JP2013525146A5 - - Google Patents

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Publication number
JP2013525146A5
JP2013525146A5 JP2013506179A JP2013506179A JP2013525146A5 JP 2013525146 A5 JP2013525146 A5 JP 2013525146A5 JP 2013506179 A JP2013506179 A JP 2013506179A JP 2013506179 A JP2013506179 A JP 2013506179A JP 2013525146 A5 JP2013525146 A5 JP 2013525146A5
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JP
Japan
Prior art keywords
processed product
inorganic thin
thin film
airtight
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013506179A
Other languages
English (en)
Japanese (ja)
Other versions
JP5946140B2 (ja
JP2013525146A (ja
Filing date
Publication date
Priority claimed from US12/763,541 external-priority patent/US8563113B2/en
Application filed filed Critical
Publication of JP2013525146A publication Critical patent/JP2013525146A/ja
Publication of JP2013525146A5 publication Critical patent/JP2013525146A5/ja
Application granted granted Critical
Publication of JP5946140B2 publication Critical patent/JP5946140B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013506179A 2010-04-20 2011-04-14 多層気密バリアおよび関連構造および気密封止方法 Expired - Fee Related JP5946140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/763,541 2010-04-20
US12/763,541 US8563113B2 (en) 2010-04-20 2010-04-20 Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
PCT/US2011/032389 WO2011133373A2 (en) 2010-04-20 2011-04-14 Multi-laminate hermetic barriers and related structures and methods of hermetic sealing

Publications (3)

Publication Number Publication Date
JP2013525146A JP2013525146A (ja) 2013-06-20
JP2013525146A5 true JP2013525146A5 (enExample) 2015-03-05
JP5946140B2 JP5946140B2 (ja) 2016-07-05

Family

ID=44279672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013506179A Expired - Fee Related JP5946140B2 (ja) 2010-04-20 2011-04-14 多層気密バリアおよび関連構造および気密封止方法

Country Status (7)

Country Link
US (2) US8563113B2 (enExample)
EP (1) EP2561562A2 (enExample)
JP (1) JP5946140B2 (enExample)
KR (2) KR101715982B1 (enExample)
CN (2) CN102859741B (enExample)
TW (2) TWI472428B (enExample)
WO (1) WO2011133373A2 (enExample)

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TWI509858B (zh) * 2013-03-29 2015-11-21 Ta Jo Liu 有機半導體裝置
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KR20140120541A (ko) * 2013-04-03 2014-10-14 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
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CN103972414A (zh) * 2014-04-29 2014-08-06 京东方科技集团股份有限公司 一种有机电致发光器件及其封装方法
WO2016073549A1 (en) * 2014-11-05 2016-05-12 Corning Incorporated Glass articles with non-planar features and alkali-free glass elements
CN105261712B (zh) 2015-08-31 2017-07-25 上海和辉光电有限公司 一种柔性oled显示面板
CN109476138B (zh) * 2016-07-26 2021-02-26 富士胶片株式会社 阻气膜及太阳能电池以及阻气膜的制造方法
JP2020500747A (ja) * 2016-12-09 2020-01-16 ビーミス カンパニー インコーポレイテッド ガラスおよびプラスチックの交互の個別の層を有する包装用フィルム
FR3061404B1 (fr) * 2016-12-27 2022-09-23 Packaging Sip Procede de fabrication collective de modules electroniques hermetiques
CN108695441A (zh) * 2017-04-05 2018-10-23 上海和辉光电有限公司 一种oled显示器
WO2019003058A1 (en) * 2017-06-26 2019-01-03 3M Innovative Properties Company STRUCTURED FILM AND ARTICLES THEREFOR
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CN109037480B (zh) * 2018-08-01 2020-11-06 京东方科技集团股份有限公司 显示面板及其制作方法
CN116313903A (zh) * 2023-02-14 2023-06-23 纳宇半导体材料(宁波)有限责任公司 一种芯片粘结和封装互连工艺用防氧化装置及互连方法

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