JP2013516755A - 流体ジェットを用いて孔を作製する方法 - Google Patents
流体ジェットを用いて孔を作製する方法 Download PDFInfo
- Publication number
- JP2013516755A JP2013516755A JP2012546479A JP2012546479A JP2013516755A JP 2013516755 A JP2013516755 A JP 2013516755A JP 2012546479 A JP2012546479 A JP 2012546479A JP 2012546479 A JP2012546479 A JP 2012546479A JP 2013516755 A JP2013516755 A JP 2013516755A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- adhesive region
- region
- adhesive
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Forests & Forestry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (7)
- 層(4)に孔(5)を作製する方法において、
支持体(2)の表面に、第1の接着領域(1a)および第2の接着領域(1b)を設けるステップであって、該第1の接着領域(1a)の寸法が、前記孔(5)の寸法に対応する、ステップと、
前記第1の接着領域および前記第2の接着領域に前記層(4)を堆積させるステップであって、該層(4)の材料が、前記第2の接着領域(1b)に対する粘着係数よりも低い、前記第1の接着領域(1a)に対する粘着係数を有する、ステップと、
ジェット流体(6)を用いて、前記第1の接着領域(1a)における前記層の一部を除去するステップとを含むことを特徴とする方法。 - 前記層(4)の前記材料が、誘電材料であることを特徴とする、請求項1に記載の方法。
- 前記層(4)の前記材料が有機性であり、前記除去ステップの前に該層の該材料を硬化させるステップを含むことを特徴とする、請求項1又は2に記載の方法。
- 前記層(4)の前記材料が、紫外線下で架橋可能であることを特徴とする、請求項3に記載の方法。
- 前記第1の接着領域(1a)および前記第2の接着領域(1b)が、接着層(3)を局所的に堆積させることによって形成されることを特徴とする、請求項1から4のいずれか一項に記載の方法。
- 前記接着層(3)が、自己組織化単分子膜(SAM)であることを特徴とする、請求項5に記載の方法。
- 前記接着層(3)が、金属層であることを特徴とする、請求項5に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1000006A FR2954918B1 (fr) | 2010-01-04 | 2010-01-04 | Procede de realisation de trous a l'aide d'un jet d'eau |
FR1000006 | 2010-01-04 | ||
PCT/FR2010/000865 WO2011080419A1 (fr) | 2010-01-04 | 2010-12-22 | Procede de realisation de trous a l'aide d'un jet de fluide |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013516755A true JP2013516755A (ja) | 2013-05-13 |
JP5694373B2 JP5694373B2 (ja) | 2015-04-01 |
Family
ID=42537640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012546479A Expired - Fee Related JP5694373B2 (ja) | 2010-01-04 | 2010-12-22 | 流体ジェットを用いて孔を作製する方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8450217B2 (ja) |
EP (1) | EP2521638B1 (ja) |
JP (1) | JP5694373B2 (ja) |
KR (1) | KR20120102103A (ja) |
CN (1) | CN102781637B (ja) |
BR (1) | BR112012016337A2 (ja) |
FR (1) | FR2954918B1 (ja) |
RU (1) | RU2544715C2 (ja) |
WO (1) | WO2011080419A1 (ja) |
ZA (1) | ZA201204508B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11043409B2 (en) | 2018-03-05 | 2021-06-22 | Infineon Technologies Ag | Method of forming contacts to an embedded semiconductor die and related semiconductor packages |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63169299A (ja) * | 1987-01-06 | 1988-07-13 | 富士通株式会社 | ウオ−タジエツトカツタのノズルユニツト |
JP2000021873A (ja) * | 1998-06-26 | 2000-01-21 | Fujitsu Ltd | 積層構造、配線構造、その製造方法、及び半導体装置 |
JP2002026229A (ja) * | 2000-07-07 | 2002-01-25 | Seiko Epson Corp | 配線間接続孔の形成方法 |
US6403397B1 (en) * | 2000-06-28 | 2002-06-11 | Agere Systems Guardian Corp. | Process for fabricating organic semiconductor device involving selective patterning |
JP2004111818A (ja) * | 2002-09-20 | 2004-04-08 | Seiko Epson Corp | パターン形成方法 |
JP2008159971A (ja) * | 2006-12-26 | 2008-07-10 | Konica Minolta Holdings Inc | 導電パターン形成方法、有機薄膜トランジスタ製造方法、及び該製造方法により作製した有機薄膜トランジスタ |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU1085437A1 (ru) * | 1982-05-21 | 1987-04-15 | Предприятие П/Я А-1889 | Способ изготовлени полевых транзисторов |
JPH0714836A (ja) * | 1993-06-17 | 1995-01-17 | Kawasaki Steel Corp | 多層配線構造の半導体装置 |
