JP2013545215A5 - - Google Patents
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- Publication number
- JP2013545215A5 JP2013545215A5 JP2013527306A JP2013527306A JP2013545215A5 JP 2013545215 A5 JP2013545215 A5 JP 2013545215A5 JP 2013527306 A JP2013527306 A JP 2013527306A JP 2013527306 A JP2013527306 A JP 2013527306A JP 2013545215 A5 JP2013545215 A5 JP 2013545215A5
- Authority
- JP
- Japan
- Prior art keywords
- paste
- microns
- range
- size
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37895910P | 2010-09-01 | 2010-09-01 | |
| US61/378,959 | 2010-09-01 | ||
| PCT/US2011/050145 WO2012031078A1 (en) | 2010-09-01 | 2011-09-01 | Via fill material for solar applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013545215A JP2013545215A (ja) | 2013-12-19 |
| JP2013545215A5 true JP2013545215A5 (cg-RX-API-DMAC7.html) | 2016-01-14 |
Family
ID=45773271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013527306A Pending JP2013545215A (ja) | 2010-09-01 | 2011-09-01 | 太陽光装置用のビアフィル材 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140332067A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2612331A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2013545215A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20130124482A (cg-RX-API-DMAC7.html) |
| CN (1) | CN103430240A (cg-RX-API-DMAC7.html) |
| BR (1) | BR112013004884A2 (cg-RX-API-DMAC7.html) |
| SG (1) | SG188359A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012031078A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6068474B2 (ja) * | 2011-09-09 | 2017-01-25 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 銀製の太陽電池接点 |
| US9374892B1 (en) * | 2011-11-01 | 2016-06-21 | Triton Microtechnologies | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components |
| KR20140114881A (ko) * | 2012-01-18 | 2014-09-29 | 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 | 유기 아연 화합물을 포함하는 태양 전지 금속화 |
| US20130319496A1 (en) * | 2012-06-01 | 2013-12-05 | Heraeus Precious Metals North America Conshohocken Llc | Low-metal content electroconductive paste composition |
| TWI659431B (zh) * | 2012-08-31 | 2019-05-11 | 德商賀利氏貴金屬公司 | 包含銀奈米粒子及球狀銀微米粒子之用於電極製備的導電膠 |
| US9763317B2 (en) * | 2013-03-14 | 2017-09-12 | Cisco Technology, Inc. | Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board |
| EP2787510B1 (en) * | 2013-04-02 | 2018-05-30 | Heraeus Deutschland GmbH & Co. KG | Particles comprising Al, Si and Mg in electro-conductive pastes and solar cell preparation |
| ES2649662T3 (es) * | 2013-07-09 | 2018-01-15 | Heraeus Deutschland GmbH & Co. KG | Una pasta electroconductora que comprende partículas de Ag con una distribución multimodal del diámetro en la preparación de electrodos en células solares MWT |
| US9966353B2 (en) * | 2013-12-25 | 2018-05-08 | Mitsubishi Materials Corporation | Power module substrate, method of producing same, and power module |
| CN103824613A (zh) * | 2014-03-18 | 2014-05-28 | 山西盛驰科技有限公司 | 一种高性能晶体硅太阳能电池背场的浆料 |
| WO2015179268A1 (en) * | 2014-05-19 | 2015-11-26 | Sun Chemical Corporation | A silver paste containing bismuth oxide and its use in solar cells |
| JP6164256B2 (ja) * | 2015-07-08 | 2017-07-19 | 住友ベークライト株式会社 | 熱伝導性組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法 |
| CN105097070B (zh) * | 2015-07-22 | 2017-05-31 | 深圳市春仰科技有限公司 | 太阳能电池正面导电银浆及其制备方法 |
| WO2018058181A1 (en) * | 2016-09-30 | 2018-04-05 | Dyesol Ltd | A solar module and a method of fabricating a solar module |
| CN110402490B (zh) | 2016-11-18 | 2024-03-12 | 申泰公司 | 填充材料以及基板通孔的填充方法 |
| WO2019191621A1 (en) | 2018-03-30 | 2019-10-03 | Samtec, Inc. | Electrically conductive vias and methods for producing same |
| US11710580B2 (en) | 2018-07-06 | 2023-07-25 | Senju Metal Industry Co., Ltd. | Electrically conductive paste and sintered body |
| CN109659067A (zh) * | 2018-12-06 | 2019-04-19 | 中国科学院山西煤炭化学研究所 | 用于perc晶体硅太阳能电池的正银浆料及制法 |
| EP4042479A4 (en) | 2019-09-30 | 2023-11-01 | Samtec Inc. | ELECTRICALLY CONDUCTIVE VIA HOLES AND METHODS OF PRODUCING THEM |
| DE102021000640A1 (de) | 2021-02-09 | 2022-08-11 | Azur Space Solar Power Gmbh | Verfahren zur Strukturierung einer Isolationsschicht auf einer Halbleiterscheibe |
| CN120452883B (zh) * | 2025-07-08 | 2025-10-31 | 浙江晶科新材料有限公司 | 银浆和太阳能电池 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012045A (ja) * | 1996-06-25 | 1998-01-16 | Sumitomo Metal Mining Co Ltd | 低温焼成用導電ペースト |
| US5874197A (en) * | 1997-09-18 | 1999-02-23 | E. I. Du Pont De Nemours And Company | Thermal assisted photosensitive composition and method thereof |
| US6384473B1 (en) * | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
| US20070095387A1 (en) * | 2003-11-27 | 2007-05-03 | Shuichi Fujii | Solar cell module |
| JP4805621B2 (ja) * | 2005-07-07 | 2011-11-02 | 株式会社ノリタケカンパニーリミテド | 導電性ペースト |
| JP4714633B2 (ja) * | 2006-04-25 | 2011-06-29 | シャープ株式会社 | 太陽電池電極用導電性ペースト |
| US20090095344A1 (en) * | 2006-04-25 | 2009-04-16 | Tomohiro Machida | Conductive Paste for Solar Cell Electrode |
| ES2651625T3 (es) * | 2007-04-25 | 2018-01-29 | Heraeus Precious Metals North America Conshohocken Llc | Formulaciones para conductores de película gruesa, que comprenden plata y níquel o aleaciones de plata y níquel y celdas solares fabricadas a partir de las mismas |
| US8309844B2 (en) * | 2007-08-29 | 2012-11-13 | Ferro Corporation | Thick film pastes for fire through applications in solar cells |
| CN101609849B (zh) * | 2009-07-13 | 2010-11-03 | 中南大学 | 太阳能电池正面电极用银导体浆料及其制备工艺 |
-
2011
- 2011-09-01 CN CN2011800525714A patent/CN103430240A/zh active Pending
- 2011-09-01 WO PCT/US2011/050145 patent/WO2012031078A1/en not_active Ceased
- 2011-09-01 US US13/819,862 patent/US20140332067A1/en not_active Abandoned
- 2011-09-01 BR BR112013004884A patent/BR112013004884A2/pt not_active Application Discontinuation
- 2011-09-01 SG SG2013015557A patent/SG188359A1/en unknown
- 2011-09-01 EP EP11822638.0A patent/EP2612331A4/en not_active Withdrawn
- 2011-09-01 JP JP2013527306A patent/JP2013545215A/ja active Pending
- 2011-09-01 KR KR1020137008310A patent/KR20130124482A/ko not_active Withdrawn
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