JP2013525146A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013525146A5 JP2013525146A5 JP2013506179A JP2013506179A JP2013525146A5 JP 2013525146 A5 JP2013525146 A5 JP 2013525146A5 JP 2013506179 A JP2013506179 A JP 2013506179A JP 2013506179 A JP2013506179 A JP 2013506179A JP 2013525146 A5 JP2013525146 A5 JP 2013525146A5
- Authority
- JP
- Japan
- Prior art keywords
- processed product
- inorganic thin
- thin film
- airtight
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims 19
- 239000010408 film Substances 0.000 claims 17
- -1 polyethylene naphthalate Polymers 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 4
- 239000002274 desiccant Substances 0.000 claims 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 2
- 230000007935 neutral effect Effects 0.000 claims 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- QUWRNYCGDZRXMR-UHFFFAOYSA-N C1(=CC=CC2=CC=CC=C12)C(=O)O.C=C.C=C.C=C Chemical compound C1(=CC=CC2=CC=CC=C12)C(=O)O.C=C.C=C.C=C QUWRNYCGDZRXMR-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 239000011112 polyethylene naphthalate Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/763,541 US8563113B2 (en) | 2010-04-20 | 2010-04-20 | Multi-laminate hermetic barriers and related structures and methods of hermetic sealing |
| US12/763,541 | 2010-04-20 | ||
| PCT/US2011/032389 WO2011133373A2 (en) | 2010-04-20 | 2011-04-14 | Multi-laminate hermetic barriers and related structures and methods of hermetic sealing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013525146A JP2013525146A (ja) | 2013-06-20 |
| JP2013525146A5 true JP2013525146A5 (enExample) | 2015-03-05 |
| JP5946140B2 JP5946140B2 (ja) | 2016-07-05 |
Family
ID=44279672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013506179A Expired - Fee Related JP5946140B2 (ja) | 2010-04-20 | 2011-04-14 | 多層気密バリアおよび関連構造および気密封止方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8563113B2 (enExample) |
| EP (1) | EP2561562A2 (enExample) |
| JP (1) | JP5946140B2 (enExample) |
| KR (2) | KR101715982B1 (enExample) |
| CN (2) | CN102859741B (enExample) |
| TW (2) | TWI561378B (enExample) |
| WO (1) | WO2011133373A2 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10158057B2 (en) | 2010-10-28 | 2018-12-18 | Corning Incorporated | LED lighting devices |
| TWI612123B (zh) * | 2012-02-03 | 2018-01-21 | Lg化學股份有限公司 | 黏合膜 |
| WO2013130374A1 (en) * | 2012-02-27 | 2013-09-06 | Corning Incorporated | LOW Tg GLASS GASKET FOR HERMETIC SEALING APPLICATIONS |
| TW201343940A (zh) * | 2012-03-14 | 2013-11-01 | Corning Inc | 用於形成密封阻障層之濺射靶材與相關濺射方法 |
| US9299956B2 (en) * | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
| CN104412706B (zh) * | 2012-06-15 | 2017-05-31 | 须贺唯知 | 电子元件的封装方法以及基板接合体 |
| US20140104534A1 (en) * | 2012-10-11 | 2014-04-17 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Paus1211876_ch12193 |
| US20140120315A1 (en) * | 2012-10-25 | 2014-05-01 | Bruce Gardiner Aitken | Flexible multilayer hermetic laminate |
| US10017849B2 (en) | 2012-11-29 | 2018-07-10 | Corning Incorporated | High rate deposition systems and processes for forming hermetic barrier layers |
| US9202996B2 (en) | 2012-11-30 | 2015-12-01 | Corning Incorporated | LED lighting devices with quantum dot glass containment plates |
| US9666763B2 (en) | 2012-11-30 | 2017-05-30 | Corning Incorporated | Glass sealing with transparent materials having transient absorption properties |
| TWI511343B (zh) * | 2013-03-29 | 2015-12-01 | Ta Jo Liu | 有機半導體裝置 |
| TWI509858B (zh) * | 2013-03-29 | 2015-11-21 | Ta Jo Liu | 有機半導體裝置 |
| KR20140120541A (ko) * | 2013-04-03 | 2014-10-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2014182776A1 (en) | 2013-05-10 | 2014-11-13 | Corning Incorporated | Laser welding transparent glass sheets using low melting glass or thin absorbing films |
