JP2013534728A5 - - Google Patents
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- Publication number
- JP2013534728A5 JP2013534728A5 JP2013515795A JP2013515795A JP2013534728A5 JP 2013534728 A5 JP2013534728 A5 JP 2013534728A5 JP 2013515795 A JP2013515795 A JP 2013515795A JP 2013515795 A JP2013515795 A JP 2013515795A JP 2013534728 A5 JP2013534728 A5 JP 2013534728A5
- Authority
- JP
- Japan
- Prior art keywords
- optical element
- molding material
- semiconductor chip
- refractive index
- high refractive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012778 molding material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims 18
- 230000003287 optical effect Effects 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 9
- 239000000463 material Substances 0.000 claims 3
- 239000002861 polymer material Substances 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 claims 2
- 238000001723 curing Methods 0.000 claims 2
- 229920002100 high-refractive-index polymer Polymers 0.000 claims 2
- 238000004020 luminiscence type Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 230000003213 activating effect Effects 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000002105 nanoparticle Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000001029 thermal curing Methods 0.000 claims 1
- 230000004913 activation Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010024545.3 | 2010-06-22 | ||
| DE102010024545.3A DE102010024545B4 (de) | 2010-06-22 | 2010-06-22 | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| PCT/EP2011/058580 WO2011160913A1 (de) | 2010-06-22 | 2011-05-25 | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013534728A JP2013534728A (ja) | 2013-09-05 |
| JP2013534728A5 true JP2013534728A5 (enExample) | 2016-07-28 |
| JP6315988B2 JP6315988B2 (ja) | 2018-04-25 |
Family
ID=44260354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013515795A Active JP6315988B2 (ja) | 2010-06-22 | 2011-05-25 | 半導体構成素子の製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9368699B2 (enExample) |
| EP (1) | EP2586069B1 (enExample) |
| JP (1) | JP6315988B2 (enExample) |
| KR (2) | KR20130023347A (enExample) |
| CN (2) | CN105529392B (enExample) |
| DE (1) | DE102010024545B4 (enExample) |
| TW (2) | TWI545809B (enExample) |
| WO (1) | WO2011160913A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010024545B4 (de) | 2010-06-22 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| DE102014108368A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Halbleiterbauelement und Verfahren zu dessen Herstellung |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159406A (ja) * | 1984-08-31 | 1986-03-26 | Fujitsu Ltd | プレ−ナ型光ガイドの光結合構造およびその製造方法 |
| DE10023353A1 (de) | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
| JP3991612B2 (ja) | 2001-04-09 | 2007-10-17 | 日亜化学工業株式会社 | 発光素子 |
| DE10129785B4 (de) * | 2001-06-20 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| JP2003224304A (ja) * | 2002-01-28 | 2003-08-08 | Kasei Optonix Co Ltd | 発光装置 |
| JP4241259B2 (ja) | 2003-08-06 | 2009-03-18 | セイコーエプソン株式会社 | マイクロレンズの製造方法 |
| DE10361650A1 (de) | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
| US7645397B2 (en) | 2004-01-15 | 2010-01-12 | Nanosys, Inc. | Nanocrystal doped matrixes |
| DE102005009066A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement |
| RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
| TWI338380B (en) | 2006-10-11 | 2011-03-01 | Chuan Yu Hung | Light emitting diode incorporating high refractive index material |
| KR20090089431A (ko) * | 2006-11-17 | 2009-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Ｌｅｄ 광원용 광학 접합 조성물 |
| US8029904B2 (en) * | 2006-12-01 | 2011-10-04 | Rohm And Haas Company | Aryl (thio)ether aryl polysiloxane composition and methods for making and using same |
| US8895652B2 (en) | 2007-06-12 | 2014-11-25 | Ajjer, Llc | High refractive index materials and composites |
| JP5318383B2 (ja) * | 2007-08-07 | 2013-10-16 | デクセリアルズ株式会社 | 光学部品封止材及び発光装置 |
| TW200910648A (en) * | 2007-08-31 | 2009-03-01 | Isotech Products Inc | Forming process of resin lens of an LED component |
| JP5578597B2 (ja) * | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
| US20090065792A1 (en) | 2007-09-07 | 2009-03-12 | 3M Innovative Properties Company | Method of making an led device having a dome lens |
| US10256385B2 (en) * | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US8866169B2 (en) * | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| JP2009275196A (ja) * | 2008-05-19 | 2009-11-26 | Sony Corp | 硬化性樹脂材料組成物、光学材料、発光装置及びその製造方法、並びに電子デバイス |
| CN101740707B (zh) * | 2009-12-11 | 2013-11-06 | 晶科电子（广州）有限公司 | 预成型荧光粉贴片及其与发光二极管的封装方法 |
| DE102010024545B4 (de) | 2010-06-22 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
-
2010
- 2010-06-22 DE DE102010024545.3A patent/DE102010024545B4/de active Active
-
2011
- 2011-05-25 WO PCT/EP2011/058580 patent/WO2011160913A1/de not_active Ceased
- 2011-05-25 EP EP11723914.5A patent/EP2586069B1/de active Active
- 2011-05-25 JP JP2013515795A patent/JP6315988B2/ja active Active
- 2011-05-25 US US13/703,180 patent/US9368699B2/en active Active
- 2011-05-25 KR KR1020137001259A patent/KR20130023347A/ko not_active Ceased
- 2011-05-25 KR KR1020177033700A patent/KR20170131724A/ko not_active Ceased
- 2011-05-25 CN CN201610015092.XA patent/CN105529392B/zh active Active
- 2011-05-25 CN CN201180031248.9A patent/CN102947959B/zh active Active
- 2011-06-20 TW TW104124265A patent/TWI545809B/zh active
- 2011-06-20 TW TW100121392A patent/TWI497776B/zh active
-
2016
- 2016-05-05 US US15/146,984 patent/US9634207B2/en active Active
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