JP2013529859A - 導電性薄層構造、電気的相互接続および電気的相互接続を形成する方法。 - Google Patents
導電性薄層構造、電気的相互接続および電気的相互接続を形成する方法。 Download PDFInfo
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Abstract
Description
図1に関連して、半導体構造10は、例示的な一実施形態の処理段階において図示される。半導体構造は、ベース12と、ベース上の電気的に絶縁性の材料14とを含む。
Claims (33)
- 一対の非グラフェン領域の間に挟まれたグラフェン領域を含む、
ことを特徴とする導電性薄層構造。 - 前記グラフェン領域は、5つのグラフェン単層の厚さよりも小さい、
ことを特徴とする請求項1に記載の薄層構造。 - 前記グラフェン領域は、1つから3つの間のグラフェン単層の厚さである、
ことを特徴とする請求項1に記載の薄層構造。 - 前記複数の非グラフェン領域のうちの少なくとも一つは、導電性である、
ことを特徴とする請求項1に記載の薄層構造。 - 前記複数の非グラフェン領域のうちの少なくとも一つは、電気的に絶縁性である、
ことを特徴とする請求項1に記載の薄層構造。 - 前記グラフェン領域と、複数の非グラフェン領域は、お互いに入れ子になっている、
ことを特徴とする請求項1に記載の薄層構造。 - 前記複数の非グラフェン領域のうちの少なくとも一つは、一つ以上の金属を含む、
ことを特徴とする請求項6に記載の薄層構造。 - 前記複数の非グラフェン領域のうちの少なくとも一つは、銅およびニッケルのうちの一つもしくはその双方を含む、
ことを特徴とする請求項6に記載の薄層構造。 - 導電性薄層構造であって、前記薄層構造は、お互いのうちに入れ子になった複数の領域を含み、前記複数の入れ子領域のうちの一つはグラフェン領域であり、前記複数の入れ子領域のうちの他方は複数の非グラフェン領域であり、前記グラフェン領域は、一対の非グラフェン領域の間に挟まれ、前記薄層構造は、前記グラフェン領域の部分と、前記複数の非グラフェン領域の部分とを含む最上部表面を含み、前記複数の非グラフェン領域のうちの少なくとも一つは導電性である、導電性薄層構造と、
前記薄層構造の前記上部表面上で、前記薄層構造の一部へとそこを通って伸長する開口を有する電気的に絶縁性の材料であって、前記複数の非グラフェン領域間にグラフェンを有する代わりに、前記一対の非グラフェン領域の間にスペースを有することによって、前記部分は、前記薄層構造の他の複数の部分とは異なる、電気的に絶縁性の材料と、
前記開口内および前記スペース内の導電性材料と、
を含む、
ことを特徴とする電気的相互接続。 - 前記複数の非グラフェン領域のうちの前記少なくとも一つは、銅およびニッケルのうちの一つもしくはその双方を含む、
ことを特徴とする請求項9に記載の電気的相互接続。 - 前記導電性材料は、少なくとも一つの金属を含む、
ことを特徴とする請求項9に記載の電気的相互接続。 - 電気的相互接続を形成する方法であって、
電気的に絶縁性の材料にトレンチを形成するステップと、
前記トレンチを配列し、かつ前記第一のトレンチ内に入れ子になった第二のトレンチを形成するために、前記トレンチ内に第一の非グラフェン材料を形成するステップと、
前記第二のトレンチを配列し、かつ、前記第二のトレンチ内に入れ子になった第三のトレンチを形成するために、前記第一の非グラフェン材料上にグラフェンを形成するステップと、
前記第三のトレンチ内に第二の非グラフェン材料を形成するステップと、
を含む、
ことを特徴とする方法。 - 前記グラフェンは、5つのグラフェン単層の厚さよりも小さい、
ことを特徴とする請求項12に記載の方法。 - 前記グラフェンは、1つから3つの間のグラフェン単層の厚さである、
ことを特徴とする請求項12に記載の方法。 - 前記第一および第二の非グラフェン材料は、お互いに同一の組成である、
ことを特徴とする請求項12に記載の方法。 - 前記第一の非グラフェン材料は、前記第二の非グラフェン材料とは異なる組成である、
ことを特徴とする請求項12に記載の方法。 - 前記第一の非グラフェン材料は、少なくとも一つの金属を含む、
ことを特徴とする請求項12に記載の方法。 - 前記第一の非グラフェン材料は、銅およびニッケルのうちの一つもしくはその双方を含む、
ことを特徴とする請求項12に記載の方法。 - 前記第二の非グラフェン材料は、前記第三のトレンチを完全に充填する、
