TWI581456B - 具有聚矽氮烷黏結層之發光二極體組件 - Google Patents

具有聚矽氮烷黏結層之發光二極體組件 Download PDF

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Publication number
TWI581456B
TWI581456B TW100141513A TW100141513A TWI581456B TW I581456 B TWI581456 B TW I581456B TW 100141513 A TW100141513 A TW 100141513A TW 100141513 A TW100141513 A TW 100141513A TW I581456 B TWI581456 B TW I581456B
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TW
Taiwan
Prior art keywords
led
component
light
wavelength converter
semiconductor
Prior art date
Application number
TW100141513A
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English (en)
Chinese (zh)
Other versions
TW201232811A (en
Inventor
毛國平
楊宇
史蒂芬 約翰 納莫羅斯基
泰瑞 李 史密斯
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3M新設資產公司
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Publication date
Application filed by 3M新設資產公司 filed Critical 3M新設資產公司
Publication of TW201232811A publication Critical patent/TW201232811A/zh
Application granted granted Critical
Publication of TWI581456B publication Critical patent/TWI581456B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Led Device Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Optical Filters (AREA)
TW100141513A 2010-11-18 2011-11-15 具有聚矽氮烷黏結層之發光二極體組件 TWI581456B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41511510P 2010-11-18 2010-11-18

Publications (2)

Publication Number Publication Date
TW201232811A TW201232811A (en) 2012-08-01
TWI581456B true TWI581456B (zh) 2017-05-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141513A TWI581456B (zh) 2010-11-18 2011-11-15 具有聚矽氮烷黏結層之發光二極體組件

Country Status (7)

Country Link
US (1) US9041034B2 (enExample)
EP (1) EP2641277A4 (enExample)
JP (1) JP6132770B2 (enExample)
KR (1) KR20130128420A (enExample)
CN (1) CN103222076B (enExample)
TW (1) TWI581456B (enExample)
WO (1) WO2012067766A2 (enExample)

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US20140217457A1 (en) * 2011-05-25 2014-08-07 Wavesquare Inc. Light-emitting element chip and manufacturing method therefor
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DE102012108939A1 (de) * 2012-09-21 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement
DE102012217776A1 (de) * 2012-09-28 2014-06-12 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
EP3118904B1 (en) * 2013-07-18 2023-07-05 Lumileds LLC Dicing a wafer of light emitting semiconductor devices
KR20160035581A (ko) * 2013-07-19 2016-03-31 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. 발광다이오드를 위한 봉지재
TWI722242B (zh) * 2013-07-29 2021-03-21 晶元光電股份有限公司 一種半導體裝置
KR101767078B1 (ko) 2013-07-29 2017-08-10 에피스타 코포레이션 반도체 소자를 선택적으로 전이하는 방법
TWI766580B (zh) * 2013-07-29 2022-06-01 晶元光電股份有限公司 一種半導體裝置
US9935246B2 (en) 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
US9252121B2 (en) 2014-01-23 2016-02-02 International Business Machines Corporation Thermal interface material on package
WO2015128460A1 (en) * 2014-02-28 2015-09-03 Az Electronic Materials (Germany) Gmbh Hybrid material for optoelectronic applications
EP2913355A1 (en) * 2014-02-28 2015-09-02 AZ Electronic Materials (Germany) GmbH Hybrid material for optoelectronic applications
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
WO2017057454A1 (ja) * 2015-09-30 2017-04-06 東レ株式会社 発光装置の製造方法および表示装置の製造方法
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JP6957594B2 (ja) 2016-07-18 2021-11-02 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Led封止材料のための配合物
EP3485520B1 (en) 2016-07-18 2022-01-26 Merck Patent GmbH Formulation for an led encapsulation material
JP6911541B2 (ja) 2017-05-31 2021-07-28 セイコーエプソン株式会社 発光装置およびプロジェクター
DE102017124559B4 (de) * 2017-10-20 2024-05-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Epitaxie-Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement sowie Verfahren zur Herstellung des Epitaxie-Wellenlängenkonversionselements und des Licht emittierenden Halbleiterbauelements
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Also Published As

Publication number Publication date
US20130221393A1 (en) 2013-08-29
JP2013543280A (ja) 2013-11-28
CN103222076B (zh) 2017-10-27
TW201232811A (en) 2012-08-01
CN103222076A (zh) 2013-07-24
WO2012067766A3 (en) 2012-07-12
KR20130128420A (ko) 2013-11-26
WO2012067766A2 (en) 2012-05-24
EP2641277A4 (en) 2016-06-15
US9041034B2 (en) 2015-05-26
EP2641277A2 (en) 2013-09-25
JP6132770B2 (ja) 2017-05-24

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