JP2013516656A5 - - Google Patents

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Publication number
JP2013516656A5
JP2013516656A5 JP2012548053A JP2012548053A JP2013516656A5 JP 2013516656 A5 JP2013516656 A5 JP 2013516656A5 JP 2012548053 A JP2012548053 A JP 2012548053A JP 2012548053 A JP2012548053 A JP 2012548053A JP 2013516656 A5 JP2013516656 A5 JP 2013516656A5
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JP
Japan
Prior art keywords
circuit board
flexible circuit
camera module
image capture
module according
Prior art date
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JP2012548053A
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English (en)
Japanese (ja)
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JP2013516656A (ja
JP5934109B2 (ja
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Priority claimed from PCT/US2011/000044 external-priority patent/WO2011084900A1/en
Publication of JP2013516656A publication Critical patent/JP2013516656A/ja
Publication of JP2013516656A5 publication Critical patent/JP2013516656A5/ja
Application granted granted Critical
Publication of JP5934109B2 publication Critical patent/JP5934109B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012548053A 2010-01-11 2011-01-11 成形テープフリップチップ画像装置実装を備えたカメラモジュールおよび製造方法 Expired - Fee Related JP5934109B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29384210P 2010-01-11 2010-01-11
US61/293,842 2010-01-11
PCT/US2011/000044 WO2011084900A1 (en) 2010-01-11 2011-01-11 Camera module with molded tape flip chip imager mount and method of manufacture

Publications (3)

Publication Number Publication Date
JP2013516656A JP2013516656A (ja) 2013-05-13
JP2013516656A5 true JP2013516656A5 (enExample) 2013-12-05
JP5934109B2 JP5934109B2 (ja) 2016-06-15

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Family Applications (1)

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JP2012548053A Expired - Fee Related JP5934109B2 (ja) 2010-01-11 2011-01-11 成形テープフリップチップ画像装置実装を備えたカメラモジュールおよび製造方法

Country Status (5)

Country Link
US (1) US8430579B2 (enExample)
EP (1) EP2524264A4 (enExample)
JP (1) JP5934109B2 (enExample)
CN (1) CN102782574B (enExample)
WO (1) WO2011084900A1 (enExample)

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