BR112013004884A2 - pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico - Google Patents

pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico

Info

Publication number
BR112013004884A2
BR112013004884A2 BR112013004884A BR112013004884A BR112013004884A2 BR 112013004884 A2 BR112013004884 A2 BR 112013004884A2 BR 112013004884 A BR112013004884 A BR 112013004884A BR 112013004884 A BR112013004884 A BR 112013004884A BR 112013004884 A2 BR112013004884 A2 BR 112013004884A2
Authority
BR
Brazil
Prior art keywords
producing
conductive paste
electronic device
electrical device
electrical
Prior art date
Application number
BR112013004884A
Other languages
English (en)
Inventor
Aziz S Shaikh
Caroline M Mckinley
George E Graddy Jr
Original Assignee
Ferro Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corp filed Critical Ferro Corp
Publication of BR112013004884A2 publication Critical patent/BR112013004884A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
    • H01L31/02245—Electrode arrangements specially adapted for back-contact solar cells for metallisation wrap-through [MWT] type solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Photovoltaic Devices (AREA)

Abstract

pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico. a presente invenção é dirigida a um material de enchimento de via para uso em aplicações solares que exibe baixa resistência em série alta resistência de shunt. o material de enchimento de via de acordo com a invenção inclui pó de prata, uma frita de vidro e um veículo.
BR112013004884A 2010-09-01 2011-09-01 pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico BR112013004884A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37895910P 2010-09-01 2010-09-01
PCT/US2011/050145 WO2012031078A1 (en) 2010-09-01 2011-09-01 Via fill material for solar applications

Publications (1)

Publication Number Publication Date
BR112013004884A2 true BR112013004884A2 (pt) 2016-05-03

Family

ID=45773271

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013004884A BR112013004884A2 (pt) 2010-09-01 2011-09-01 pasta condutiva, dispositivo eletrônico e método para produzir um dispositivo elétrico

Country Status (8)

Country Link
US (1) US20140332067A1 (pt)
EP (1) EP2612331A4 (pt)
JP (1) JP2013545215A (pt)
KR (1) KR20130124482A (pt)
CN (1) CN103430240A (pt)
BR (1) BR112013004884A2 (pt)
SG (1) SG188359A1 (pt)
WO (1) WO2012031078A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101896740B1 (ko) * 2011-09-09 2018-09-07 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 은 태양 전지 접점
US9374892B1 (en) * 2011-11-01 2016-06-21 Triton Microtechnologies Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components
KR20140114881A (ko) * 2012-01-18 2014-09-29 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 유기 아연 화합물을 포함하는 태양 전지 금속화
US20130319496A1 (en) * 2012-06-01 2013-12-05 Heraeus Precious Metals North America Conshohocken Llc Low-metal content electroconductive paste composition
KR20150052188A (ko) * 2012-08-31 2015-05-13 헤레우스 프레셔스 메탈스 게엠베하 운트 코. 카게 전극 제조에서 Ag 나노-입자 및 구형 Ag 마이크로-입자를 포함하는 전기-전도성 페이스트
US9763317B2 (en) * 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
EP2787510B1 (en) * 2013-04-02 2018-05-30 Heraeus Deutschland GmbH & Co. KG Particles comprising Al, Si and Mg in electro-conductive pastes and solar cell preparation
ES2649662T3 (es) * 2013-07-09 2018-01-15 Heraeus Deutschland GmbH & Co. KG Una pasta electroconductora que comprende partículas de Ag con una distribución multimodal del diámetro en la preparación de electrodos en células solares MWT
US9966353B2 (en) * 2013-12-25 2018-05-08 Mitsubishi Materials Corporation Power module substrate, method of producing same, and power module
CN103824613A (zh) * 2014-03-18 2014-05-28 山西盛驰科技有限公司 一种高性能晶体硅太阳能电池背场的浆料
US20170271535A1 (en) * 2014-05-19 2017-09-21 Sun Chemical Corporation A silver paste containing bismuth oxide and its use in solar cells
JP6164256B2 (ja) * 2015-07-08 2017-07-19 住友ベークライト株式会社 熱伝導性組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法
CN105097070B (zh) * 2015-07-22 2017-05-31 深圳市春仰科技有限公司 太阳能电池正面导电银浆及其制备方法
EP4173051A4 (en) * 2016-09-30 2023-12-27 Greatcell Energy Limited SOLAR MODULE AND METHOD FOR MANUFACTURING A SOLAR MODULE
WO2018094177A1 (en) 2016-11-18 2018-05-24 Samtec Inc. Filling materials and methods of filling through holes of a substrate
US12009225B2 (en) 2018-03-30 2024-06-11 Samtec, Inc. Electrically conductive vias and methods for producing same
EP3806111B1 (en) * 2018-07-06 2024-03-13 Senju Metal Industry Co., Ltd. Electrically conductive paste and sintered body
CN109659067A (zh) * 2018-12-06 2019-04-19 中国科学院山西煤炭化学研究所 用于perc晶体硅太阳能电池的正银浆料及制法
DE102021000640A1 (de) 2021-02-09 2022-08-11 Azur Space Solar Power Gmbh Verfahren zur Strukturierung einer Isolationsschicht auf einer Halbleiterscheibe

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012045A (ja) * 1996-06-25 1998-01-16 Sumitomo Metal Mining Co Ltd 低温焼成用導電ペースト
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
KR101087202B1 (ko) * 2003-11-27 2011-11-29 쿄세라 코포레이션 태양 전지 모듈
JP4805621B2 (ja) * 2005-07-07 2011-11-02 株式会社ノリタケカンパニーリミテド 導電性ペースト
EP2015367A4 (en) * 2006-04-25 2011-10-05 Sharp Kk ELECTRO-CONDUCTIVE PASTE FOR A SOLAR BATTERY ELECTRODE
JP4714633B2 (ja) * 2006-04-25 2011-06-29 シャープ株式会社 太陽電池電極用導電性ペースト
JP5530920B2 (ja) * 2007-04-25 2014-06-25 ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー 銀及びニッケル、もしくは、銀及びニッケル合金からなる厚膜導電体形成、及びそれから作られる太陽電池
US8309844B2 (en) * 2007-08-29 2012-11-13 Ferro Corporation Thick film pastes for fire through applications in solar cells
CN101609849B (zh) * 2009-07-13 2010-11-03 中南大学 太阳能电池正面电极用银导体浆料及其制备工艺

Also Published As

Publication number Publication date
CN103430240A (zh) 2013-12-04
KR20130124482A (ko) 2013-11-14
WO2012031078A1 (en) 2012-03-08
US20140332067A1 (en) 2014-11-13
JP2013545215A (ja) 2013-12-19
SG188359A1 (en) 2013-04-30
EP2612331A1 (en) 2013-07-10
EP2612331A4 (en) 2014-12-17

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B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]