KR20180084351A - 고분자 기반 광대역 전자파 차폐 필름 - Google Patents

고분자 기반 광대역 전자파 차폐 필름 Download PDF

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Publication number
KR20180084351A
KR20180084351A KR1020170007849A KR20170007849A KR20180084351A KR 20180084351 A KR20180084351 A KR 20180084351A KR 1020170007849 A KR1020170007849 A KR 1020170007849A KR 20170007849 A KR20170007849 A KR 20170007849A KR 20180084351 A KR20180084351 A KR 20180084351A
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KR
South Korea
Prior art keywords
shielding film
conducting polymer
emi shielding
film based
polymer
Prior art date
Application number
KR1020170007849A
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English (en)
Inventor
오일권
이시화
Original Assignee
한국과학기술원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한국과학기술원 filed Critical 한국과학기술원
Priority to KR1020170007849A priority Critical patent/KR20180084351A/ko
Priority to US15/480,234 priority patent/US20180206367A1/en
Publication of KR20180084351A publication Critical patent/KR20180084351A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/194—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
    • C01P2004/13—Nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　본 발명은 고분자 기반 광대역 전자파 차폐 필름에 관한 것으로서, 더욱 상세하게는 전도성 물질과 자성 물질이 복합적으로 결합된 다층 그래핀-나노튜브-금속산화물 나노구조체를 상기 고분자의 필러로 적용하여, 전자파 차폐 및 흡수 성능을 향상시킬 수 있는 고분자 기반 광대역 전자파 차폐 필름에 관한 것이다.
KR1020170007849A 2017-01-17 2017-01-17 고분자 기반 광대역 전자파 차폐 필름 KR20180084351A (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170007849A KR20180084351A (ko) 2017-01-17 2017-01-17 고분자 기반 광대역 전자파 차폐 필름
US15/480,234 US20180206367A1 (en) 2017-01-17 2017-04-05 Polymer-based, wideband electromagnetic wave shielding film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170007849A KR20180084351A (ko) 2017-01-17 2017-01-17 고분자 기반 광대역 전자파 차폐 필름

Publications (1)

Publication Number Publication Date
KR20180084351A true KR20180084351A (ko) 2018-07-25

Family

ID=62841536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170007849A KR20180084351A (ko) 2017-01-17 2017-01-17 고분자 기반 광대역 전자파 차폐 필름

Country Status (2)

Country Link
US (1) US20180206367A1 (ko)
KR (1) KR20180084351A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210055818A (ko) * 2019-11-07 2021-05-18 주식회사 포리스 플렉서블 emi 차폐필름

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CN108476604B (zh) * 2015-10-27 2020-11-03 汉高股份有限及两合公司 用于低频emi屏蔽的导电组合物
KR20200087384A (ko) 2019-01-10 2020-07-21 삼성디스플레이 주식회사 표시 장치
CN110760081B (zh) * 2019-10-22 2022-04-19 甘肃微纳科技有限公司 一种石墨烯吸波贴片的制备方法
CN110776658B (zh) * 2019-11-25 2022-06-21 西安工程大学 一种棉纤维基柔性碳复合薄膜及其制备方法
CN110922709B (zh) * 2019-12-18 2022-07-15 苏州世华新材料科技股份有限公司 一种导电聚合物复合吸波材料及其制备方法
CN112165849B (zh) * 2020-10-14 2022-05-13 南开大学 宽频可调石墨烯电磁波吸收材料及其制备方法
CN113054442B (zh) * 2021-03-11 2023-03-28 西北工业大学 一种多尺度三维石墨烯-碳纳米管-镍基柔性电磁吸波复合材料制备及其超结构设计方法
CN113214788B (zh) * 2021-05-12 2022-07-05 南开大学 一种多重结构设计的吸波材料的制备方法
CN115246994B (zh) * 2021-12-31 2024-04-05 浙江师范大学 一种导热-吸波一体化柔性材料及其制备方法与应用
CN114554822B (zh) * 2022-04-26 2022-07-15 南京信息工程大学 一种复合吸波薄膜材料及其制备方法
CN115465568B (zh) * 2022-10-08 2023-12-12 苏州盛达飞智能科技股份有限公司 一种软质电磁屏蔽包装材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210055818A (ko) * 2019-11-07 2021-05-18 주식회사 포리스 플렉서블 emi 차폐필름

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