JP2013518388A - 集合体、集合方法および集合体用のタイル - Google Patents
集合体、集合方法および集合体用のタイル Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 13
- 230000002776 aggregation Effects 0.000 title claims description 3
- 238000004220 aggregation Methods 0.000 title claims description 3
- 239000011888 foil Substances 0.000 claims abstract description 77
- 241000251468 Actinopterygii Species 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 33
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 239000002759 woven fabric Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000926 separation method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000969 carrier Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- AZUYLZMQTIKGSC-UHFFFAOYSA-N 1-[6-[4-(5-chloro-6-methyl-1H-indazol-4-yl)-5-methyl-3-(1-methylindazol-5-yl)pyrazol-1-yl]-2-azaspiro[3.3]heptan-2-yl]prop-2-en-1-one Chemical compound ClC=1C(=C2C=NNC2=CC=1C)C=1C(=NN(C=1C)C1CC2(CN(C2)C(C=C)=O)C1)C=1C=C2C=NN(C2=CC=1)C AZUYLZMQTIKGSC-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 210000003953 foreskin Anatomy 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000002560 therapeutic procedure Methods 0.000 description 1
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Abstract
Description
・前記電気伝導体の少なくとも一つが少なくとも第一の電気伝導性のトラックを有し、
・前記箔は、前記少なくとも第一の電気伝導性のトラックを設けられた第一の主表面と、該第一の主表面の反対側にあり担体のほうに面する第二の主表面とを有する。
・前記少なくとも第一の電気伝導性のトラックと並行して少なくとも第一の切り込みが前記箔を通じて延在し、それにより前記少なくとも第一の電気伝導性のトラックの一部を担持する前記箔のストリップ形状部分を画定する。
・前記少なくとも第一の電気伝導性のトラックは担体の電気伝導体に電気的に接続される。
・前記箔は、そのストリップ形状部分をもって前記担体に取り付けられる。
Claims (22)
- 複数のタイルと担体との集合体であって、前記タイルは電気物理トランスデューサおよび該トランスデューサへの電気コネクタをもつ箔を有し、前記タイルは前記担体に機械的かつ電気的に結合され、前記タイルは魚の鱗パターンに従って重なる、集合体。
- 各タイルが第一の、活性な領域と、第二の、不活性な領域を有し、前記複数のタイルのうちのタイル(1e〜1h)の前記第一の活性領域が、前記複数のタイルのうちの他のタイル(1a〜1d)の前記第二の不活性領域に重なる、請求項1記載の集合体。
- 前記第二の不活性領域は、前記電気物理トランスデューサのための電源接点を設けられる、請求項2記載の集合体。
- 前記タイルの前記活性領域が丸まったエッジをもつ、請求項2または3記載の集合体。
- 請求項1ないし4のうちいずれか一項記載の集合体であって、
・前記電気伝導体の少なくとも一つが少なくとも第一の電気伝導性トラックを有し、
・前記箔が、前記少なくとも第一の電気伝導性トラックを設けられた第一の主表面と、該第一の主表面の反対側にあり前記担体に面する第二の主表面とを有し、
・前記少なくとも第一の電気伝導性トラックと並行して少なくとも第一の切り込みが前記箔を通って延在し、それにより前記少なくとも第一の電気伝導性トラックの一部を担持する前記箔のストリップ形状部分を画定し、
・前記少なくとも第一の電気伝導性トラックは前記担体の電気伝導体に電気的に接続され、
・前記箔は、そのストリップ形状部分をもって前記担体に取り付けられる、
集合体。 - 前記少なくとも第一の電気伝導性トラックと前記担体の電気伝導体との間の電気的な接続が、前記第二の表面から、前記少なくとも第一の切り込みを通り、前記少なくとも第一の電気伝導性のトラックに当たって延在する電気伝導性要素によって形成される、請求項5記載の集合体。
- 前記箔が、前記少なくとも第一の切り込み(25a)に対向して前記少なくとも第一の電気伝導性トラック(24)のある側に、前記箔を通って延在する少なくとも第二の切り込み(25b)を有し、前記電気伝導性要素がさらに前記少なくとも第二の切り込みを通って延在する、請求項5記載の集合体。
- 前記少なくとも第一の電気伝導性トラック(24)が前記電気物理トランスデューサの第一の接点のはたらきをし、前記箔は第二の接点としてはたらく第二の電気伝導性トラック(28)を設けられる、請求項5記載の集合体。