ことを特徴とする請求項12に記載の方法。 - 前記第二の非グラフェン材料は、前記第三のトレンチを配列し、かつ、前記第三のトレンチ内に入れ子になった第四のトレンチを形成し、
前記第四のトレンチを配列し、かつ、前記第四のトレンチ内に入れ子になった第五のトレンチを形成するために、前記第二の非グラフェン材料上にグラフェンを形成するステップと、
前記第五のトレンチ内に第三の非グラフェン材料を形成するステップと、
をさらに含む、
ことを特徴とする請求項12に記載の方法。 - 前記第一、第二および第三の非グラフェン材料は、お互いに同一の組成である、
ことを特徴とする請求項20に記載の方法。 - 前記第一、第二および第三の非グラフェン材料のうちの少なくとも一つは、前記第一、第二および第三の非グラフェン材料のうちの他の材料とは異なる組成である、
ことを特徴とする請求項20に記載の方法。 - 前記第一、第二および第三の非グラフェン材料のうちの少なくとも一つは、電気的に絶縁性である、
ことを特徴とする請求項20に記載の方法。 - 電気的相互接続を形成する方法であって、
導電性薄層構造を形成するステップであって、前記薄層構造は、お互いのうちに入れ子になった複数の領域を含み、前記複数の入れ子領域のうちの一つは、グラフェン領域であり、前記複数の入れ子領域のうちの他方は複数の非グラフェン領域であり、前記グラフェン領域は、一対の非グラフェン領域の間に挟まれ、前記薄層構造は、前記グラフェン領域の部分と前記複数の非グラフェン領域の部分とを含む最上部表面を含み、前記複数の非グラフェン領域のうちの少なくとも一つは導電性である、ステップと、
前記薄層構造の前記上部表面上に、電気的に絶縁性の材料を形成するステップと、
前記薄層構造の前記上部表面へと、前記絶縁性材料を通って伸長する開口を形成するステップと、
前記複数の非グラフェン領域に対して、前記グラフェン領域を選択的に除去するために、前記開口内にエッチャントを提供し、それによって、前記一対の非グラフェン領域の間にスペースを形成するステップと、
前記開口内、および前記スペース内に導電性材料を形成するステップと、
を含む、
ことを特徴とする方法。 - 前記グラフェン領域の内部内に入れ子になった前記非グラフェン領域は、内部非グラフェン領域であり、前記スペースは、前記内部非グラフェン領域の全体を包囲して伸長する、
ことを特徴とする請求項24に記載の方法。 - 前記グラフェン領域の内部内に入れ子になった前記非グラフェン領域は、内部非グラフェン領域であり、前記スペースは、前記内部非グラフェン領域を部分的にのみ包囲して伸長する、
ことを特徴とする請求項24に記載の方法。 - 前記複数の非グラフェン領域のうちの双方が導電性である、
ことを特徴とする請求項24に記載の方法。 - 前記複数の非グラフェン領域のうちの唯一つだけが導電性である、
ことを特徴とする請求項24に記載の方法。 - 電気的相互接続を形成する方法であって、
導電性薄層構造を形成するステップであって、前記薄層構造は、お互いの内に入れ子になった複数の領域を含み、前記複数の入れ子領域のうちの一つはグラフェン領域であり、前記複数の入れ子領域のうちの他方は、複数の非グラフェン領域であり、前記グラフェン領域は、一対の非グラフェン領域の間に挟まれ、前記薄層構造は、前記グラフェン領域の部分と前記複数の非グラフェン領域の部分とを含む最上部表面を含み、前記複数の非グラフェン領域のうちの少なくとも一つは導電性である、ステップと、
前記薄層構造の前記上部表面上に電気的に絶縁性の材料を形成するステップと、
前記薄層構造の前記上部表面へと、前記絶縁性材料を通って伸長する開口を形成するステップと、
前記薄層構造を少なくとも部分的に通って前記開口を伸長するステップと、
前記開口内に導電性材料を形成するステップと、
を含む、
ことを特徴とする方法。 - 開口は、前記薄層構造全体を通って伸長する、
ことを特徴とする請求項29に記載の方法。 - 開口は、前記薄層構造を部分的にのみ通って伸長する、
ことを特徴とする請求項29に記載の方法。 - 前記複数の非グラフェン領域のうちの双方が導電性である、
ことを特徴とする請求項29に記載の方法。 - 前記複数の非グラフェン領域のうちの唯一つだけが導電性である、
ことを特徴とする請求項29に記載の方法。
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