| TWI642643B (zh) | 2013-06-14 | 2018-12-01 | 康寧公司 | 疊層式密封薄片 |
| KR20150012540A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 유기발광표시장치의 제조방법. |
| CN103456892B (zh) | 2013-09-17 | 2016-06-29 | 京东方科技集团股份有限公司 | 有机电致发光器件封装结构 |
| CN106062989A (zh) * | 2014-02-28 | 2016-10-26 | 康宁股份有限公司 | 挠性显示器装置封装以及制造方法 |
| JP5977776B2 (ja) * | 2014-03-12 | 2016-08-24 | 富士フイルム株式会社 | バリア性積層体、ガスバリアフィルム、積層フィルム、および輸液バッグ |
| US9930793B2 (en) | 2014-03-27 | 2018-03-27 | Intel Corporation | Electric circuit on flexible substrate |
| CN103972414A (zh) * | 2014-04-29 | 2014-08-06 | 京东方科技集团股份有限公司 | 一种有机电致发光器件及其封装方法 |
| US10483210B2 (en) * | 2014-11-05 | 2019-11-19 | Corning Incorporated | Glass articles with non-planar features and alkali-free glass elements |
| CN105261712B (zh) | 2015-08-31 | 2017-07-25 | 上海和辉光电有限公司 | 一种柔性oled显示面板 |
| CN109476138B (zh) * | 2016-07-26 | 2021-02-26 | 富士胶片株式会社 | 阻气膜及太阳能电池以及阻气膜的制造方法 |
| WO2018106263A1 (en) * | 2016-12-09 | 2018-06-14 | Bemis Company, Inc. | Packaging films with alternating individual layers of glass and plastic |
| FR3061404B1 (fr) * | 2016-12-27 | 2022-09-23 | Packaging Sip | Procede de fabrication collective de modules electroniques hermetiques |
| CN108695441A (zh) * | 2017-04-05 | 2018-10-23 | 上海和辉光电有限公司 | 一种oled显示器 |
| WO2019003058A1 (en) * | 2017-06-26 | 2019-01-03 | 3M Innovative Properties Company | STRUCTURED FILM AND ARTICLES THEREFOR |
| WO2019054982A1 (en) * | 2017-09-12 | 2019-03-21 | Bemis Company, Inc. | RIGID GLASS AND POLYMERIC ARTICLES |
| KR102385105B1 (ko) * | 2018-02-27 | 2022-04-08 | 삼성전자주식회사 | 크랙 검출용 칩 및 이를 이용한 크랙 검출 방법 |
| CN109037480B (zh) * | 2018-08-01 | 2020-11-06 | 京东方科技集团股份有限公司 | 显示面板及其制作方法 |
| CN116313903A (zh) * | 2023-02-14 | 2023-06-23 | 纳宇半导体材料(宁波)有限责任公司 | 一种芯片粘结和封装互连工艺用防氧化装置及互连方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5089446A (en) | 1990-10-09 | 1992-02-18 | Corning Incorporated | Sealing materials and glasses |
| US5888648A (en) | 1996-09-12 | 1999-03-30 | Mobil Oil Corporation | Multi-layer hermetically sealable film and method of making same |
| EP1145338B1 (en) | 1998-12-16 | 2012-12-05 | Samsung Display Co., Ltd. | Environmental barrier material for organic light emitting device and method of making |
| IL145317A0 (en) | 1999-04-28 | 2002-06-30 | Du Pont | Flexible organic electronic device with improved resistance to oxygen and moisture degradation |
| JP2000357811A (ja) * | 1999-06-15 | 2000-12-26 | Kanegafuchi Chem Ind Co Ltd | 太陽電池モジュール |
| CN100369744C (zh) * | 2001-10-12 | 2008-02-20 | 皇家飞利浦电子股份有限公司 | 阻挡层及其制造方法 |
| US6936131B2 (en) | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| CN1678639A (zh) * | 2002-07-24 | 2005-10-05 | 粘合剂研究公司 | 可转换的压敏粘合剂胶带及其在显示屏上的用途 |
| JP2004165512A (ja) | 2002-11-14 | 2004-06-10 | Matsushita Electric Works Ltd | 有機光電変換素子 |
| JP4254350B2 (ja) * | 2002-12-16 | 2009-04-15 | 住友ベークライト株式会社 | 透明バリアフィルム |
| KR100544121B1 (ko) | 2003-07-19 | 2006-01-23 | 삼성에스디아이 주식회사 | 유기 전계 발광표시장치 |
| US7052355B2 (en) | 2003-10-30 | 2006-05-30 | General Electric Company | Organic electro-optic device and method for making the same |
| JP2005251671A (ja) | 2004-03-08 | 2005-09-15 | Fuji Photo Film Co Ltd | 表示装置 |
| JP4716773B2 (ja) * | 2005-04-06 | 2011-07-06 | 富士フイルム株式会社 | ガスバリアフィルムとそれを用いた有機デバイス |
| US20060278965A1 (en) * | 2005-06-10 | 2006-12-14 | Foust Donald F | Hermetically sealed package and methods of making the same |
| US7722929B2 (en) | 2005-08-18 | 2010-05-25 | Corning Incorporated | Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device |
| US7829147B2 (en) | 2005-08-18 | 2010-11-09 | Corning Incorporated | Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device |
