JP2013543280A5 - - Google Patents
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- Publication number
- JP2013543280A5 JP2013543280A5 JP2013539854A JP2013539854A JP2013543280A5 JP 2013543280 A5 JP2013543280 A5 JP 2013543280A5 JP 2013539854 A JP2013539854 A JP 2013539854A JP 2013539854 A JP2013539854 A JP 2013539854A JP 2013543280 A5 JP2013543280 A5 JP 2013543280A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- wavelength converter
- semiconductor
- bonding layer
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 9
- 229920000642 polymer Polymers 0.000 claims 3
- 229920001709 polysilazane Polymers 0.000 claims 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41511510P | 2010-11-18 | 2010-11-18 | |
| US61/415,115 | 2010-11-18 | ||
| PCT/US2011/057635 WO2012067766A2 (en) | 2010-11-18 | 2011-10-25 | Light emitting diode component comprising polysilazane bonding layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013543280A JP2013543280A (ja) | 2013-11-28 |
| JP2013543280A5 true JP2013543280A5 (enExample) | 2014-12-18 |
| JP6132770B2 JP6132770B2 (ja) | 2017-05-24 |
Family
ID=46084569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013539854A Expired - Fee Related JP6132770B2 (ja) | 2010-11-18 | 2011-10-25 | ポリシラザン接合層を含む発光ダイオードコンポーネント |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9041034B2 (enExample) |
| EP (1) | EP2641277A4 (enExample) |
| JP (1) | JP6132770B2 (enExample) |
| KR (1) | KR20130128420A (enExample) |
| CN (1) | CN103222076B (enExample) |
| TW (1) | TWI581456B (enExample) |
| WO (1) | WO2012067766A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010034923A1 (de) * | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht |
| DE102011100728A1 (de) * | 2011-05-06 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| US20140217457A1 (en) * | 2011-05-25 | 2014-08-07 | Wavesquare Inc. | Light-emitting element chip and manufacturing method therefor |
| WO2014024068A2 (en) * | 2012-08-06 | 2014-02-13 | Koninklijke Philips N.V. | Highly stable qds-composites for solid state lighting and the method of making them through initiator-free polymerization |
| DE102012108939A1 (de) * | 2012-09-21 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement |
| DE102012217776A1 (de) * | 2012-09-28 | 2014-06-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| EP3118904B1 (en) * | 2013-07-18 | 2023-07-05 | Lumileds LLC | Dicing a wafer of light emitting semiconductor devices |
| KR20160035581A (ko) * | 2013-07-19 | 2016-03-31 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | 발광다이오드를 위한 봉지재 |
| TWI722242B (zh) * | 2013-07-29 | 2021-03-21 | 晶元光電股份有限公司 | 一種半導體裝置 |
| KR101767078B1 (ko) | 2013-07-29 | 2017-08-10 | 에피스타 코포레이션 | 반도체 소자를 선택적으로 전이하는 방법 |
| TWI766580B (zh) * | 2013-07-29 | 2022-06-01 | 晶元光電股份有限公司 | 一種半導體裝置 |
| US9935246B2 (en) | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| US9252121B2 (en) | 2014-01-23 | 2016-02-02 | International Business Machines Corporation | Thermal interface material on package |
| WO2015128460A1 (en) * | 2014-02-28 | 2015-09-03 | Az Electronic Materials (Germany) Gmbh | Hybrid material for optoelectronic applications |
| EP2913355A1 (en) * | 2014-02-28 | 2015-09-02 | AZ Electronic Materials (Germany) GmbH | Hybrid material for optoelectronic applications |
| KR102311677B1 (ko) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| JP7071118B2 (ja) * | 2014-08-19 | 2022-05-18 | ルミレッズ ホールディング ベーフェー | ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ |
| EP3295479B1 (en) * | 2015-05-13 | 2018-09-26 | Lumileds Holding B.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
| WO2017057454A1 (ja) * | 2015-09-30 | 2017-04-06 | 東レ株式会社 | 発光装置の製造方法および表示装置の製造方法 |
| KR102499548B1 (ko) * | 2015-11-06 | 2023-03-03 | 엘지이노텍 주식회사 | 발광패키지 및 이를 포함하는 차량용 헤드램프 |
| JP6957594B2 (ja) | 2016-07-18 | 2021-11-02 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | Led封止材料のための配合物 |
| EP3485520B1 (en) | 2016-07-18 | 2022-01-26 | Merck Patent GmbH | Formulation for an led encapsulation material |
| JP6911541B2 (ja) | 2017-05-31 | 2021-07-28 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| DE102017124559B4 (de) * | 2017-10-20 | 2024-05-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Epitaxie-Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement sowie Verfahren zur Herstellung des Epitaxie-Wellenlängenkonversionselements und des Licht emittierenden Halbleiterbauelements |
| EP3803976B1 (en) | 2018-05-24 | 2024-05-22 | Lumiode, Inc. | Led display structures and fabrication of same |
| WO2020083717A1 (en) * | 2018-10-22 | 2020-04-30 | Lumileds Holding B.V. | A method of manufacturing a light converting device |
| US11380252B2 (en) | 2018-12-21 | 2022-07-05 | Lumiode, Inc. | Addressing for emissive displays |
| US11584882B2 (en) * | 2020-02-14 | 2023-02-21 | Osram Opto Semiconductors Gmbh | Wavelength converter; method of its making and light-emitting device incorporating the element |
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| US3519516A (en) | 1967-02-17 | 1970-07-07 | Dmitry Yakovlevich Zhinkin | Method for bonding siloxane rubberbase vulcanizates using a polysilazane adhesive |
| US4642126A (en) | 1985-02-11 | 1987-02-10 | Norton Company | Coated abrasives with rapidly curable adhesives and controllable curvature |
| US4652274A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Coated abrasive product having radiation curable binder |
| CA1323949C (en) | 1987-04-02 | 1993-11-02 | Michael C. Palazzotto | Ternary photoinitiator system for addition polymerization |
| US4929704A (en) * | 1988-12-20 | 1990-05-29 | Hercules Incorporated | Isocyanate- and isothiocyanate-modified polysilazane ceramic precursors |
| US5208192A (en) * | 1990-01-12 | 1993-05-04 | Ethyl Corporation | Preceramic polysilazane compositions |
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| US5616650A (en) | 1993-11-05 | 1997-04-01 | Lanxide Technology Company, Lp | Metal-nitrogen polymer compositions comprising organic electrophiles |
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| JPH08236274A (ja) * | 1994-12-28 | 1996-09-13 | Tonen Corp | エレクトロルミネッセンス素子 |
| US5801073A (en) * | 1995-05-25 | 1998-09-01 | Charles Stark Draper Laboratory | Net-shape ceramic processing for electronic devices and packages |
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| DE69606942T2 (de) * | 1995-09-25 | 2000-10-05 | Dow Corning Corp., Midland | Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik |
| US6268432B1 (en) * | 1998-10-01 | 2001-07-31 | Dow Corning Toray Silicone Co. Ltd. | Filler/adhesive agent for display units containing a curable silicone composition |
| JP3503131B2 (ja) * | 1999-06-03 | 2004-03-02 | サンケン電気株式会社 | 半導体発光装置 |
| AU4139101A (en) | 1999-12-03 | 2001-06-12 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
| US6709806B2 (en) * | 2000-03-31 | 2004-03-23 | Kabushiki Kaisha Toshiba | Method of forming composite member |
| CN1222195C (zh) * | 2000-07-24 | 2005-10-05 | Tdk株式会社 | 发光元件 |
