CN103283007B - 不流动底充胶 - Google Patents

不流动底充胶 Download PDF

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Publication number
CN103283007B
CN103283007B CN201180063433.6A CN201180063433A CN103283007B CN 103283007 B CN103283007 B CN 103283007B CN 201180063433 A CN201180063433 A CN 201180063433A CN 103283007 B CN103283007 B CN 103283007B
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Prior art keywords
conducting element
conductive pole
conductive
metal
conjunction
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Chinese (zh)
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CN103283007A (zh
Inventor
贝勒卡西姆·哈巴
伊利亚斯·默罕默德
埃利斯·周
李相一
基肖尔·德赛
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Adeia Semiconductor Solutions LLC
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Tessera LLC
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CN201180063433.6A 2010-11-02 2011-10-27 不流动底充胶 Active CN103283007B (zh)

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US9196581B2 (en) 2015-11-24
US20140217584A1 (en) 2014-08-07
KR20180061419A (ko) 2018-06-07
US20120104595A1 (en) 2012-05-03
KR20130140759A (ko) 2013-12-24
JP2013541858A (ja) 2013-11-14
WO2012061199A2 (en) 2012-05-10
JP5649739B2 (ja) 2015-01-07
TWI564972B (zh) 2017-01-01
KR101967322B1 (ko) 2019-04-09
WO2012061199A3 (en) 2012-06-28
TW201225188A (en) 2012-06-16
US8697492B2 (en) 2014-04-15
CN103283007A (zh) 2013-09-04

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