- 前記第一の電気伝導性トラックが前記担体上の前記電気伝導体(421)に結合されるのと同様の仕方で前記第二の電気伝導性トラックが前記担体上のさらなる電気伝導体(422)に結合され、前記第二の電気伝導性トラックの一部分が第二のストリップ形状部分によって担持される、請求項8記載の集合体。
- 前記第一のストリップ形状部分および前記第二のストリップ形状部分が互いに直交する方向に、前記電気物理トランスデューサの隣り合う辺に配置されている、請求項9記載の集合体。
- 前記電気物理トランスデューサがOLEDであり、前記第一および第二の電気伝導性トラックが該OLEDのアノードおよびカソードへの接点のはたらきをする、請求項8ないし10のうちいずれか一項記載の集合体。
- 前記電気伝導性要素が電気伝導性ワイヤである、請求項6記載の集合体。
- 前記電気伝導性ワイヤがばねである、請求項12記載の集合体。
- 前記伝導性要素がステープル様のピッチである、請求項6記載の集合体。
- 前記担体が製織物である、請求項1記載の集合体。
- 前記担体が箔である、請求項1記載の集合体。
- 前記担体が伸張可能である、請求項1記載の集合体。
- 前記少なくとも一つの切り込みが切り込み延長ストッパーの形で終わる、請求項1記載の集合体。
- 前記箔は第一および第二の向かい合う辺と、前記第一と第二の辺の間に延在する第三の辺とを有し、前記箔は複数の切り込みを有し、各切り込みは前記第一および第二の辺の一方から延びており、相続く切り込みは前記箔の互いに反対側の辺から延び、それにより蛇行するストリップ形状部分を形成し、前記電気伝導性のトラックは前記蛇行するストリップ形状部分の上に延在する、請求項1記載の集合体。
- 請求項1記載の集合体であって、各タイルは制御設備を有し、複数のセクションに分割される活性領域を有し、各セクションは発光要素を電気物理トランスデューサとして有し、センサー要素を前記セクションが別のタイルによって覆われているか否かを感知するためのさらなる電気物理トランスデューサとして有し、前記制御設備は、少なくとも部分的に覆われていないことが感知されるセクション内の電気物理トランスデューサのみを選択的に活性化するよう構成される、集合体。
- 複数のタイルを担体とともに集合させる方法であって、前記タイルは電気物理トランスデューサおよび前記トランスデューサへの電気コネクタをもつ箔を有し、当該方法は、
前記タイルを機械的および電気的に前記担体に結合し、それにより前記タイルを魚の鱗パターンに従って重ねることを含む、
方法。 - 前記集合体において使うよう構成される、請求項1ないし20のうちいずれか一項記載のタイル。
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PCT/NL2011/050062 WO2011093711A1 (en) | 2010-01-29 | 2011-01-31 | Assembly, method of assembling, and tile for use in assembly |
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JP2012551109A Expired - Fee Related JP5789617B2 (ja) | 2010-01-29 | 2011-01-31 | 集合体、集合方法および集合体用のタイル |
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EP (3) | EP2529606A1 (ja) |
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JP5864440B2 (ja) | 2016-02-17 |
US20130201637A1 (en) | 2013-08-08 |
CN102742371B (zh) | 2015-11-25 |
WO2011093713A2 (en) | 2011-08-04 |
EP2529607A2 (en) | 2012-12-05 |
WO2011093712A1 (en) | 2011-08-04 |
JP2013519106A (ja) | 2013-05-23 |
JP6087151B2 (ja) | 2017-03-01 |
JP2013518308A (ja) | 2013-05-20 |
CN102742027B (zh) | 2015-09-09 |
CN102742369B (zh) | 2015-09-30 |
CN102742369A (zh) | 2012-10-17 |
CN102742027A (zh) | 2012-10-17 |
US9078361B2 (en) | 2015-07-07 |
JP5789617B2 (ja) | 2015-10-07 |
WO2011093713A3 (en) | 2011-09-29 |
US20130201636A1 (en) | 2013-08-08 |
US9480151B2 (en) | 2016-10-25 |
EP2529409B1 (en) | 2019-08-28 |
WO2011093711A1 (en) | 2011-08-04 |
US20130200783A1 (en) | 2013-08-08 |
US9402306B2 (en) | 2016-07-26 |
CN102742371A (zh) | 2012-10-17 |
EP2529409A1 (en) | 2012-12-05 |
EP2529606A1 (en) | 2012-12-05 |
EP2529607B1 (en) | 2019-01-23 |
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