BR112012016337A2 - processo de realização de furos com o auxílio de um jato de fluído. - Google Patents

processo de realização de furos com o auxílio de um jato de fluído.

Info

Publication number
BR112012016337A2
BR112012016337A2 BR112012016337A BR112012016337A BR112012016337A2 BR 112012016337 A2 BR112012016337 A2 BR 112012016337A2 BR 112012016337 A BR112012016337 A BR 112012016337A BR 112012016337 A BR112012016337 A BR 112012016337A BR 112012016337 A2 BR112012016337 A2 BR 112012016337A2
Authority
BR
Brazil
Prior art keywords
zone
aid
jet
fluid
layer
Prior art date
Application number
BR112012016337A
Other languages
English (en)
Inventor
Heitzmann Marie
Benwadih Mohammed
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Publication of BR112012016337A2 publication Critical patent/BR112012016337A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemically Coating (AREA)

Abstract

patente de invenção: processo de realização de furos com o auxílio de um jato de fluido. a invenção refere-se a um processo de realização de um furo (5) em uma camada (4) compreendendo a previsão de uma primeira e de uma segunda zona de aderência (1a) e (1b) em uma superfície de um suporte (2). a primeira zona (1a) tem dimensões que correspondem às dimensões do furo (5). o processo compreende a colocação da camada (4) sobre as primeira e segunda zonas (1a) e (1b). o material da camada (4) apresenta uma coeficiente de aderência sobre a primeira zona (1a) inferior ao coeficiente de aderência sobre a segunda zona (1b). a parte da camada disposta acima da primeira zona (1a) é iliminada por um jato de fluido (6).
BR112012016337A 2010-01-04 2010-12-22 processo de realização de furos com o auxílio de um jato de fluído. BR112012016337A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1000006A FR2954918B1 (fr) 2010-01-04 2010-01-04 Procede de realisation de trous a l'aide d'un jet d'eau
PCT/FR2010/000865 WO2011080419A1 (fr) 2010-01-04 2010-12-22 Procede de realisation de trous a l'aide d'un jet de fluide

Publications (1)

Publication Number Publication Date
BR112012016337A2 true BR112012016337A2 (pt) 2019-09-24

Family

ID=42537640

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012016337A BR112012016337A2 (pt) 2010-01-04 2010-12-22 processo de realização de furos com o auxílio de um jato de fluído.

Country Status (10)

Country Link
US (1) US8450217B2 (pt)
EP (1) EP2521638B1 (pt)
JP (1) JP5694373B2 (pt)
KR (1) KR20120102103A (pt)
CN (1) CN102781637B (pt)
BR (1) BR112012016337A2 (pt)
FR (1) FR2954918B1 (pt)
RU (1) RU2544715C2 (pt)
WO (1) WO2011080419A1 (pt)
ZA (1) ZA201204508B (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1085437A1 (ru) * 1982-05-21 1987-04-15 Предприятие П/Я А-1889 Способ изготовлени полевых транзисторов
JPS63169299A (ja) * 1987-01-06 1988-07-13 富士通株式会社 ウオ−タジエツトカツタのノズルユニツト
JPH0714836A (ja) * 1993-06-17 1995-01-17 Kawasaki Steel Corp 多層配線構造の半導体装置
JPH10270555A (ja) * 1997-03-27 1998-10-09 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP3690565B2 (ja) * 1998-06-26 2005-08-31 富士通株式会社 積層構造、配線構造、その製造方法、及び半導体装置
US6207573B1 (en) * 1999-05-19 2001-03-27 Infineon Technologies North America Corp. Differential trench open process
US6403393B1 (en) * 1999-09-01 2002-06-11 International Business Machines Corporation Device having integrated optical and copper conductors and method of fabricating same
US6403397B1 (en) * 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
JP3896770B2 (ja) * 2000-07-07 2007-03-22 セイコーエプソン株式会社 配線間接続孔の形成方法
JP3986743B2 (ja) * 2000-10-03 2007-10-03 株式会社日立製作所 配線基板とその製造方法及びそれに用いる無電解銅めっき液
WO2004027471A1 (ja) * 2002-09-18 2004-04-01 Fujitsu Limited 光導波路デバイスおよび光導波路デバイスの製造方法
JP2004111818A (ja) * 2002-09-20 2004-04-08 Seiko Epson Corp パターン形成方法
WO2006000915A2 (en) * 2004-01-13 2006-01-05 Lionix Bv Surface waveguide and method of manufacture
US7105375B2 (en) 2004-07-30 2006-09-12 Xerox Corporation Reverse printing
US7138068B2 (en) * 2005-03-21 2006-11-21 Motorola, Inc. Printed circuit patterned embedded capacitance layer
US7589018B2 (en) * 2006-11-09 2009-09-15 Seiko Epson Corporation Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device
JP2008159971A (ja) * 2006-12-26 2008-07-10 Konica Minolta Holdings Inc 導電パターン形成方法、有機薄膜トランジスタ製造方法、及び該製造方法により作製した有機薄膜トランジスタ
KR20090035962A (ko) * 2007-10-08 2009-04-13 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 처리 방법

Also Published As

Publication number Publication date
FR2954918A1 (fr) 2011-07-08
RU2012133297A (ru) 2014-02-20
CN102781637B (zh) 2015-02-04
RU2544715C2 (ru) 2015-03-20
US8450217B2 (en) 2013-05-28
US20120289045A1 (en) 2012-11-15
EP2521638A1 (fr) 2012-11-14
KR20120102103A (ko) 2012-09-17
JP5694373B2 (ja) 2015-04-01
ZA201204508B (en) 2013-02-27
EP2521638B1 (fr) 2016-03-16
JP2013516755A (ja) 2013-05-13
FR2954918B1 (fr) 2012-01-27
WO2011080419A1 (fr) 2011-07-07
CN102781637A (zh) 2012-11-14

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.