| US20070040501A1 (en) | 2005-08-18 | 2007-02-22 | Aitken Bruce G | Method for inhibiting oxygen and moisture degradation of a device and the resulting device |
| WO2007034773A1 (ja) | 2005-09-20 | 2007-03-29 | Mitsubishi Plastics, Inc. | ガスバリア性積層フィルム |
| US20080048178A1 (en) * | 2006-08-24 | 2008-02-28 | Bruce Gardiner Aitken | Tin phosphate barrier film, method, and apparatus |
| US7800303B2 (en) * | 2006-11-07 | 2010-09-21 | Corning Incorporated | Seal for light emitting display device, method, and apparatus |
| US8115326B2 (en) | 2006-11-30 | 2012-02-14 | Corning Incorporated | Flexible substrates having a thin-film barrier |
| JP5080838B2 (ja) | 2007-03-29 | 2012-11-21 | 富士フイルム株式会社 | 電子デバイスおよびその製造方法 |
| JP2008306179A (ja) | 2007-05-21 | 2008-12-18 | Applied Materials Inc | バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置 |
| US20080290798A1 (en) | 2007-05-22 | 2008-11-27 | Mark Alejandro Quesada | LLT barrier layer for top emission display device, method and apparatus |
| AU2007355605B2 (en) * | 2007-06-25 | 2012-04-26 | Second Sight Medical Products, Inc. | Method for providing hermetic electrical feedthrough |
| JP5827789B2 (ja) | 2010-03-26 | 2015-12-02 | 東洋鋼鈑株式会社 | 光輝性に優れた絞りしごき缶用樹脂被覆Al板及び絞りしごき缶の製造方法 |
-
2010
- 2010-04-20 US US12/763,541 patent/US8563113B2/en not_active Expired - Fee Related
-
2011
- 2011-04-11 TW TW103146343A patent/TWI561378B/zh not_active IP Right Cessation
- 2011-04-11 TW TW100112360A patent/TWI472428B/zh not_active IP Right Cessation
- 2011-04-14 CN CN201180019944.8A patent/CN102859741B/zh not_active Expired - Fee Related
- 2011-04-14 JP JP2013506179A patent/JP5946140B2/ja not_active Expired - Fee Related
- 2011-04-14 KR KR1020127029637A patent/KR101715982B1/ko not_active Expired - Fee Related
- 2011-04-14 KR KR1020157003346A patent/KR101769690B1/ko not_active Expired - Fee Related
- 2011-04-14 EP EP11717095A patent/EP2561562A2/en not_active Withdrawn
- 2011-04-14 WO PCT/US2011/032389 patent/WO2011133373A2/en not_active Ceased
- 2011-04-14 CN CN201510008911.3A patent/CN104647851A/zh active Pending
-
2013
- 2013-09-20 US US14/032,663 patent/US9555595B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013525146A5 (enExample) | ||
| CN102859741B (zh) | 多层叠气密性阻挡层和相关结构以及气密性密封方法 | |
| WO2008156039A1 (ja) | ブリスターパック形成用樹脂積層フィルムおよびブリスターパック | |
| JP2007531238A5 (enExample) | ||
| CN104600204B (zh) | Oled封装结构及封装方法 | |
| JP2013069808A5 (enExample) | ||
| JP2007324121A5 (enExample) | ||
| JP2007265987A5 (enExample) | ||
| CN103956435A (zh) | 一种有机发光二极管的胶带封装结构 | |
| EP2626898A3 (en) | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | |
| BRPI1011547A2 (pt) | produto com substrato biorreabsorvíveis e embalagem | |
| CN103384447A (zh) | 软性电子装置 | |
| WO2011005952A3 (en) | Methods for forming fritted cover sheets with masks and glass packages comprising the same | |
| CN104157799A (zh) | Oled的封装方法及oled封装结构 | |
| CN109616588A (zh) | 一种发光器件的封装结构、封装方法和显示装置 | |
| TW200723944A (en) | Dual display unit and method of making same | |
| GB2546681A (en) | Flexible oled substrate and flexible oled packaging method | |
| CN111578045A (zh) | 一种多功能复合真空绝热板及其制作封装方法 | |
| EP2211363A3 (en) | Manufacturing method of airtight container and image displaying apparatus | |
| WO2011149317A3 (ko) | 수분 및/또는 산소 투과 방지를 위한 유연성 유/무기 복합 보호막, 그의 제조방법, 및 상기 유연성 유/무기 복합 보호막을 포함하는 전자소자 | |
| TW200739989A (en) | Organic light emitting display device and method of fabricating the same | |
| US20140124132A1 (en) | Metal sheet for encapsulating organic light-emitting display device and encapsulating method of encapsulation using the same | |
| JP2012220578A5 (ja) | 表示装置の製造方法 | |
| WO2018072297A1 (zh) | Oled显示面板的制作方法 | |
| CN204204920U (zh) | 显示面板和显示装置 |