JP2013545294A - 熱電モジュールに使用する熱電材料製の半導体素子 - Google Patents
熱電モジュールに使用する熱電材料製の半導体素子 Download PDFInfo
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- JP2013545294A JP2013545294A JP2013534274A JP2013534274A JP2013545294A JP 2013545294 A JP2013545294 A JP 2013545294A JP 2013534274 A JP2013534274 A JP 2013534274A JP 2013534274 A JP2013534274 A JP 2013534274A JP 2013545294 A JP2013545294 A JP 2013545294A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 97
- 239000000463 material Substances 0.000 title claims abstract description 44
- 230000002093 peripheral effect Effects 0.000 claims description 51
- 230000000694 effects Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
Abstract
【選択図】図1
Description
2…第1の端面
3…第2の端面
4…熱電材料
5…円周方向
6…半径方向
7…開口
8…断面の平面
9…サイズ
10…領域
11…外周面
12…内周面
13…前側
14…後側
15…第1の側部
16…第2の側部
17…熱電モジュール
18…熱電素子
19…自動車両
20…方向
21…外筒
22…内筒
23…ダクト
24…中心軸線
25…低温媒体
26…高温媒体
27…高温側
28…低温側
29…金属ブリッジ
30…絶縁材
31…半径方向
32…高さ
Claims (7)
- 少なくとも1つの開口(7)を有する熱電材料(4)からなり、そして、第1の端面(2)および反対側に配置される第2の端面(3)を備える半導体素子(1)であって、前記熱電材料(4)を通っておよび前記開口(7)を通って前記第1の端面(2)と平行なまたは前記第2の端面(3)と平行な断面の平面(8)は、前記第1の端面(2)よりもわずか20%だけ大きく、そして同時に、前記第2の端面(3)よりも小さい領域(10)を形成する、半導体素子(1)。
- 前記断面の平面(8)は、少なくとも前記第1の端面(2)に対応する、請求項1に記載の半導体素子(1)。
- 前記少なくとも1つの開口(7)は、前記第1の端面(2)および前記第2の端面(3)から少し離れて配置される、請求項1または2に記載の半導体素子(1)。
- 環状のセグメント形状の半導体素子(1)であって、外周面(11)および内周面(12)ならびに円周方向(5)に延びる前側(13)および反対側に配置される後側(14)を有し、前記前側(13)および前記後側(14)は、前記外周面(11)に向けて半径方向(6)に狭まり、かつ相互間に熱電材料(4)を配置され、前記外周面(11)に対してまたは前記内周面(12)に対して平行な前記熱電材料(4)を通る複数の断面の平面(8)は、各々、前記内周面(12)のわずか120%の領域を含む、半導体素子(1)。
- 前記断面の平面(8)は、少なくとも前記内周面(12)に対応する、請求項4に記載の半導体素子(1)。
- 第1の端面(2)および反対側に配置される第2の端面(3)、前側(13)および反対側に配置される後側(14)、第1の側部(15)および反対側に配置される第2の側部(16)、ならびに相互間に配置される熱電材料(4)を有する半導体素子(1)であって、前記前側(13)および前記後側(14)は、前記第1の端面(2)から前記第2の端面(3)に向けて半径方向(20)に狭まり、前記第1の側部(15)および前記第2の側部(16)は、前記半径方向(20)に広がり、前記第1の端面(2)に対してまたは前記第2の端面(3)に対して平行な前記熱電材料(4)を通る複数の断面の平面(8)は、各々、わずか5%だけサイズ9が変化するだけの領域を有する、半導体素子(1)。
- 共に熱電素子(18)を形成する請求項1〜6のいずれか1項に記載の少なくとも2つの半導体素子(1)を有する熱電モジュール(17)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010049300.7 | 2010-10-22 | ||
DE102010049300A DE102010049300A1 (de) | 2010-10-22 | 2010-10-22 | Halbleiterelemente bestehend aus thermoelektrischem Material zum Einsatz in einem thermoelektrischen Modul |
PCT/EP2011/068089 WO2012052393A2 (de) | 2010-10-22 | 2011-10-17 | Halbleiterelemente bestehend aus thermoelektrischem material zum einsatz in einem thermoelektrischen modul |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013545294A true JP2013545294A (ja) | 2013-12-19 |
JP2013545294A5 JP2013545294A5 (ja) | 2016-02-04 |
JP6077449B2 JP6077449B2 (ja) | 2017-02-08 |
Family
ID=44802066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013534274A Active JP6077449B2 (ja) | 2010-10-22 | 2011-10-17 | 熱電モジュールに使用する熱電材料製の半導体素子 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130228204A1 (ja) |
EP (1) | EP2630671B1 (ja) |
JP (1) | JP6077449B2 (ja) |
CN (1) | CN103180986A (ja) |
DE (1) | DE102010049300A1 (ja) |
WO (1) | WO2012052393A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160144600A (ko) * | 2015-06-09 | 2016-12-19 | 한국전기연구원 | 도핑재를 첨가하여 열전성능이 향상된 열전소재 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3035542B1 (fr) * | 2015-04-27 | 2017-05-05 | Valeo Systemes Thermiques | Element thermoelectrique et dispositif comprenant un tel element thermoelectrique |
EP3588590B1 (en) * | 2018-06-22 | 2020-05-13 | CS Centro Stirling, S.Coop. | Thermoelectric module |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794527A (en) * | 1970-01-15 | 1974-02-26 | Atomic Energy Commission | Thermoelectric converter |
JPS63299383A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 熱電変換モジュ−ル |
JPH043475A (ja) * | 1990-04-20 | 1992-01-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH04199859A (ja) * | 1990-11-29 | 1992-07-21 | Matsushita Electric Ind Co Ltd | 熱電半導体素子 |
JPH11220183A (ja) * | 1998-01-30 | 1999-08-10 | Seiko Instruments Inc | 熱電素子及びその製造方法 |
JPH11298052A (ja) * | 1998-04-09 | 1999-10-29 | Toshiba Corp | 熱電素子、熱電材料及び熱電材料の製造方法 |
JP2004152921A (ja) * | 2002-10-30 | 2004-05-27 | Komatsu Ltd | 熱電モジュール及びその製造方法 |
JP2005302783A (ja) * | 2004-04-06 | 2005-10-27 | Toshiba Corp | 熱電変換モジュール及びその形状評価装置及び形状評価方法 |
JP2005325419A (ja) * | 2004-05-14 | 2005-11-24 | Dainippon Printing Co Ltd | 無機ナノ粒子およびその製造方法 |
WO2010101049A1 (ja) * | 2009-03-03 | 2010-09-10 | 学校法人東京理科大学 | 熱電変換素子及び熱電変換モジュール |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL270854A (ja) * | 1960-11-05 | |||
NL273589A (ja) * | 1961-01-23 | |||
AU1729876A (en) * | 1975-10-07 | 1978-03-09 | Landecker K | Thermoelectric element |
US5228923A (en) * | 1991-12-13 | 1993-07-20 | Implemed, Inc. | Cylindrical thermoelectric cells |
JP3462469B2 (ja) * | 2000-12-15 | 2003-11-05 | Smc株式会社 | 円形冷却プレート用異形サーモモジュール及びそれを用いた円形冷却プレート |
US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
JP4850070B2 (ja) * | 2004-10-18 | 2012-01-11 | 義臣 近藤 | ペルチェ素子又はゼーベック素子の製造方法 |
CN1991277A (zh) * | 2005-12-31 | 2007-07-04 | 曹知光 | 高效低耗热电组件 |
DE102006039024A1 (de) * | 2006-08-19 | 2008-02-21 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Thermogenerator |
-
2010
- 2010-10-22 DE DE102010049300A patent/DE102010049300A1/de not_active Withdrawn
-
2011
- 2011-10-17 WO PCT/EP2011/068089 patent/WO2012052393A2/de active Application Filing
- 2011-10-17 JP JP2013534274A patent/JP6077449B2/ja active Active
- 2011-10-17 CN CN2011800508579A patent/CN103180986A/zh active Pending
- 2011-10-17 EP EP11770440.3A patent/EP2630671B1/de active Active
-
2013
- 2013-04-22 US US13/867,615 patent/US20130228204A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794527A (en) * | 1970-01-15 | 1974-02-26 | Atomic Energy Commission | Thermoelectric converter |
JPS63299383A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 熱電変換モジュ−ル |
JPH043475A (ja) * | 1990-04-20 | 1992-01-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH04199859A (ja) * | 1990-11-29 | 1992-07-21 | Matsushita Electric Ind Co Ltd | 熱電半導体素子 |
JPH11220183A (ja) * | 1998-01-30 | 1999-08-10 | Seiko Instruments Inc | 熱電素子及びその製造方法 |
JPH11298052A (ja) * | 1998-04-09 | 1999-10-29 | Toshiba Corp | 熱電素子、熱電材料及び熱電材料の製造方法 |
JP2004152921A (ja) * | 2002-10-30 | 2004-05-27 | Komatsu Ltd | 熱電モジュール及びその製造方法 |
JP2005302783A (ja) * | 2004-04-06 | 2005-10-27 | Toshiba Corp | 熱電変換モジュール及びその形状評価装置及び形状評価方法 |
JP2005325419A (ja) * | 2004-05-14 | 2005-11-24 | Dainippon Printing Co Ltd | 無機ナノ粒子およびその製造方法 |
WO2010101049A1 (ja) * | 2009-03-03 | 2010-09-10 | 学校法人東京理科大学 | 熱電変換素子及び熱電変換モジュール |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160144600A (ko) * | 2015-06-09 | 2016-12-19 | 한국전기연구원 | 도핑재를 첨가하여 열전성능이 향상된 열전소재 |
KR102269412B1 (ko) | 2015-06-09 | 2021-06-24 | 한국전기연구원 | 도핑재를 첨가하여 열전성능이 향상된 열전소재 |
Also Published As
Publication number | Publication date |
---|---|
EP2630671B1 (de) | 2015-10-07 |
WO2012052393A3 (de) | 2012-08-30 |
EP2630671A2 (de) | 2013-08-28 |
US20130228204A1 (en) | 2013-09-05 |
DE102010049300A1 (de) | 2012-04-26 |
CN103180986A (zh) | 2013-06-26 |
WO2012052393A2 (de) | 2012-04-26 |
JP6077449B2 (ja) | 2017-02-08 |
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