JPH10270555A (ja) * | 1997-03-27 | 1998-10-09 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US6207573B1 (en) * | 1999-05-19 | 2001-03-27 | Infineon Technologies North America Corp. | Differential trench open process |
US6403393B1 (en) * | 1999-09-01 | 2002-06-11 | International Business Machines Corporation | Device having integrated optical and copper conductors and method of fabricating same |
JP3986743B2 (ja) * | 2000-10-03 | 2007-10-03 | 株式会社日立製作所 | 配線基板とその製造方法及びそれに用いる無電解銅めっき液 |
WO2004027471A1 (ja) * | 2002-09-18 | 2004-04-01 | Fujitsu Limited | 光導波路デバイスおよび光導波路デバイスの製造方法 |
WO2006000915A2 (en) * | 2004-01-13 | 2006-01-05 | Lionix Bv | Surface waveguide and method of manufacture |
US7105375B2 (en) * | 2004-07-30 | 2006-09-12 | Xerox Corporation | Reverse printing |
US7138068B2 (en) * | 2005-03-21 | 2006-11-21 | Motorola, Inc. | Printed circuit patterned embedded capacitance layer |
US7589018B2 (en) * | 2006-11-09 | 2009-09-15 | Seiko Epson Corporation | Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device |
KR20090035962A (ko) * | 2007-10-08 | 2009-04-13 | 세메스 주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
-
2010
- 2010-01-04 FR FR1000006A patent/FR2954918B1/fr not_active Expired - Fee Related
- 2010-12-22 RU RU2012133297/02A patent/RU2544715C2/ru not_active IP Right Cessation
- 2010-12-22 US US13/519,265 patent/US8450217B2/en active Active
- 2010-12-22 KR KR1020127017331A patent/KR20120102103A/ko not_active Application Discontinuation
- 2010-12-22 WO PCT/FR2010/000865 patent/WO2011080419A1/fr active Application Filing
- 2010-12-22 CN CN201080065172.7A patent/CN102781637B/zh not_active Expired - Fee Related
- 2010-12-22 EP EP10809156.2A patent/EP2521638B1/fr not_active Not-in-force
- 2010-12-22 JP JP2012546479A patent/JP5694373B2/ja not_active Expired - Fee Related
- 2010-12-22 BR BR112012016337A patent/BR112012016337A2/pt not_active IP Right Cessation
-
2012
- 2012-06-19 ZA ZA2012/04508A patent/ZA201204508B/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63169299A (ja) * | 1987-01-06 | 1988-07-13 | 富士通株式会社 | ウオ−タジエツトカツタのノズルユニツト |
JP2000021873A (ja) * | 1998-06-26 | 2000-01-21 | Fujitsu Ltd | 積層構造、配線構造、その製造方法、及び半導体装置 |
US6403397B1 (en) * | 2000-06-28 | 2002-06-11 | Agere Systems Guardian Corp. | Process for fabricating organic semiconductor device involving selective patterning |
JP2002026229A (ja) * | 2000-07-07 | 2002-01-25 | Seiko Epson Corp | 配線間接続孔の形成方法 |
JP2004111818A (ja) * | 2002-09-20 | 2004-04-08 | Seiko Epson Corp | パターン形成方法 |
JP2008159971A (ja) * | 2006-12-26 | 2008-07-10 | Konica Minolta Holdings Inc | 導電パターン形成方法、有機薄膜トランジスタ製造方法、及び該製造方法により作製した有機薄膜トランジスタ |
Also Published As
Publication number | Publication date |
---|---|
FR2954918A1 (fr) | 2011-07-08 |
ZA201204508B (en) | 2013-02-27 |
US20120289045A1 (en) | 2012-11-15 |
EP2521638A1 (fr) | 2012-11-14 |
JP5694373B2 (ja) | 2015-04-01 |
CN102781637B (zh) | 2015-02-04 |
US8450217B2 (en) | 2013-05-28 |
FR2954918B1 (fr) | 2012-01-27 |
RU2012133297A (ru) | 2014-02-20 |
EP2521638B1 (fr) | 2016-03-16 |
CN102781637A (zh) | 2012-11-14 |
RU2544715C2 (ru) | 2015-03-20 |
KR20120102103A (ko) | 2012-09-17 |
BR112012016337A2 (pt) | 2019-09-24 |
WO2011080419A1 (fr) | 2011-07-07 |
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