JP2013541858A5 - - Google Patents

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Publication number
JP2013541858A5
JP2013541858A5 JP2013537704A JP2013537704A JP2013541858A5 JP 2013541858 A5 JP2013541858 A5 JP 2013541858A5 JP 2013537704 A JP2013537704 A JP 2013537704A JP 2013537704 A JP2013537704 A JP 2013537704A JP 2013541858 A5 JP2013541858 A5 JP 2013541858A5
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JP
Japan
Prior art keywords
conductive
posts
post
conductive elements
bond metal
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JP2013537704A
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English (en)
Japanese (ja)
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JP5649739B2 (ja
JP2013541858A (ja
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Priority claimed from US12/938,068 external-priority patent/US8697492B2/en
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Publication of JP2013541858A publication Critical patent/JP2013541858A/ja
Publication of JP2013541858A5 publication Critical patent/JP2013541858A5/ja
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Publication of JP5649739B2 publication Critical patent/JP5649739B2/ja
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JP2013537704A 2010-11-02 2011-10-27 ノーフローアンダーフィル Active JP5649739B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/938,068 US8697492B2 (en) 2010-11-02 2010-11-02 No flow underfill
US12/938,068 2010-11-02
PCT/US2011/058080 WO2012061199A2 (en) 2010-11-02 2011-10-27 No flow underfill

Publications (3)

Publication Number Publication Date
JP2013541858A JP2013541858A (ja) 2013-11-14
JP2013541858A5 true JP2013541858A5 (enExample) 2014-09-11
JP5649739B2 JP5649739B2 (ja) 2015-01-07

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ID=44999895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013537704A Active JP5649739B2 (ja) 2010-11-02 2011-10-27 ノーフローアンダーフィル

Country Status (6)

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US (2) US8697492B2 (enExample)
JP (1) JP5649739B2 (enExample)
KR (2) KR101967322B1 (enExample)
CN (1) CN103283007B (enExample)
TW (1) TWI564972B (enExample)
WO (1) WO2012061199A2 (enExample)

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US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
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US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
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US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
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US9603283B1 (en) * 2015-10-09 2017-03-21 Raytheon Company Electronic module with free-formed self-supported vertical interconnects
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
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