TWI581456B - 具有聚矽氮烷黏結層之發光二極體組件 - Google Patents
具有聚矽氮烷黏結層之發光二極體組件 Download PDFInfo
- Publication number
- TWI581456B TWI581456B TW100141513A TW100141513A TWI581456B TW I581456 B TWI581456 B TW I581456B TW 100141513 A TW100141513 A TW 100141513A TW 100141513 A TW100141513 A TW 100141513A TW I581456 B TWI581456 B TW I581456B
- Authority
- TW
- Taiwan
- Prior art keywords
- led
- component
- light
- wavelength converter
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
Landscapes
- Led Device Packages (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41511510P | 2010-11-18 | 2010-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201232811A TW201232811A (en) | 2012-08-01 |
| TWI581456B true TWI581456B (zh) | 2017-05-01 |
Family
ID=46084569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100141513A TWI581456B (zh) | 2010-11-18 | 2011-11-15 | 具有聚矽氮烷黏結層之發光二極體組件 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9041034B2 (enExample) |
| EP (1) | EP2641277A4 (enExample) |
| JP (1) | JP6132770B2 (enExample) |
| KR (1) | KR20130128420A (enExample) |
| CN (1) | CN103222076B (enExample) |
| TW (1) | TWI581456B (enExample) |
| WO (1) | WO2012067766A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010034923A1 (de) * | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Schichtverbunds aus einer Lumineszenzkonversionsschicht und einer Streuschicht |
| DE102011100728A1 (de) * | 2011-05-06 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| US20140217457A1 (en) * | 2011-05-25 | 2014-08-07 | Wavesquare Inc. | Light-emitting element chip and manufacturing method therefor |
| WO2014024068A2 (en) * | 2012-08-06 | 2014-02-13 | Koninklijke Philips N.V. | Highly stable qds-composites for solid state lighting and the method of making them through initiator-free polymerization |
| DE102012108939A1 (de) * | 2012-09-21 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement umfassend ein transparentes Auskoppelelement |
| DE102012217776A1 (de) * | 2012-09-28 | 2014-06-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| EP3118904B1 (en) * | 2013-07-18 | 2023-07-05 | Lumileds LLC | Dicing a wafer of light emitting semiconductor devices |
| KR20160035581A (ko) * | 2013-07-19 | 2016-03-31 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | 발광다이오드를 위한 봉지재 |
| TWI722242B (zh) * | 2013-07-29 | 2021-03-21 | 晶元光電股份有限公司 | 一種半導體裝置 |
| KR101767078B1 (ko) | 2013-07-29 | 2017-08-10 | 에피스타 코포레이션 | 반도체 소자를 선택적으로 전이하는 방법 |
| TWI766580B (zh) * | 2013-07-29 | 2022-06-01 | 晶元光電股份有限公司 | 一種半導體裝置 |
| US9935246B2 (en) | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| US9252121B2 (en) | 2014-01-23 | 2016-02-02 | International Business Machines Corporation | Thermal interface material on package |
| WO2015128460A1 (en) * | 2014-02-28 | 2015-09-03 | Az Electronic Materials (Germany) Gmbh | Hybrid material for optoelectronic applications |
| EP2913355A1 (en) * | 2014-02-28 | 2015-09-02 | AZ Electronic Materials (Germany) GmbH | Hybrid material for optoelectronic applications |
| KR102311677B1 (ko) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | 반도체소자 및 그 제조방법 |
| JP7071118B2 (ja) * | 2014-08-19 | 2022-05-18 | ルミレッズ ホールディング ベーフェー | ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ |
| EP3295479B1 (en) * | 2015-05-13 | 2018-09-26 | Lumileds Holding B.V. | Sapphire collector for reducing mechanical damage during die level laser lift-off |
| WO2017057454A1 (ja) * | 2015-09-30 | 2017-04-06 | 東レ株式会社 | 発光装置の製造方法および表示装置の製造方法 |
| KR102499548B1 (ko) * | 2015-11-06 | 2023-03-03 | 엘지이노텍 주식회사 | 발광패키지 및 이를 포함하는 차량용 헤드램프 |
| JP6957594B2 (ja) | 2016-07-18 | 2021-11-02 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | Led封止材料のための配合物 |
| EP3485520B1 (en) | 2016-07-18 | 2022-01-26 | Merck Patent GmbH | Formulation for an led encapsulation material |
