JP2013534276A5 - - Google Patents

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Publication number
JP2013534276A5
JP2013534276A5 JP2013524427A JP2013524427A JP2013534276A5 JP 2013534276 A5 JP2013534276 A5 JP 2013534276A5 JP 2013524427 A JP2013524427 A JP 2013524427A JP 2013524427 A JP2013524427 A JP 2013524427A JP 2013534276 A5 JP2013534276 A5 JP 2013534276A5
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JP
Japan
Prior art keywords
electrolyte
acid
copper
tin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013524427A
Other languages
English (en)
Japanese (ja)
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JP2013534276A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2011/063923 external-priority patent/WO2012022689A1/en
Publication of JP2013534276A publication Critical patent/JP2013534276A/ja
Publication of JP2013534276A5 publication Critical patent/JP2013534276A5/ja
Pending legal-status Critical Current

Links

JP2013524427A 2010-08-17 2011-08-12 銅−錫合金層を沈着する電解質および方法 Pending JP2013534276A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010034646.2 2010-08-17
DE102010034646 2010-08-17
PCT/EP2011/063923 WO2012022689A1 (en) 2010-08-17 2011-08-12 Electrolyte and process for the deposition of copper-tin alloy layers

Publications (2)

Publication Number Publication Date
JP2013534276A JP2013534276A (ja) 2013-09-02
JP2013534276A5 true JP2013534276A5 (pt) 2015-07-02

Family

ID=44514714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013524427A Pending JP2013534276A (ja) 2010-08-17 2011-08-12 銅−錫合金層を沈着する電解質および方法

Country Status (7)

Country Link
US (1) US20130140185A1 (pt)
EP (1) EP2606164A1 (pt)
JP (1) JP2013534276A (pt)
KR (1) KR20130098304A (pt)
CN (1) CN103069054B (pt)
DE (1) DE102011008836B4 (pt)
WO (1) WO2012022689A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
EP3297986B1 (de) 2015-05-22 2019-07-10 Basf Se Beta-naphtholethersulfonate, verfahren zu deren herstellung und deren verwendung als glanzverbesserer
CN105220189A (zh) * 2015-10-30 2016-01-06 无锡市嘉邦电力管道厂 一种钐-锡-铜合金电镀液及其电镀方法
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001181889A (ja) 1999-12-22 2001-07-03 Nippon Macdermid Kk 光沢錫−銅合金電気めっき浴
JP3455712B2 (ja) 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
DE50106133D1 (de) 2000-09-20 2005-06-09 Schloetter Fa Dr Ing Max Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1260614B1 (en) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Tin plating
WO2003012174A1 (en) * 2001-07-27 2003-02-13 Pirelli Pneumatici S.P.A. Electrolytic process for depositing a layer of copper on a steel wire
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3876383B2 (ja) * 2002-06-03 2007-01-31 京都市 銅−錫合金めっき浴及び該めっき浴を用いた銅−錫合金めっき方法
JP4249438B2 (ja) 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
EP1408141B1 (de) 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
JP4332667B2 (ja) * 2003-10-16 2009-09-16 石原薬品株式会社 スズ及びスズ合金メッキ浴
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes

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