気メモリを製造するための装置及び磁気接合を提供するための方法

Country Status (4)

Country Link
US (1) US9129690B2 (https=)
JP (2) JP2014022751A (https=)
KR (1) KR102056886B1 (https=)
CN (1) CN103579497B (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150112896A (ko) * 2014-03-27 2015-10-07 램 리써치 코포레이션 비휘발성 금속 재료의 에칭 방법
JP2017527097A (ja) * 2014-07-25 2017-09-14 スピン トランスファー テクノロジーズ インク Ｍｔｊメモリデバイスの製造方法
US10468588B2 (en) 2018-01-05 2019-11-05 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer
US10553787B2 (en) 2015-06-16 2020-02-04 Spin Memory, Inc. Precessional spin current structure for MRAM
US10580827B1 (en) 2018-11-16 2020-03-03 Spin Memory, Inc. Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching
US10615335B2 (en) 2015-04-21 2020-04-07 Spin Memory, Inc. Spin transfer torque structure for MRAM devices having a spin current injection capping layer
US10643680B2 (en) 2016-01-28 2020-05-05 Spin Memory, Inc. Memory cell having magnetic tunnel junction and thermal stability enhancement layer
US10665777B2 (en) 2017-02-28 2020-05-26 Spin Memory, Inc. Precessional spin current structure with non-magnetic insertion layer for MRAM
US10672976B2 (en) 2017-02-28 2020-06-02 Spin Memory, Inc. Precessional spin current structure with high in-plane magnetization for MRAM
US10734574B2 (en) 2015-04-21 2020-08-04 Spin Memory, Inc. Method of manufacturing high annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory
US10777736B2 (en) 2015-07-30 2020-09-15 Spin Memory, Inc. Polishing stop layer(s) for processing arrays of semiconductor elements
US11217745B2 (en) 2018-09-06 2022-01-04 Toshiba Memory Corporation Magnetoresistive memory device and method for manufacturing magnetoresistive memory device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130017267A (ko) * 2011-08-10 2013-02-20 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
US8901687B2 (en) 2012-11-27 2014-12-02 Industrial Technology Research Institute Magnetic device with a substrate, a sensing block and a repair layer
KR102078849B1 (ko) * 2013-03-11 2020-02-18 삼성전자 주식회사 자기저항 구조체, 이를 포함하는 자기 메모리 소자 및 자기저항 구조체의 제조 방법
US9305579B2 (en) * 2014-01-15 2016-04-05 HGST Netherlands B.V. Fabrication of side-by-side sensors for MIMO recording
US20150263272A1 (en) * 2014-03-13 2015-09-17 Kazuhiro Tomioka Manufacturing method of magnetic memory device and manufacturing apparatus of magnetic memory device
US9559296B2 (en) 2014-07-03 2017-01-31 Samsung Electronics Co., Ltd. Method for providing a perpendicular magnetic anisotropy magnetic junction usable in spin transfer torque magnetic devices using a sacrificial insertion layer
US9412786B1 (en) * 2014-10-02 2016-08-09 Everspin Technologies, Inc. Magnetoresistive device design and process integration with surrounding circuitry
KR102276541B1 (ko) 2014-11-27 2021-07-13 삼성전자주식회사 자기 메모리 장치 및 이의 제조 방법
US10177197B2 (en) * 2015-11-16 2019-01-08 Samsung Electronics Co., Ltd. Magnetic junctions having elongated free layers
KR102368033B1 (ko) 2017-09-20 2022-02-25 삼성전자주식회사 자기 저항 메모리 소자의 제조 방법
US10446743B2 (en) 2018-01-11 2019-10-15 Qualcomm Incorporated Double-patterned magneto-resistive random access memory (MRAM) for reducing magnetic tunnel junction (MTJ) pitch for increased MRAM bit cell density
US11211426B2 (en) 2019-10-01 2021-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Tunnel junction selector MRAM
KR102862389B1 (ko) 2020-01-31 2025-09-22 삼성전자주식회사 자기 기억 소자
CN112470275B (zh) * 2020-10-29 2024-01-09 长江存储科技有限责任公司 三维存储器件中的同轴阶梯结构及其形成方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101441A (ja) * 2003-09-26 2005-04-14 Anelva Corp 磁気抵抗多層膜
WO2007032379A1 (ja) * 2005-09-13 2007-03-22 Canon Anelva Corporation 磁気抵抗効果素子の製造方法及び製造装置
JP2008218829A (ja) * 2007-03-06 2008-09-18 Toshiba Corp 磁気抵抗素子及びその製造方法
JP2008235356A (ja) * 2007-03-16 2008-10-02 Toshiba Corp 半導体記憶装置及びその製造方法
JP2012007194A (ja) * 2010-06-22 2012-01-12 Fujifilm Corp 成膜装置および光電変換素子の製造方法
JP2012204408A (ja) * 2011-03-23 2012-10-22 Toshiba Corp 半導体装置の製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984529B2 (en) 2003-09-10 2006-01-10 Infineon Technologies Ag Fabrication process for a magnetic tunnel junction device
JP2005194589A (ja) * 2004-01-08 2005-07-21 Sony Corp 真空装置およびその制御方法
KR100561859B1 (ko) * 2004-01-16 2006-03-16 삼성전자주식회사 컨택홀이 없는 나노 크기의 자기터널접합 셀 형성 방법
JP2005268252A (ja) 2004-03-16 2005-09-29 Sony Corp 磁気記憶装置の製造方法
US20060168794A1 (en) * 2005-01-28 2006-08-03 Hitachi Global Storage Technologies Method to control mask profile for read sensor definition
US20060158790A1 (en) * 2005-01-14 2006-07-20 Hitachi Global Storage Technologies Magnetoresistive sensor having a novel junction structure for improved track width definition and pinned layer stability
US7639456B2 (en) 2005-10-06 2009-12-29 Hitachi Global Storage Technologies Netherlands B.V. Double mill process for patterning current perpendicular to plane (CPP) magnetoresistive devices to minimize barrier shorting and barrier damage
US7509729B2 (en) * 2006-04-25 2009-03-31 Hitachi Global Storage Technologies Netherlands B.V. Method for making a perpendicular magnetic recording write head
JP4630856B2 (ja) * 2006-09-29 2011-02-09 株式会社東芝 磁気抵抗効果素子の製造方法
US8472149B2 (en) 2007-10-01 2013-06-25 Tdk Corporation CPP type magneto-resistive effect device and magnetic disk system
JP4494523B2 (ja) * 2007-11-09 2010-06-30 キヤノンアネルバ株式会社 インライン型ウェハ搬送装置および基板搬送方法
CN101855717B (zh) * 2007-11-09 2011-10-19 佳能安内华股份有限公司 在线型晶圆输送装置
KR100939111B1 (ko) 2007-12-21 2010-01-28 주식회사 하이닉스반도체 자기터널접합소자 제조방법
JP2009176806A (ja) 2008-01-22 2009-08-06 Fujitsu Ltd 不揮発性磁気メモリ素子
JP4875037B2 (ja) * 2008-09-24 2012-02-15 株式会社東芝 磁気メモリ、その再生方法、および書き込み方法
US7829923B2 (en) 2008-10-23 2010-11-09 Qualcomm Incorporated Magnetic tunnel junction and method of fabrication
US7989224B2 (en) 2009-04-30 2011-08-02 International Business Machines Corporation Sidewall coating for non-uniform spin momentum-transfer magnetic tunnel junction current flow
US8422285B2 (en) * 2009-10-30 2013-04-16 Grandis, Inc. Method and system for providing dual magnetic tunneling junctions usable in spin transfer torque magnetic memories
US8159866B2 (en) * 2009-10-30 2012-04-17 Grandis, Inc. Method and system for providing dual magnetic tunneling junctions usable in spin transfer torque magnetic memories
US8254162B2 (en) * 2010-01-11 2012-08-28 Grandis, Inc. Method and system for providing magnetic tunneling junctions usable in spin transfer torque magnetic memories
JP2011198416A (ja) * 2010-03-19 2011-10-06 Toshiba Corp 磁気メモリ
US8981502B2 (en) 2010-03-29 2015-03-17 Qualcomm Incorporated Fabricating a magnetic tunnel junction storage element
JP2012014779A (ja) * 2010-06-30 2012-01-19 Ulvac Japan Ltd 磁気記録媒体の製造方法
US8374048B2 (en) * 2010-08-11 2013-02-12 Grandis, Inc. Method and system for providing magnetic tunneling junction elements having a biaxial anisotropy
US8399941B2 (en) * 2010-11-05 2013-03-19 Grandis, Inc. Magnetic junction elements having an easy cone anisotropy and a magnetic memory using such magnetic junction elements
CN102569642B (zh) * 2010-12-07 2016-08-03 三星电子株式会社 存储节点、包括该存储节点的磁存储器件及其制造方法
US8446761B2 (en) * 2010-12-31 2013-05-21 Grandis, Inc. Method and system for providing multiple logic cells in a single stack
US8432009B2 (en) * 2010-12-31 2013-04-30 Grandis, Inc. Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101441A (ja) * 2003-09-26 2005-04-14 Anelva Corp 磁気抵抗多層膜
WO2007032379A1 (ja) * 2005-09-13 2007-03-22 Canon Anelva Corporation 磁気抵抗効果素子の製造方法及び製造装置
JP2008218829A (ja) * 2007-03-06 2008-09-18 Toshiba Corp 磁気抵抗素子及びその製造方法
JP2008235356A (ja) * 2007-03-16 2008-10-02 Toshiba Corp 半導体記憶装置及びその製造方法
JP2012007194A (ja) * 2010-06-22 2012-01-12 Fujifilm Corp 成膜装置および光電変換素子の製造方法
JP2012204408A (ja) * 2011-03-23 2012-10-22 Toshiba Corp 半導体装置の製造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015192150A (ja) * 2014-03-27 2015-11-02 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 不揮発性金属材料のエッチング方法
KR102318520B1 (ko) * 2014-03-27 2021-10-28 램 리써치 코포레이션 비휘발성 금속 재료의 에칭 방법
KR20150112896A (ko) * 2014-03-27 2015-10-07 램 리써치 코포레이션 비휘발성 금속 재료의 에칭 방법
JP2017527097A (ja) * 2014-07-25 2017-09-14 スピン トランスファー テクノロジーズ インク Ｍｔｊメモリデバイスの製造方法
US10615335B2 (en) 2015-04-21 2020-04-07 Spin Memory, Inc. Spin transfer torque structure for MRAM devices having a spin current injection capping layer
US10734574B2 (en) 2015-04-21 2020-08-04 Spin Memory, Inc. Method of manufacturing high annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory
US10553787B2 (en) 2015-06-16 2020-02-04 Spin Memory, Inc. Precessional spin current structure for MRAM
US10777736B2 (en) 2015-07-30 2020-09-15 Spin Memory, Inc. Polishing stop layer(s) for processing arrays of semiconductor elements
US10643680B2 (en) 2016-01-28 2020-05-05 Spin Memory, Inc. Memory cell having magnetic tunnel junction and thermal stability enhancement layer
US10665777B2 (en) 2017-02-28 2020-05-26 Spin Memory, Inc. Precessional spin current structure with non-magnetic insertion layer for MRAM
US10672976B2 (en) 2017-02-28 2020-06-02 Spin Memory, Inc. Precessional spin current structure with high in-plane magnetization for MRAM
US11271149B2 (en) 2017-02-28 2022-03-08 Integrated Silicon Solution, (Cayman) Inc. Precessional spin current structure with nonmagnetic insertion layer for MRAM
US11355699B2 (en) 2017-02-28 2022-06-07 Integrated Silicon Solution, (Cayman) Inc. Precessional spin current structure for MRAM
US10468588B2 (en) 2018-01-05 2019-11-05 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer
US11217745B2 (en) 2018-09-06 2022-01-04 Toshiba Memory Corporation Magnetoresistive memory device and method for manufacturing magnetoresistive memory device
US10580827B1 (en) 2018-11-16 2020-03-03 Spin Memory, Inc. Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching

Also Published As

Publication number Publication date
US9129690B2 (en) 2015-09-08
CN103579497B (zh) 2017-04-12
US20140022839A1 (en) 2014-01-23
CN103579497A (zh) 2014-02-12
KR102056886B1 (ko) 2019-12-18
JP2019071480A (ja) 2019-05-09
KR20140012595A (ko) 2014-02-03

Similar Documents

Publication Publication Date Title
KR102056886B1 (ko) 자기 접합, 자기 메모리, 개선된 특성을 갖는 자기 접합을 제공하기 위한 방법 및 시스템
US9455400B2 (en) Magnetic tunnel junction for MRAM applications
US8722543B2 (en) Composite hard mask with upper sacrificial dielectric layer for the patterning and etching of nanometer size MRAM devices
US9269893B2 (en) Replacement conductive hard mask for multi-step magnetic tunnel junction (MTJ) etch
US11217744B2 (en) Magnetic memory device with multiple sidewall spacers covering sidewall of MTJ element and method for manufacturing the same
EP2412003B1 (en) Method of double patterning and etching magnetic tunnel junction structures for spin-transfer torque mram devices
US8133745B2 (en) Method of magnetic tunneling layer processes for spin-transfer torque MRAM
CN101312232A (zh) 旋转扭矩转移磁阻式随机存取存储器装置
CN108232002B (zh) 一种制备磁性隧道结阵列的方法
JP2015179844A (ja) 犠牲挿入層を用いるスピン移動トルク磁気デバイスで使用可能な垂直磁気異方性磁気接合を提供する方法
US11723217B2 (en) Magnetic tunnel junction element with RU hard mask for use in magnetic random-access memory
US9236561B2 (en) Method and system for providing multiple self-aligned logic cells in a single stack
US10868236B2 (en) Method for manufacturing reduced pitch magnetic random access memory pillar
CN113826216B (zh) 使用Ru及类金刚石碳硬掩模制造磁性存储器元件的方法
US10170518B2 (en) Self-assembled pattern process for fabricating magnetic junctions usable in spin transfer torque applications
US9666794B2 (en) Multi-stage element removal using absorption layers
US11329217B2 (en) Method for manufacturing a magnetic random-access memory device using post pillar formation annealing
US20120068280A1 (en) Magnetic Nano-Ring Device and Method of Fabrication

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20141226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160715

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160715

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170406

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170417

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170704

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20171127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180323

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20180409

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20180502

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190124