| JP6911541B2 (ja) | 2017-05-31 | 2021-07-28 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| DE102017124559B4 (de) * | 2017-10-20 | 2024-05-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Epitaxie-Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement sowie Verfahren zur Herstellung des Epitaxie-Wellenlängenkonversionselements und des Licht emittierenden Halbleiterbauelements |
| EP3803976B1 (en) | 2018-05-24 | 2024-05-22 | Lumiode, Inc. | Led display structures and fabrication of same |
| WO2020083717A1 (en) * | 2018-10-22 | 2020-04-30 | Lumileds Holding B.V. | A method of manufacturing a light converting device |
| US11380252B2 (en) | 2018-12-21 | 2022-07-05 | Lumiode, Inc. | Addressing for emissive displays |
| US11584882B2 (en) * | 2020-02-14 | 2023-02-21 | Osram Opto Semiconductors Gmbh | Wavelength converter; method of its making and light-emitting device incorporating the element |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6781148B2 (en) * | 2000-07-24 | 2004-08-24 | Tdk Corporation | Light emitting device |
| US7170087B2 (en) * | 2003-08-01 | 2007-01-30 | Kabushiki Kaisha Toyota Jidoshokki | EL device and method for manufacturing the same |
| US20100167002A1 (en) * | 2008-12-30 | 2010-07-01 | Vitex Systems, Inc. | Method for encapsulating environmentally sensitive devices |
| US20100230691A1 (en) * | 2006-03-27 | 2010-09-16 | Mitsuhiro Inoue | Ferrous-Metal-Alkaline-Earth-Metal Silicate Mixed Crystal Phosphor and Light Emitting Device using The Same |
| US20100283074A1 (en) * | 2007-10-08 | 2010-11-11 | Kelley Tommie W | Light emitting diode with bonded semiconductor wavelength converter |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3519516A (en) | 1967-02-17 | 1970-07-07 | Dmitry Yakovlevich Zhinkin | Method for bonding siloxane rubberbase vulcanizates using a polysilazane adhesive |
| US4642126A (en) | 1985-02-11 | 1987-02-10 | Norton Company | Coated abrasives with rapidly curable adhesives and controllable curvature |
| US4652274A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Coated abrasive product having radiation curable binder |
| CA1323949C (en) | 1987-04-02 | 1993-11-02 | Michael C. Palazzotto | Ternary photoinitiator system for addition polymerization |
| US4929704A (en) * | 1988-12-20 | 1990-05-29 | Hercules Incorporated | Isocyanate- and isothiocyanate-modified polysilazane ceramic precursors |
| US5208192A (en) * | 1990-01-12 | 1993-05-04 | Ethyl Corporation | Preceramic polysilazane compositions |
| US5457151A (en) | 1991-09-24 | 1995-10-10 | Southwest Research Institute | Polysilazane adhesive composition |
| US5616650A (en) | 1993-11-05 | 1997-04-01 | Lanxide Technology Company, Lp | Metal-nitrogen polymer compositions comprising organic electrophiles |
| JP3482423B2 (ja) * | 1994-12-20 | 2003-12-22 | クラリアント ジャパン 株式会社 | 光ファイバの製造方法 |
| JPH08236274A (ja) * | 1994-12-28 | 1996-09-13 | Tonen Corp | エレクトロルミネッセンス素子 |
| US5801073A (en) * | 1995-05-25 | 1998-09-01 | Charles Stark Draper Laboratory | Net-shape ceramic processing for electronic devices and packages |
| JP3771298B2 (ja) * | 1995-05-30 | 2006-04-26 | クラリアント インターナショナル リミティド | ポリシラザン組成物 |
| DE69606942T2 (de) * | 1995-09-25 | 2000-10-05 | Dow Corning Corp., Midland | Verwendung von präkeramischen Polymeren als Klebstoffe für Elektronik |
| US6268432B1 (en) * | 1998-10-01 | 2001-07-31 | Dow Corning Toray Silicone Co. Ltd. | Filler/adhesive agent for display units containing a curable silicone composition |
| JP3503131B2 (ja) * | 1999-06-03 | 2004-03-02 | サンケン電気株式会社 | 半導体発光装置 |
| AU4139101A (en) | 1999-12-03 | 2001-06-12 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
| US6709806B2 (en) * | 2000-03-31 | 2004-03-23 | Kabushiki Kaisha Toshiba | Method of forming composite member |
| JP2002267906A (ja) * | 2001-03-09 | 2002-09-18 | Hitachi Koki Co Ltd | 光学部品の接合構造 |
| JP2003118030A (ja) * | 2001-10-16 | 2003-04-23 | Asahi Glass Co Ltd | ガスバリヤ性有機基材およびそれを用いたエレクトロルミネッセンス素子 |
| JP4788109B2 (ja) * | 2003-10-28 | 2011-10-05 | パナソニック電工株式会社 | 半導体発光装置及びその製造方法 |
