JP2014524957A5 - - Google Patents

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Publication number
JP2014524957A5
JP2014524957A5 JP2014520234A JP2014520234A JP2014524957A5 JP 2014524957 A5 JP2014524957 A5 JP 2014524957A5 JP 2014520234 A JP2014520234 A JP 2014520234A JP 2014520234 A JP2014520234 A JP 2014520234A JP 2014524957 A5 JP2014524957 A5 JP 2014524957A5
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JP
Japan
Prior art keywords
semiconductor package
resin composition
package resin
substrate
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014520234A
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English (en)
Japanese (ja)
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JP6155261B2 (ja
JP2014524957A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/045916 external-priority patent/WO2013012587A2/en
Publication of JP2014524957A publication Critical patent/JP2014524957A/ja
Publication of JP2014524957A5 publication Critical patent/JP2014524957A5/ja
Application granted granted Critical
Publication of JP6155261B2 publication Critical patent/JP6155261B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014520234A 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法 Expired - Fee Related JP6155261B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161508344P 2011-07-15 2011-07-15
US61/508,344 2011-07-15
PCT/US2012/045916 WO2013012587A2 (en) 2011-07-15 2012-07-09 Semiconductor package resin composition and usage method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017043422A Division JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Publications (3)

Publication Number Publication Date
JP2014524957A JP2014524957A (ja) 2014-09-25
JP2014524957A5 true JP2014524957A5 (enExample) 2015-08-27
JP6155261B2 JP6155261B2 (ja) 2017-06-28

Family

ID=47558664

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014520234A Expired - Fee Related JP6155261B2 (ja) 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法
JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Country Status (5)

Country Link
US (2) US9230873B2 (enExample)
JP (2) JP6155261B2 (enExample)
KR (1) KR20140058557A (enExample)
TW (1) TWI550018B (enExample)
WO (1) WO2013012587A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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US20140011052A1 (en) * 2011-03-28 2014-01-09 3M Innovative Properties Company Curable composition, article, method of curing, and reaction product
JP6271164B2 (ja) * 2013-06-17 2018-01-31 日立オートモティブシステムズ株式会社 箱型車載制御装置
KR102186491B1 (ko) 2014-01-02 2020-12-03 헨켈 아이피 앤드 홀딩 게엠베하 나노-미립자 충전제를 함유하는 필름
US9220183B1 (en) * 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
CN108463774A (zh) * 2016-01-12 2018-08-28 日立化成株式会社 感光性树脂组合物、使用其的干膜、印刷配线板、以及印刷配线板的制造方法
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7218378B2 (ja) * 2018-02-19 2023-02-06 シグニファイ ホールディング ビー ヴィ ライトエンジンを備える封止デバイス
JP7109940B2 (ja) * 2018-03-08 2022-08-01 日東電工株式会社 封止用接着シート
WO2024228184A1 (en) * 2023-05-04 2024-11-07 Inpack Technologies - Limited Partnership Method of forming non-conductive polymer layers with a controlled coefficient of thermal expansion

Family Cites Families (20)

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US6228681B1 (en) 1999-03-10 2001-05-08 Fry's Metals, Inc. Flip chip having integral mask and underfill providing two-stage bump formation
US6245595B1 (en) 1999-07-22 2001-06-12 National Semiconductor Corporation Techniques for wafer level molding of underfill encapsulant
US6281046B1 (en) 2000-04-25 2001-08-28 Atmel Corporation Method of forming an integrated circuit package at a wafer level
US6573122B2 (en) 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
US6794761B2 (en) 2001-04-26 2004-09-21 Intel Corporation No-flow underfill material
US20030111519A1 (en) 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
EP1302514B1 (en) 2001-10-09 2009-07-15 Mitsubishi Chemical Corporation Active energy ray-curable antistatic coating composition
US20030162911A1 (en) 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7022410B2 (en) 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US20040101688A1 (en) 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20060147719A1 (en) 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
KR100774798B1 (ko) 2004-05-13 2007-11-07 닛토덴코 가부시키가이샤 반도체 캡슐화용 에폭시 수지 조성물 및 이것을 이용한 반도체 장치
WO2007049573A1 (ja) 2005-10-28 2007-05-03 Sumitomo Osaka Cement Co., Ltd. 無機酸化物透明分散液と無機酸化物粒子含有樹脂組成物、発光素子封止用組成物及び発光素子、ハードコート膜と光学機能膜及び光学部品、並びに無機酸化物粒子含有樹脂組成物の製造方法
JP2008180992A (ja) * 2007-01-25 2008-08-07 Hitachi Chem Co Ltd 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及び半導体パッケージ
WO2008112883A2 (en) 2007-03-13 2008-09-18 Lord Corporation Die attachment method with a covex surface underfill
JP2008297373A (ja) 2007-05-29 2008-12-11 Somar Corp 液状エポキシ樹脂組成物からなるアンダーフィル材及びフリップチップ型半導体装置
JP5004351B2 (ja) 2007-11-30 2012-08-22 信越化学工業株式会社 半導体装置の製造方法
JP5972576B2 (ja) 2009-02-27 2016-08-17 エルジー・ケム・リミテッド 耐摩耗性および耐汚染性に優れたコーティング組成物およびコーティングフィルム
US8541485B2 (en) * 2009-05-26 2013-09-24 3M Innovative Properties Company Process for making filled resins

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