JP2013543280A5 - - Google Patents
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- Publication number
- JP2013543280A5 JP2013543280A5 JP2013539854A JP2013539854A JP2013543280A5 JP 2013543280 A5 JP2013543280 A5 JP 2013543280A5 JP 2013539854 A JP2013539854 A JP 2013539854A JP 2013539854 A JP2013539854 A JP 2013539854A JP 2013543280 A5 JP2013543280 A5 JP 2013543280A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- wavelength converter
- semiconductor
- bonding layer
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 9
- 229920000642 polymer Polymers 0.000 claims 3
- 229920001709 polysilazane Polymers 0.000 claims 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41511510P | 2010-11-18 | 2010-11-18 | |
| US61/415,115 | 2010-11-18 | ||
| PCT/US2011/057635 WO2012067766A2 (en) | 2010-11-18 | 2011-10-25 | Light emitting diode component comprising polysilazane bonding layer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013543280A JP2013543280A (ja) | 2013-11-28 |
| JP2013543280A5 true JP2013543280A5 (enExample) | 2014-12-18 |
| JP6132770B2 JP6132770B2 (ja) | 2017-05-24 |
Family
ID=46084569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013539854A Expired - Fee Related JP6132770B2 (ja) | 2010-11-18 | 2011-10-25 | ポリシラザン接合層を含む発光ダイオードコンポーネント |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9041034B2 (enExample) |
| EP (1) | EP2641277A4 (enExample) |
| JP (1) | JP6132770B2 (enExample) |
| KR (1) | KR20130128420A (enExample) |
| CN (1) | CN103222076B (enExample) |
| TW (1) | TWI581456B (enExample) |
| WO (1) | WO2012067766A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010034923A1 (de) * | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht |
| DE102011100728A1 (de) | 2011-05-06 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| WO2012160604A1 (ja) * | 2011-05-25 | 2012-11-29 | Dowaエレクトロニクス株式会社 | 発光素子チップ及びその製造方法 |
| US9506627B2 (en) | 2012-08-06 | 2016-11-29 | Koninklijke Philips N.V. | Highly stable QDS-composites for solid state lighting and the method of making them through initiator-free polymerization |
| DE102012108939A1 (de) | 2012-09-21 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement |
| DE102012217776A1 (de) * | 2012-09-28 | 2014-06-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| US10707387B2 (en) * | 2013-07-18 | 2020-07-07 | Lumileds Llc | Dicing a wafer of light emitting devices |
| SG10201800517XA (en) * | 2013-07-19 | 2018-02-27 | Az Electronic Mat Luxembourg Sarl | Encapsulation material for light emitting diodes |
| TWI766580B (zh) * | 2013-07-29 | 2022-06-01 | 晶元光電股份有限公司 | 一種半導體裝置 |
| TWI722242B (zh) * | 2013-07-29 | 2021-03-21 | 晶元光電股份有限公司 | 一種半導體裝置 |
| JP6125730B2 (ja) | 2013-07-29 | 2017-05-10 | 晶元光▲電▼股▲ふん▼有限公司 | 半導体素子を選択的にトランスファーする方法 |
| US9935246B2 (en) | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| US9252121B2 (en) | 2014-01-23 | 2016-02-02 | International Business Machines Corporation | Thermal interface material on package |
| EP2913355A1 (en) * | 2014-02-28 | 2015-09-02 | AZ Electronic Materials (Germany) GmbH | Hybrid material for optoelectronic applications |
| EP3110881B1 (en) * | 2014-02-28 | 2018-06-06 | AZ Electronic Materials (Luxembourg) S.à.r.l. | Hybrid material for optoelectronic applications |
| KR102311677B1 (ko) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| JP7071118B2 (ja) * | 2014-08-19 | 2022-05-18 | ルミレッズ ホールディング ベーフェー | ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ |
| KR102572643B1 (ko) * | 2015-05-13 | 2023-08-31 | 루미리즈 홀딩 비.브이. | 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기 |
| WO2017057454A1 (ja) * | 2015-09-30 | 2017-04-06 | 東レ株式会社 | 発光装置の製造方法および表示装置の製造方法 |
| KR102499548B1 (ko) * | 2015-11-06 | 2023-03-03 | 엘지이노텍 주식회사 | 발광패키지 및 이를 포함하는 차량용 헤드램프 |
| EP3485520B1 (en) | 2016-07-18 | 2022-01-26 | Merck Patent GmbH | Formulation for an led encapsulation material |
| US10487243B2 (en) | 2016-07-18 | 2019-11-26 | Az Electronic Materials (Luxembourg) S.A.R.L. | Formulation for LED encapsulation material |
| JP6911541B2 (ja) * | 2017-05-31 | 2021-07-28 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| DE102017124559B4 (de) * | 2017-10-20 | 2024-05-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Epitaxie-Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement sowie Verfahren zur Herstellung des Epitaxie-Wellenlängenkonversionselements und des Licht emittierenden Halbleiterbauelements |
| WO2019226788A1 (en) | 2018-05-24 | 2019-11-28 | Lumiode, Inc. | Led display structures and fabrication of same |
| WO2020083717A1 (en) * | 2018-10-22 | 2020-04-30 | Lumileds Holding B.V. | A method of manufacturing a light converting device |
| WO2020131894A1 (en) | 2018-12-21 | 2020-06-25 | Lumiode, Inc. | Addressing for emissive displays |
| US11584882B2 (en) * | 2020-02-14 | 2023-02-21 | Osram Opto Semiconductors Gmbh | Wavelength converter; method of its making and light-emitting device incorporating the element |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3519516A (en) | 1967-02-17 | 1970-07-07 | Dmitry Yakovlevich Zhinkin | Method for bonding siloxane rubberbase vulcanizates using a polysilazane adhesive |
| US4642126A (en) | 1985-02-11 | 1987-02-10 | Norton Company | Coated abrasives with rapidly curable adhesives and controllable curvature |
| US4652274A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Coated abrasive product having radiation curable binder |
| CA1323949C (en) | 1987-04-02 | 1993-11-02 | Michael C. Palazzotto | Ternary photoinitiator system for addition polymerization |
| US4929704A (en) * | 1988-12-20 | 1990-05-29 | Hercules Incorporated | Isocyanate- and isothiocyanate-modified polysilazane ceramic precursors |
| US5208192A (en) * | 1990-01-12 | 1993-05-04 | Ethyl Corporation | Preceramic polysilazane compositions |
| US5457151A (en) | 1991-09-24 | 1995-10-10 | Southwest Research Institute | Polysilazane adhesive composition |
| US5616650A (en) | 1993-11-05 | 1997-04-01 | Lanxide Technology Company, Lp | Metal-nitrogen polymer compositions comprising organic electrophiles |
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| JPH08236274A (ja) * | 1994-12-28 | 1996-09-13 | Tonen Corp | エレクトロルミネッセンス素子 |
| US5801073A (en) * | 1995-05-25 | 1998-09-01 | Charles Stark Draper Laboratory | Net-shape ceramic processing for electronic devices and packages |
| JP3771298B2 (ja) * | 1995-05-30 | 2006-04-26 | クラリアント インターナショナル リミティド | ポリシラザン組成物 |
| DE69606942T2 (de) * | 1995-09-25 | 2000-10-05 | Dow Corning Corp., Midland | Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik |
| US6268432B1 (en) * | 1998-10-01 | 2001-07-31 | Dow Corning Toray Silicone Co. Ltd. | Filler/adhesive agent for display units containing a curable silicone composition |
| JP3503131B2 (ja) * | 1999-06-03 | 2004-03-02 | サンケン電気株式会社 | 半導体発光装置 |
| KR100700993B1 (ko) | 1999-12-03 | 2007-03-30 | 크리, 인코포레이티드 | 향상된 광 적출 구조체를 갖는 발광 다이오드 및 그 제조 방법 |
| US6709806B2 (en) * | 2000-03-31 | 2004-03-23 | Kabushiki Kaisha Toshiba | Method of forming composite member |