| TW200538522A (en) * | 2004-02-16 | 2005-12-01 | Hitachi Chemical Co Ltd | Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same |
| JP2005294820A (ja) * | 2004-03-12 | 2005-10-20 | Showa Denko Kk | Iii族窒化物半導体発光素子及びその形成方法、それを用いたランプ、光源 |
| WO2005088738A1 (en) | 2004-03-12 | 2005-09-22 | Showa Denko K.K. | Group iii nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same |
| JPWO2005121841A1 (ja) * | 2004-06-11 | 2008-04-10 | 日本ゼオン株式会社 | 反射防止積層体および光学部材 |
| US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US7402831B2 (en) | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US7297374B1 (en) | 2004-12-29 | 2007-11-20 | 3M Innovative Properties Company | Single- and multi-photon polymerizable pre-ceramic polymeric compositions |
| KR101370362B1 (ko) | 2005-03-14 | 2014-03-05 | 코닌클리케 필립스 엔.브이. | 다결정 세라믹 구조 내의 인광체 및 이를 포함하는 발광 요소 |
| JP2007042686A (ja) * | 2005-07-29 | 2007-02-15 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| KR20090018623A (ko) | 2006-06-12 | 2009-02-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 재발광 반도체 구성 및 수렴 광학 요소를 갖는 led 소자 |
| WO2008083188A2 (en) | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Led light source with converging extractor in an optical element |
| JP4927019B2 (ja) | 2007-04-10 | 2012-05-09 | 信越化学工業株式会社 | 蛍光体含有接着性シリコーン組成物、該組成物からなる組成物シート、及び該シートを使用する発光装置の製造方法 |
| US20120181919A1 (en) | 2008-08-27 | 2012-07-19 | Osram Sylvania Inc. | Luminescent Ceramic Composite Converter and Method of Making the Same |
| WO2010104534A1 (en) * | 2009-03-12 | 2010-09-16 | Dow Corning Corporation | Thermal interface materials and mehtods for their preparation and use |
| US20120018761A1 (en) * | 2009-03-27 | 2012-01-26 | Konica Minolta Opto, Inc. | Phosphor member, method of manufacturing phosphor member, and illuminating device |
| EP2427922A1 (en) * | 2009-05-05 | 2012-03-14 | 3M Innovative Properties Company | Re-emitting semiconductor construction with enhanced extraction efficiency |
| KR20120015337A (ko) * | 2009-05-05 | 2012-02-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Led에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법 |
-
2011
- 2011-10-25 WO PCT/US2011/057635 patent/WO2012067766A2/en not_active Ceased
- 2011-10-25 EP EP11841084.4A patent/EP2641277A4/en not_active Withdrawn
- 2011-10-25 CN CN201180055356.XA patent/CN103222076B/zh not_active Expired - Fee Related
- 2011-10-25 US US13/876,373 patent/US9041034B2/en active Active
- 2011-10-25 JP JP2013539854A patent/JP6132770B2/ja not_active Expired - Fee Related
- 2011-10-25 KR KR1020137015558A patent/KR20130128420A/ko not_active Abandoned
- 2011-11-15 TW TW100141513A patent/TWI581456B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6781148B2 (en) * | 2000-07-24 | 2004-08-24 | Tdk Corporation | Light emitting device |
| US7170087B2 (en) * | 2003-08-01 | 2007-01-30 | Kabushiki Kaisha Toyota Jidoshokki | EL device and method for manufacturing the same |
| US20100230691A1 (en) * | 2006-03-27 | 2010-09-16 | Mitsuhiro Inoue | Ferrous-Metal-Alkaline-Earth-Metal Silicate Mixed Crystal Phosphor and Light Emitting Device using The Same |
| US20100283074A1 (en) * | 2007-10-08 | 2010-11-11 | Kelley Tommie W | Light emitting diode with bonded semiconductor wavelength converter |
| US20100167002A1 (en) * | 2008-12-30 | 2010-07-01 | Vitex Systems, Inc. | Method for encapsulating environmentally sensitive devices |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130221393A1 (en) | 2013-08-29 |
| JP2013543280A (ja) | 2013-11-28 |
| CN103222076B (zh) | 2017-10-27 |
| TW201232811A (en) | 2012-08-01 |
| CN103222076A (zh) | 2013-07-24 |
| WO2012067766A3 (en) | 2012-07-12 |
| KR20130128420A (ko) | 2013-11-26 |
| WO2012067766A2 (en) | 2012-05-24 |
| EP2641277A4 (en) | 2016-06-15 |
| US9041034B2 (en) | 2015-05-26 |
| EP2641277A2 (en) | 2013-09-25 |
| JP6132770B2 (ja) | 2017-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |