JP6132770B2 - ポリシラザン接合層を含む発光ダイオードコンポーネント - Google Patents

ポリシラザン接合層を含む発光ダイオードコンポーネント Download PDF

Info

Publication number
JP6132770B2
JP6132770B2 JP2013539854A JP2013539854A JP6132770B2 JP 6132770 B2 JP6132770 B2 JP 6132770B2 JP 2013539854 A JP2013539854 A JP 2013539854A JP 2013539854 A JP2013539854 A JP 2013539854A JP 6132770 B2 JP6132770 B2 JP 6132770B2
Authority
JP
Japan
Prior art keywords
polysilazane
led
wavelength converter
semiconductor
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013539854A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013543280A (ja
JP2013543280A5 (enExample
Inventor
グオピン マオ,
グオピン マオ,
スティーブン ジェー. ズナメロスキー,
スティーブン ジェー. ズナメロスキー,
ユー ヤン,
ユー ヤン,
テリー エル. スミス,
テリー エル. スミス,
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2013543280A publication Critical patent/JP2013543280A/ja
Publication of JP2013543280A5 publication Critical patent/JP2013543280A5/ja
Application granted granted Critical
Publication of JP6132770B2 publication Critical patent/JP6132770B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
JP2013539854A 2010-11-18 2011-10-25 ポリシラザン接合層を含む発光ダイオードコンポーネント Expired - Fee Related JP6132770B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41511510P 2010-11-18 2010-11-18
US61/415,115 2010-11-18
PCT/US2011/057635 WO2012067766A2 (en) 2010-11-18 2011-10-25 Light emitting diode component comprising polysilazane bonding layer

Publications (3)

Publication Number Publication Date
JP2013543280A JP2013543280A (ja) 2013-11-28
JP2013543280A5 JP2013543280A5 (enExample) 2014-12-18
JP6132770B2 true JP6132770B2 (ja) 2017-05-24

Family

ID=46084569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013539854A Expired - Fee Related JP6132770B2 (ja) 2010-11-18 2011-10-25 ポリシラザン接合層を含む発光ダイオードコンポーネント

Country Status (7)

Country Link
US (1) US9041034B2 (enExample)
EP (1) EP2641277A4 (enExample)
JP (1) JP6132770B2 (enExample)
KR (1) KR20130128420A (enExample)
CN (1) CN103222076B (enExample)
TW (1) TWI581456B (enExample)
WO (1) WO2012067766A2 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010034923A1 (de) * 2010-08-20 2012-02-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht
DE102011100728A1 (de) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
US20140217457A1 (en) * 2011-05-25 2014-08-07 Wavesquare Inc. Light-emitting element chip and manufacturing method therefor
WO2014024068A2 (en) * 2012-08-06 2014-02-13 Koninklijke Philips N.V. Highly stable qds-composites for solid state lighting and the method of making them through initiator-free polymerization
DE102012108939A1 (de) * 2012-09-21 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement
DE102012217776A1 (de) * 2012-09-28 2014-06-12 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
EP3118904B1 (en) * 2013-07-18 2023-07-05 Lumileds LLC Dicing a wafer of light emitting semiconductor devices
KR20160035581A (ko) * 2013-07-19 2016-03-31 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. 발광다이오드를 위한 봉지재
TWI722242B (zh) * 2013-07-29 2021-03-21 晶元光電股份有限公司 一種半導體裝置
KR101767078B1 (ko) 2013-07-29 2017-08-10 에피스타 코포레이션 반도체 소자를 선택적으로 전이하는 방법
TWI766580B (zh) * 2013-07-29 2022-06-01 晶元光電股份有限公司 一種半導體裝置
US9935246B2 (en) 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
US9252121B2 (en) 2014-01-23 2016-02-02 International Business Machines Corporation Thermal interface material on package
WO2015128460A1 (en) * 2014-02-28 2015-09-03 Az Electronic Materials (Germany) Gmbh Hybrid material for optoelectronic applications
EP2913355A1 (en) * 2014-02-28 2015-09-02 AZ Electronic Materials (Germany) GmbH Hybrid material for optoelectronic applications
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
WO2017057454A1 (ja) * 2015-09-30 2017-04-06 東レ株式会社 発光装置の製造方法および表示装置の製造方法
KR102499548B1 (ko) * 2015-11-06 2023-03-03 엘지이노텍 주식회사 발광패키지 및 이를 포함하는 차량용 헤드램프
JP6957594B2 (ja) 2016-07-18 2021-11-02 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Led封止材料のための配合物
EP3485520B1 (en) 2016-07-18 2022-01-26 Merck Patent GmbH Formulation for an led encapsulation material
JP6911541B2 (ja) 2017-05-31 2021-07-28 セイコーエプソン株式会社 発光装置およびプロジェクター
DE102017124559B4 (de) * 2017-10-20 2024-05-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Epitaxie-Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement sowie Verfahren zur Herstellung des Epitaxie-Wellenlängenkonversionselements und des Licht emittierenden Halbleiterbauelements
EP3803976B1 (en) 2018-05-24 2024-05-22 Lumiode, Inc. Led display structures and fabrication of same
WO2020083717A1 (en) * 2018-10-22 2020-04-30 Lumileds Holding B.V. A method of manufacturing a light converting device
US11380252B2 (en) 2018-12-21 2022-07-05 Lumiode, Inc. Addressing for emissive displays
US11584882B2 (en) * 2020-02-14 2023-02-21 Osram Opto Semiconductors Gmbh Wavelength converter; method of its making and light-emitting device incorporating the element

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519516A (en) 1967-02-17 1970-07-07 Dmitry Yakovlevich Zhinkin Method for bonding siloxane rubberbase vulcanizates using a polysilazane adhesive
US4642126A (en) 1985-02-11 1987-02-10 Norton Company Coated abrasives with rapidly curable adhesives and controllable curvature
US4652274A (en) 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Coated abrasive product having radiation curable binder
CA1323949C (en) 1987-04-02 1993-11-02 Michael C. Palazzotto Ternary photoinitiator system for addition polymerization
US4929704A (en) * 1988-12-20 1990-05-29 Hercules Incorporated Isocyanate- and isothiocyanate-modified polysilazane ceramic precursors
US5208192A (en) * 1990-01-12 1993-05-04 Ethyl Corporation Preceramic polysilazane compositions
US5457151A (en) 1991-09-24 1995-10-10 Southwest Research Institute Polysilazane adhesive composition
US5616650A (en) 1993-11-05 1997-04-01 Lanxide Technology Company, Lp Metal-nitrogen polymer compositions comprising organic electrophiles
JP3482423B2 (ja) * 1994-12-20 2003-12-22 クラリアント ジャパン 株式会社 光ファイバの製造方法
JPH08236274A (ja) * 1994-12-28 1996-09-13 Tonen Corp エレクトロルミネッセンス素子
US5801073A (en) * 1995-05-25 1998-09-01 Charles Stark Draper Laboratory Net-shape ceramic processing for electronic devices and packages
JP3771298B2 (ja) * 1995-05-30 2006-04-26 クラリアント インターナショナル リミティド ポリシラザン組成物
DE69606942T2 (de) * 1995-09-25 2000-10-05 Dow Corning Corp., Midland Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik
US6268432B1 (en) * 1998-10-01 2001-07-31 Dow Corning Toray Silicone Co. Ltd. Filler/adhesive agent for display units containing a curable silicone composition
JP3503131B2 (ja) * 1999-06-03 2004-03-02 サンケン電気株式会社 半導体発光装置
AU4139101A (en) 1999-12-03 2001-06-12 Cree Lighting Company Enhanced light extraction in leds through the use of internal and external optical elements
US6709806B2 (en) * 2000-03-31 2004-03-23 Kabushiki Kaisha Toshiba Method of forming composite member
CN1222195C (zh) * 2000-07-24 2005-10-05 Tdk株式会社 发光元件
JP2002267906A (ja) * 2001-03-09 2002-09-18 Hitachi Koki Co Ltd 光学部品の接合構造
JP2003118030A (ja) * 2001-10-16 2003-04-23 Asahi Glass Co Ltd ガスバリヤ性有機基材およびそれを用いたエレクトロルミネッセンス素子
JP2005056587A (ja) * 2003-08-01 2005-03-03 Toyota Industries Corp El装置及びその製造方法
JP4788109B2 (ja) * 2003-10-28 2011-10-05 パナソニック電工株式会社 半導体発光装置及びその製造方法
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
JP2005294820A (ja) * 2004-03-12 2005-10-20 Showa Denko Kk Iii族窒化物半導体発光素子及びその形成方法、それを用いたランプ、光源
WO2005088738A1 (en) 2004-03-12 2005-09-22 Showa Denko K.K. Group iii nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same
JPWO2005121841A1 (ja) * 2004-06-11 2008-04-10 日本ゼオン株式会社 反射防止積層体および光学部材
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7402831B2 (en) 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
US7297374B1 (en) 2004-12-29 2007-11-20 3M Innovative Properties Company Single- and multi-photon polymerizable pre-ceramic polymeric compositions
KR101370362B1 (ko) 2005-03-14 2014-03-05 코닌클리케 필립스 엔.브이. 다결정 세라믹 구조 내의 인광체 및 이를 포함하는 발광 요소
JP2007042686A (ja) * 2005-07-29 2007-02-15 Toshiba Lighting & Technology Corp 発光ダイオード装置
JP5032043B2 (ja) * 2006-03-27 2012-09-26 豊田合成株式会社 フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置
KR20090018623A (ko) 2006-06-12 2009-02-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 재발광 반도체 구성 및 수렴 광학 요소를 갖는 led 소자
WO2008083188A2 (en) 2006-12-29 2008-07-10 3M Innovative Properties Company Led light source with converging extractor in an optical element
JP4927019B2 (ja) 2007-04-10 2012-05-09 信越化学工業株式会社 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法
US20100283074A1 (en) * 2007-10-08 2010-11-11 Kelley Tommie W Light emitting diode with bonded semiconductor wavelength converter
US20120181919A1 (en) 2008-08-27 2012-07-19 Osram Sylvania Inc. Luminescent Ceramic Composite Converter and Method of Making the Same
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use
US20120018761A1 (en) * 2009-03-27 2012-01-26 Konica Minolta Opto, Inc. Phosphor member, method of manufacturing phosphor member, and illuminating device
EP2427922A1 (en) * 2009-05-05 2012-03-14 3M Innovative Properties Company Re-emitting semiconductor construction with enhanced extraction efficiency
KR20120015337A (ko) * 2009-05-05 2012-02-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Led에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법

Also Published As

Publication number Publication date
US20130221393A1 (en) 2013-08-29
JP2013543280A (ja) 2013-11-28
CN103222076B (zh) 2017-10-27
TW201232811A (en) 2012-08-01
CN103222076A (zh) 2013-07-24
WO2012067766A3 (en) 2012-07-12
KR20130128420A (ko) 2013-11-26
TWI581456B (zh) 2017-05-01
WO2012067766A2 (en) 2012-05-24
EP2641277A4 (en) 2016-06-15
US9041034B2 (en) 2015-05-26
EP2641277A2 (en) 2013-09-25

Similar Documents

Publication Publication Date Title
JP6132770B2 (ja) ポリシラザン接合層を含む発光ダイオードコンポーネント
CN101821866B (zh) 具有粘接的半导体波长转换器的发光二极管
KR102077742B1 (ko) 반도체 요소 전사 방법
JP7168615B2 (ja) 光電子部品の製造方法、および光電子部品
US20050141240A1 (en) Light emitting device and fabrication method thereof
TW200939538A (en) Down-converted light emitting diode with simplified light extraction
CN102804422A (zh) 用于与led结合使用的重发光半导体载流子器件及其制造方法
CN108369984A8 (zh) 使用高折射率粘合剂的发光二极管制作
JP2005251875A (ja) 半導体発光装置
CN110265521B (zh) 倒装发光二极管芯片及其制作方法
KR101968637B1 (ko) 유연성 반도체소자 및 그 제조방법
CN101160672A (zh) 发光器件
Lin et al. An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications
CN107039564B (zh) 发射光的半导体器件
CN100479207C (zh) 一种高光提取效率的发光二极管及其制备方法
CN120827011A (zh) 用于制造光电部件的方法以及光电部件
US20250370164A1 (en) Organic anti-reflective coating for visible and ir optical components for emission efficiency
US20220209073A1 (en) Method for producing an optoelectronic component and optoelectronic component

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141027

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141027

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150804

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151104

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160510

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160912

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20161104

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170321

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170418

R150 Certificate of patent or registration of utility model

Ref document number: 6132770

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees