JP2013545294A5 - - Google Patents
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- Publication number
- JP2013545294A5 JP2013545294A5 JP2013534274A JP2013534274A JP2013545294A5 JP 2013545294 A5 JP2013545294 A5 JP 2013545294A5 JP 2013534274 A JP2013534274 A JP 2013534274A JP 2013534274 A JP2013534274 A JP 2013534274A JP 2013545294 A5 JP2013545294 A5 JP 2013545294A5
- Authority
- JP
- Japan
- Prior art keywords
- face
- semiconductor element
- opening
- peripheral surface
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010049300.7 | 2010-10-22 | ||
| DE102010049300A DE102010049300A1 (de) | 2010-10-22 | 2010-10-22 | Halbleiterelemente bestehend aus thermoelektrischem Material zum Einsatz in einem thermoelektrischen Modul |
| PCT/EP2011/068089 WO2012052393A2 (de) | 2010-10-22 | 2011-10-17 | Halbleiterelemente bestehend aus thermoelektrischem material zum einsatz in einem thermoelektrischen modul |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013545294A JP2013545294A (ja) | 2013-12-19 |
| JP2013545294A5 true JP2013545294A5 (enExample) | 2016-02-04 |
| JP6077449B2 JP6077449B2 (ja) | 2017-02-08 |
Family
ID=44802066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013534274A Expired - Fee Related JP6077449B2 (ja) | 2010-10-22 | 2011-10-17 | 熱電モジュールに使用する熱電材料製の半導体素子 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130228204A1 (enExample) |
| EP (1) | EP2630671B1 (enExample) |
| JP (1) | JP6077449B2 (enExample) |
| CN (1) | CN103180986A (enExample) |
| DE (1) | DE102010049300A1 (enExample) |
| WO (1) | WO2012052393A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3035542B1 (fr) * | 2015-04-27 | 2017-05-05 | Valeo Systemes Thermiques | Element thermoelectrique et dispositif comprenant un tel element thermoelectrique |
| KR102269412B1 (ko) * | 2015-06-09 | 2021-06-24 | 한국전기연구원 | 도핑재를 첨가하여 열전성능이 향상된 열전소재 |
| EP3588590B1 (en) * | 2018-06-22 | 2020-05-13 | CS Centro Stirling, S.Coop. | Thermoelectric module |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL270854A (enExample) * | 1960-11-05 | |||
| NL273589A (enExample) * | 1961-01-23 | |||
| US3794527A (en) * | 1970-01-15 | 1974-02-26 | Atomic Energy Commission | Thermoelectric converter |
| AU1729876A (en) * | 1975-10-07 | 1978-03-09 | Landecker K | Thermoelectric element |
| JPS63299383A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 熱電変換モジュ−ル |
| JP2936174B2 (ja) * | 1990-04-20 | 1999-08-23 | 松下電器産業株式会社 | 電子部品 |
| JP2836950B2 (ja) * | 1990-11-29 | 1998-12-14 | 松下電器産業株式会社 | 熱電半導体素子 |
| US5228923A (en) * | 1991-12-13 | 1993-07-20 | Implemed, Inc. | Cylindrical thermoelectric cells |
| JP2893258B1 (ja) * | 1998-01-30 | 1999-05-17 | セイコーインスツルメンツ株式会社 | 熱電素子及びその製造方法 |
| JPH11298052A (ja) * | 1998-04-09 | 1999-10-29 | Toshiba Corp | 熱電素子、熱電材料及び熱電材料の製造方法 |
| JP3462469B2 (ja) * | 2000-12-15 | 2003-11-05 | Smc株式会社 | 円形冷却プレート用異形サーモモジュール及びそれを用いた円形冷却プレート |
| JP2004152921A (ja) * | 2002-10-30 | 2004-05-27 | Komatsu Ltd | 熱電モジュール及びその製造方法 |
| US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
| JP2005302783A (ja) * | 2004-04-06 | 2005-10-27 | Toshiba Corp | 熱電変換モジュール及びその形状評価装置及び形状評価方法 |
| JP4747512B2 (ja) * | 2004-05-14 | 2011-08-17 | 大日本印刷株式会社 | 熱電変換材料およびその製造方法 |
| JP4850070B2 (ja) * | 2004-10-18 | 2012-01-11 | 義臣 近藤 | ペルチェ素子又はゼーベック素子の製造方法 |
| CN1991277A (zh) * | 2005-12-31 | 2007-07-04 | 曹知光 | 高效低耗热电组件 |
| DE102006039024A1 (de) * | 2006-08-19 | 2008-02-21 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Thermogenerator |
| JP5499317B2 (ja) * | 2009-03-03 | 2014-05-21 | 学校法人東京理科大学 | 熱電変換素子及び熱電変換モジュール |
-
2010
- 2010-10-22 DE DE102010049300A patent/DE102010049300A1/de not_active Withdrawn
-
2011
- 2011-10-17 JP JP2013534274A patent/JP6077449B2/ja not_active Expired - Fee Related
- 2011-10-17 CN CN2011800508579A patent/CN103180986A/zh active Pending
- 2011-10-17 WO PCT/EP2011/068089 patent/WO2012052393A2/de not_active Ceased
- 2011-10-17 EP EP11770440.3A patent/EP2630671B1/de not_active Not-in-force
-
2013
- 2013-04-22 US US13/867,615 patent/US20130228204A1/en not_active Abandoned
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