| JP2002267906A (ja) * | 2001-03-09 | 2002-09-18 | Hitachi Koki Co Ltd | 光学部品の接合構造 |
| JP2003118030A (ja) * | 2001-10-16 | 2003-04-23 | Asahi Glass Co Ltd | ガスバリヤ性有機基材およびそれを用いたエレクトロルミネッセンス素子 |
| JP2005056587A (ja) * | 2003-08-01 | 2005-03-03 | Toyota Industries Corp | El装置及びその製造方法 |
| JP4788109B2 (ja) * | 2003-10-28 | 2011-10-05 | パナソニック電工株式会社 | 半導体発光装置及びその製造方法 |
| TW200538522A (en) * | 2004-02-16 | 2005-12-01 | Hitachi Chemical Co Ltd | Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same |
| JP2005294820A (ja) * | 2004-03-12 | 2005-10-20 | Showa Denko Kk | Iii族窒化物半導体発光素子及びその形成方法、それを用いたランプ、光源 |
| WO2005088738A1 (en) | 2004-03-12 | 2005-09-22 | Showa Denko K.K. | Group iii nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same |
| JPWO2005121841A1 (ja) * | 2004-06-11 | 2008-04-10 | 日本ゼオン株式会社 | 反射防止積層体および光学部材 |
| US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US7402831B2 (en) | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US7297374B1 (en) | 2004-12-29 | 2007-11-20 | 3M Innovative Properties Company | Single- and multi-photon polymerizable pre-ceramic polymeric compositions |
| KR101370362B1 (ko) | 2005-03-14 | 2014-03-05 | 코닌클리케 필립스 엔.브이. | 다결정 세라믹 구조 내의 인광체 및 이를 포함하는 발광 요소 |
| JP2007042686A (ja) * | 2005-07-29 | 2007-02-15 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| JP5032043B2 (ja) * | 2006-03-27 | 2012-09-26 | 豊田合成株式会社 | フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置 |
| KR20090018623A (ko) | 2006-06-12 | 2009-02-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 재발광 반도체 구성 및 수렴 광학 요소를 갖는 led 소자 |
| WO2008083188A2 (en) | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Led light source with converging extractor in an optical element |
| JP4927019B2 (ja) | 2007-04-10 | 2012-05-09 | 信越化学工業株式会社 | 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法 |
| US20100283074A1 (en) * | 2007-10-08 | 2010-11-11 | Kelley Tommie W | Light emitting diode with bonded semiconductor wavelength converter |
| US20120181919A1 (en) | 2008-08-27 | 2012-07-19 | Osram Sylvania Inc. | Luminescent Ceramic Composite Converter and Method of Making the Same |
| US20100167002A1 (en) * | 2008-12-30 | 2010-07-01 | Vitex Systems, Inc. | Method for encapsulating environmentally sensitive devices |
| WO2010104534A1 (en) * | 2009-03-12 | 2010-09-16 | Dow Corning Corporation | Thermal interface materials and mehtods for their preparation and use |
| US20120018761A1 (en) * | 2009-03-27 | 2012-01-26 | Konica Minolta Opto, Inc. | Phosphor member, method of manufacturing phosphor member, and illuminating device |
| EP2427922A1 (en) * | 2009-05-05 | 2012-03-14 | 3M Innovative Properties Company | Re-emitting semiconductor construction with enhanced extraction efficiency |
| KR20120015337A (ko) * | 2009-05-05 | 2012-02-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Led에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법 |
-
2011
- 2011-10-25 WO PCT/US2011/057635 patent/WO2012067766A2/en not_active Ceased
- 2011-10-25 EP EP11841084.4A patent/EP2641277A4/en not_active Withdrawn
- 2011-10-25 CN CN201180055356.XA patent/CN103222076B/zh not_active Expired - Fee Related
- 2011-10-25 US US13/876,373 patent/US9041034B2/en active Active
- 2011-10-25 JP JP2013539854A patent/JP6132770B2/ja not_active Expired - Fee Related
- 2011-10-25 KR KR1020137015558A patent/KR20130128420A/ko not_active Abandoned
- 2011-11-15 TW TW100141513A patent/TWI581456B/zh not_active IP Right Cessation
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