KR101506937B1 - 정전 방전(ｅｓｄ) 감소를 위한 장치 및 방법 - Google Patents

정전 방전(ｅｓｄ) 감소를 위한 장치 및 방법 Download PDF

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KR101506937B1
KR101506937B1 KR1020127027935A KR20127027935A KR101506937B1 KR 101506937 B1 KR101506937 B1 KR 101506937B1 KR 1020127027935 A KR1020127027935 A KR 1020127027935A KR 20127027935 A KR20127027935 A KR 20127027935A KR 101506937 B1 KR101506937 B1 KR 101506937B1
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South Korea
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substrate
carrier structure
support
ground
substrate carrier
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KR1020127027935A
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English (en)
Korean (ko)
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KR20130075730A (ko
Inventor
베른하르트 군터 뮐러
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020127027935A 2010-05-26 2011-05-23 정전 방전(ｅｓｄ) 감소를 위한 장치 및 방법 Active KR101506937B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10163959.9 2010-05-26
EP10163959A EP2390906A1 (en) 2010-05-26 2010-05-26 Apparatus and method for electrostatic discharge (ESD) reduction
PCT/EP2011/058362 WO2011147775A1 (en) 2010-05-26 2011-05-23 Apparatus and method for electrostatic discharge (esd) reduction

Publications (2)

Publication Number Publication Date
KR20130075730A KR20130075730A (ko) 2013-07-05
KR101506937B1 true KR101506937B1 (ko) 2015-03-31

Family

ID=42664837

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127027935A Active KR101506937B1 (ko) 2010-05-26 2011-05-23 정전 방전(ｅｓｄ) 감소를 위한 장치 및 방법

Country Status (7)

Country Link
US (1) US8531198B2 (https=)
EP (1) EP2390906A1 (https=)
JP (1) JP5876037B2 (https=)
KR (1) KR101506937B1 (https=)
CN (1) CN102906868B (https=)
TW (1) TWI459503B (https=)
WO (1) WO2011147775A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012100927A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Prozessmodul
US9229446B2 (en) 2012-05-08 2016-01-05 International Business Machines Corporation Production line quality processes
KR102205030B1 (ko) 2013-12-17 2021-01-20 삼성디스플레이 주식회사 표시장치
KR102271585B1 (ko) 2014-02-10 2021-07-01 삼성디스플레이 주식회사 표시 장치
CN115901831A (zh) * 2014-12-22 2023-04-04 应用材料公司 用于检查基板的设备、用于检查基板的方法、大面积基板检查设备及其操作方法
CN110178238B (zh) * 2017-01-11 2023-07-28 应用材料公司 用于处理基板的方法和设备和对应的显示元件
CN108470851B (zh) * 2018-03-26 2020-03-06 京东方科技集团股份有限公司 基板处理方法和基板处理装置
CN110899271B (zh) * 2018-09-17 2021-10-15 北京北方华创微电子装备有限公司 远程等离子源的调整装置及远程等离子源清洗系统
CN119375567A (zh) * 2023-07-25 2025-01-28 Jcet星科金朋韩国有限公司 用于测试电子器件的设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
JPH11219882A (ja) * 1998-02-02 1999-08-10 Nikon Corp ステージ及び露光装置
KR20070083498A (ko) * 2004-12-01 2007-08-24 가부시키가이샤 니콘 스테이지 장치 및 노광 장치
JP2009054756A (ja) * 2007-08-27 2009-03-12 Shindengen Electric Mfg Co Ltd 電界効果型半導体装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06219513A (ja) * 1993-01-27 1994-08-09 Nikon Corp 搬送装置
US5966021A (en) * 1996-04-03 1999-10-12 Pycon, Inc. Apparatus for testing an integrated circuit in an oven during burn-in
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6319102B1 (en) * 1999-07-09 2001-11-20 International Business Machines Corporation Capacitor coupled chuck for carbon dioxide snow cleaning system
JP4590031B2 (ja) * 2000-07-26 2010-12-01 東京エレクトロン株式会社 被処理体の載置機構
US6914423B2 (en) * 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6326220B1 (en) * 2000-11-11 2001-12-04 Macronix International Co., Ltd. Method for determining near-surface doping concentration
US6824612B2 (en) * 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US6833717B1 (en) * 2004-02-12 2004-12-21 Applied Materials, Inc. Electron beam test system with integrated substrate transfer module
US7535238B2 (en) * 2005-04-29 2009-05-19 Applied Materials, Inc. In-line electron beam test system
US20060273815A1 (en) 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
JP4895635B2 (ja) * 2006-02-20 2012-03-14 セイコーインスツル株式会社 搬送装置
TW200746268A (en) * 2006-04-11 2007-12-16 Applied Materials Inc Process for forming cobalt-containing materials
US8008166B2 (en) * 2007-07-26 2011-08-30 Applied Materials, Inc. Method and apparatus for cleaning a substrate surface
JP2009054746A (ja) * 2007-08-27 2009-03-12 Nikon Corp 静電チャック及び静電チャック方法
JP5276921B2 (ja) * 2008-08-08 2013-08-28 株式会社日立ハイテクノロジーズ 検査装置
EP2180327A1 (en) * 2008-10-21 2010-04-28 Applied Materials, Inc. Apparatus and method for active voltage compensation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
JPH11219882A (ja) * 1998-02-02 1999-08-10 Nikon Corp ステージ及び露光装置
KR20070083498A (ko) * 2004-12-01 2007-08-24 가부시키가이샤 니콘 스테이지 장치 및 노광 장치
JP2009054756A (ja) * 2007-08-27 2009-03-12 Shindengen Electric Mfg Co Ltd 電界効果型半導体装置

Also Published As

Publication number Publication date
TWI459503B (zh) 2014-11-01
JP5876037B2 (ja) 2016-03-02
KR20130075730A (ko) 2013-07-05
CN102906868A (zh) 2013-01-30
CN102906868B (zh) 2016-06-01
US20110291683A1 (en) 2011-12-01
WO2011147775A1 (en) 2011-12-01
US8531198B2 (en) 2013-09-10
JP2013528320A (ja) 2013-07-08
EP2390906A1 (en) 2011-11-30
TW201218309A (en) 2012-05-01

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