JP2013528320A5 - - Google Patents

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Publication number
JP2013528320A5
JP2013528320A5 JP2013511632A JP2013511632A JP2013528320A5 JP 2013528320 A5 JP2013528320 A5 JP 2013528320A5 JP 2013511632 A JP2013511632 A JP 2013511632A JP 2013511632 A JP2013511632 A JP 2013511632A JP 2013528320 A5 JP2013528320 A5 JP 2013528320A5
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JP
Japan
Prior art keywords
substrate
carrier structure
substrate carrier
support
support unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013511632A
Other languages
English (en)
Japanese (ja)
Other versions
JP5876037B2 (ja
JP2013528320A (ja
Filing date
Publication date
Priority claimed from EP10163959A external-priority patent/EP2390906A1/en
Application filed filed Critical
Publication of JP2013528320A publication Critical patent/JP2013528320A/ja
Publication of JP2013528320A5 publication Critical patent/JP2013528320A5/ja
Application granted granted Critical
Publication of JP5876037B2 publication Critical patent/JP5876037B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013511632A 2010-05-26 2011-05-23 静電放電(esd)の低減のための装置及び方法 Expired - Fee Related JP5876037B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10163959.9 2010-05-26
EP10163959A EP2390906A1 (en) 2010-05-26 2010-05-26 Apparatus and method for electrostatic discharge (ESD) reduction
PCT/EP2011/058362 WO2011147775A1 (en) 2010-05-26 2011-05-23 Apparatus and method for electrostatic discharge (esd) reduction

Publications (3)

Publication Number Publication Date
JP2013528320A JP2013528320A (ja) 2013-07-08
JP2013528320A5 true JP2013528320A5 (https=) 2014-08-07
JP5876037B2 JP5876037B2 (ja) 2016-03-02

Family

ID=42664837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013511632A Expired - Fee Related JP5876037B2 (ja) 2010-05-26 2011-05-23 静電放電(esd)の低減のための装置及び方法

Country Status (7)

Country Link
US (1) US8531198B2 (https=)
EP (1) EP2390906A1 (https=)
JP (1) JP5876037B2 (https=)
KR (1) KR101506937B1 (https=)
CN (1) CN102906868B (https=)
TW (1) TWI459503B (https=)
WO (1) WO2011147775A1 (https=)

Families Citing this family (9)

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Publication number Priority date Publication date Assignee Title
DE102012100927A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Prozessmodul
US9229446B2 (en) 2012-05-08 2016-01-05 International Business Machines Corporation Production line quality processes
KR102205030B1 (ko) 2013-12-17 2021-01-20 삼성디스플레이 주식회사 표시장치
KR102271585B1 (ko) 2014-02-10 2021-07-01 삼성디스플레이 주식회사 표시 장치
CN115901831A (zh) * 2014-12-22 2023-04-04 应用材料公司 用于检查基板的设备、用于检查基板的方法、大面积基板检查设备及其操作方法
CN110178238B (zh) * 2017-01-11 2023-07-28 应用材料公司 用于处理基板的方法和设备和对应的显示元件
CN108470851B (zh) * 2018-03-26 2020-03-06 京东方科技集团股份有限公司 基板处理方法和基板处理装置
CN110899271B (zh) * 2018-09-17 2021-10-15 北京北方华创微电子装备有限公司 远程等离子源的调整装置及远程等离子源清洗系统
CN119375567A (zh) * 2023-07-25 2025-01-28 Jcet星科金朋韩国有限公司 用于测试电子器件的设备

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Publication number Priority date Publication date Assignee Title
JPH06219513A (ja) * 1993-01-27 1994-08-09 Nikon Corp 搬送装置
US5966021A (en) * 1996-04-03 1999-10-12 Pycon, Inc. Apparatus for testing an integrated circuit in an oven during burn-in
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
JPH11219882A (ja) * 1998-02-02 1999-08-10 Nikon Corp ステージ及び露光装置
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6319102B1 (en) * 1999-07-09 2001-11-20 International Business Machines Corporation Capacitor coupled chuck for carbon dioxide snow cleaning system
JP4590031B2 (ja) * 2000-07-26 2010-12-01 東京エレクトロン株式会社 被処理体の載置機構
US6914423B2 (en) * 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6326220B1 (en) * 2000-11-11 2001-12-04 Macronix International Co., Ltd. Method for determining near-surface doping concentration
US6824612B2 (en) * 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US6833717B1 (en) * 2004-02-12 2004-12-21 Applied Materials, Inc. Electron beam test system with integrated substrate transfer module
JP4905135B2 (ja) * 2004-12-01 2012-03-28 株式会社ニコン ステージ装置及び露光装置
US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US20060273815A1 (en) 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
JP4895635B2 (ja) * 2006-02-20 2012-03-14 セイコーインスツル株式会社 搬送装置
TW200746268A (en) * 2006-04-11 2007-12-16 Applied Materials Inc Process for forming cobalt-containing materials
US8008166B2 (en) * 2007-07-26 2011-08-30 Applied Materials, Inc. Method and apparatus for cleaning a substrate surface
JP5142634B2 (ja) * 2007-08-27 2013-02-13 新電元工業株式会社 電界効果型半導体装置
JP2009054746A (ja) * 2007-08-27 2009-03-12 Nikon Corp 静電チャック及び静電チャック方法
JP5276921B2 (ja) * 2008-08-08 2013-08-28 株式会社日立ハイテクノロジーズ 検査装置
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation

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