| CN1222195C (zh) | 2000-07-24 | 2005-10-05 | Tdk株式会社 | 发光元件 |
| JP2002267906A (ja) * | 2001-03-09 | 2002-09-18 | Hitachi Koki Co Ltd | 光学部品の接合構造 |
| JP2003118030A (ja) * | 2001-10-16 | 2003-04-23 | Asahi Glass Co Ltd | ガスバリヤ性有機基材およびそれを用いたエレクトロルミネッセンス素子 |
| JP2005056587A (ja) * | 2003-08-01 | 2005-03-03 | Toyota Industries Corp | El装置及びその製造方法 |
| JP4788109B2 (ja) * | 2003-10-28 | 2011-10-05 | パナソニック電工株式会社 | 半導体発光装置及びその製造方法 |
| TW200538522A (en) * | 2004-02-16 | 2005-12-01 | Hitachi Chemical Co Ltd | Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same |
| US7576365B2 (en) | 2004-03-12 | 2009-08-18 | Showa Denko K.K. | Group III nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same |
| JP2005294820A (ja) * | 2004-03-12 | 2005-10-20 | Showa Denko Kk | Iii族窒化物半導体発光素子及びその形成方法、それを用いたランプ、光源 |
| CN100480737C (zh) * | 2004-06-11 | 2009-04-22 | 日本瑞翁株式会社 | 防反射叠层体和光学元件 |
| US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US7402831B2 (en) | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US7297374B1 (en) * | 2004-12-29 | 2007-11-20 | 3M Innovative Properties Company | Single- and multi-photon polymerizable pre-ceramic polymeric compositions |
| US7879258B2 (en) | 2005-03-14 | 2011-02-01 | Koninklijke Philips Electronics N.V. | Phosphor in polycrystalline ceramic structure and a light-emitting element comprising same |
| JP2007042686A (ja) * | 2005-07-29 | 2007-02-15 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| JP5032043B2 (ja) * | 2006-03-27 | 2012-09-26 | 豊田合成株式会社 | フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置 |
| EP2036135A4 (en) | 2006-06-12 | 2013-11-13 | 3M Innovative Properties Co | LED ARRANGEMENT WITH REASSEMBLING SEMICONDUCTOR CONSTRUCTION AND CONVERGING OPTICAL ELEMENT |
| WO2008083188A2 (en) | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Led light source with converging extractor in an optical element |
| US7858198B2 (en) * | 2007-04-10 | 2010-12-28 | Shin-Etsu Chemical Co., Ltd. | Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet |
| WO2009048704A2 (en) * | 2007-10-08 | 2009-04-16 | 3M Innovative Properties Company | Light emitting diode with bonded semiconductor wavelength converter |
| US20120181919A1 (en) * | 2008-08-27 | 2012-07-19 | Osram Sylvania Inc. | Luminescent Ceramic Composite Converter and Method of Making the Same |
| US20100167002A1 (en) * | 2008-12-30 | 2010-07-01 | Vitex Systems, Inc. | Method for encapsulating environmentally sensitive devices |
| US8440312B2 (en) * | 2009-03-12 | 2013-05-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| WO2010110204A1 (ja) * | 2009-03-27 | 2010-09-30 | コニカミノルタオプト株式会社 | 蛍光体部材、蛍光体部材の製造方法、及び照明装置 |
| KR20120016262A (ko) * | 2009-05-05 | 2012-02-23 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 향상된 추출 효율을 갖는 재발광 반도체 구조물 |
| CN102804422A (zh) * | 2009-05-05 | 2012-11-28 | 3M创新有限公司 | 用于与led结合使用的重发光半导体载流子器件及其制造方法 |
-
2011
- 2011-10-25 JP JP2013539854A patent/JP6132770B2/ja not_active Expired - Fee Related
- 2011-10-25 EP EP11841084.4A patent/EP2641277A4/en not_active Withdrawn
- 2011-10-25 KR KR1020137015558A patent/KR20130128420A/ko not_active Abandoned
- 2011-10-25 US US13/876,373 patent/US9041034B2/en active Active
- 2011-10-25 WO PCT/US2011/057635 patent/WO2012067766A2/en not_active Ceased
- 2011-10-25 CN CN201180055356.XA patent/CN103222076B/zh not_active Expired - Fee Related
- 2011-11-15 TW TW100141513A patent/TWI581456B/zh not_active IP Right Cessation
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