JP2013516043A - 発熱体およびこの製造方法 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
- H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49101—Applying terminal
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Heating Bodies (AREA)
Abstract
【選択図】図1
Description
10マイクロメータの厚さを有する銅箔を125マイクロメータ厚さのPETフィルム上にラミネーションした。前記記載の銅箔上にノブラック系列のドライフィルムレジスト(Dry film resist)をラミネーションした後に、フォトリソグラフィ工程を利用して線幅10〜15マイクロメータの厚さのエッチング抵抗パターンを形成した。前記エッチング抵抗パターンが備えられた銅箔を含むPETフィルムを銅エッチング液に浸漬して発熱線を形成した。このとき、エッチング液としては過酸化水素20%を含んだ水溶液を用いた。前記エッチング抵抗パターンは、図15のように2mm×4mmを基本単位内で不規則的な点を生成した後、ボロノイパターンを生成した後、線は曲線を利用して生成した。
コーティング膜を形成する代わりに、アクリレート系列の接着剤が備えられた125マイクロメータの厚さのPETフィルムをパターン上にラミネーションしたことを除いては、実施例1のようにフィルムと接合ガラスを製造した。
コーティング膜を形成せずに実施例1のようにフィルムを製造した後、接合ガラスを製造した。
Claims (14)
- 透明基材、前記透明基材の少なくとも一面に備えられた接着剤層、前記接着剤層上に備えられた導電性発熱線、前記導電性発熱線および前記発熱線によって覆われていない接着剤層の上面をカプセル化するコーティング膜、前記導電性発熱線と電気的に連結したバスバー、および前記バスバーと連結した電源部を含む、発熱体。
- 前記接着剤層は、前記導電性発熱線の形成のための金属薄膜を前記透明基材にラミネーションするためのものである、請求項1に記載の発熱体。
- 前記導電性発熱線の厚さは5マイクロメータ以上である、請求項1に記載の発熱体。
- 前記導電性発熱線は、直径20cmの任意の円に対する透過率偏差が5%以下を有するように備えられる、請求項1に記載の発熱体。
- 前記透明基材の開口率は70%以上である、請求項1に記載の発熱体。
- 前記導電性発熱線は、ボロノイ図をなす図形の境目形態またはドロネーパターンをなす少なくとも1つの三角形からなる図形の境目形態のパターン形態で備えられる、請求項1に記載の発熱体。
- 前記導電性発熱線の線幅は100マイクロメータ以下である、請求項1に記載の発熱体。
- 前記コーティング膜の厚さは1マイクロメータ以上である、請求項1に記載の発熱体。
- 前記コーティング膜は粘度が50cps以下の組成物を利用して形成される、請求項1に記載の発熱体。
- 前記導電性発熱線によって覆われていない透明基材の上部領域に備えられたコーティング膜の根低偏差は100nm以下である、請求項1に記載の発熱体。
- 前記発熱体と7m離隔した光源から出た光が前記発熱体を通過したとき、光源の円周方向に干渉模様が実質的に発生しない、請求項1に記載の発熱体。
- 前記コーティング膜が備えられた面に備えられた追加の透明基材を含む、請求項1に記載の発熱体。
- 透明基材上に接着剤層を利用して金属薄膜をラミネーションするステップ、
エッチング抵抗パターンを利用して金属薄膜をエッチングすることによって導電性発熱線を形成するステップ、前記発熱線および前記発熱線によって覆われていない接着剤層の上面をカプセル化するコーティング膜を形成するステップ、前記導電性発熱線と電気的に連結したバスバーを形成するステップ、および前記バスバーと連結した電源部を形成するステップを含む、発熱体の製造方法。 - 前記コーティング膜を形成するステップは、粘度が50cps以下の組成物を利用して形成する、請求項13に記載の発熱体の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR20090132681 | 2009-12-29 | ||
KR10-2009-0132681 | 2009-12-29 | ||
PCT/KR2010/009515 WO2011081456A2 (ko) | 2009-12-29 | 2010-12-29 | 발열체 및 이의 제조방법 |
Publications (2)
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JP2013516043A true JP2013516043A (ja) | 2013-05-09 |
JP5665237B2 JP5665237B2 (ja) | 2015-02-04 |
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JP2012547026A Active JP5665237B2 (ja) | 2009-12-29 | 2010-12-29 | 発熱体およびこの製造方法 |
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US (2) | US20120261404A1 (ja) |
EP (1) | EP2521422B1 (ja) |
JP (1) | JP5665237B2 (ja) |
KR (1) | KR101221689B1 (ja) |
CN (1) | CN102687586B (ja) |
TW (1) | TWI451800B (ja) |
WO (1) | WO2011081456A2 (ja) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016085889A (ja) * | 2014-10-27 | 2016-05-19 | 大日本印刷株式会社 | 発熱板用の中間部材 |
JP2016091658A (ja) * | 2014-10-30 | 2016-05-23 | 大日本印刷株式会社 | 発熱板、導電性パターンシートおよび中間部材 |
JP2016126913A (ja) * | 2014-12-27 | 2016-07-11 | 三菱樹脂株式会社 | 透明フィルムヒーター |
JP2016146334A (ja) * | 2015-01-29 | 2016-08-12 | 大日本印刷株式会社 | 発熱板、導電性パターンシートおよび発熱板を備えた乗り物 |
JP2016192386A (ja) * | 2015-03-31 | 2016-11-10 | 大日本印刷株式会社 | 透明発熱板、暖房器具及び住宅用窓 |
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Also Published As
Publication number | Publication date |
---|---|
EP2521422B1 (en) | 2020-02-19 |
WO2011081456A3 (ko) | 2011-11-10 |
TW201141299A (en) | 2011-11-16 |
WO2011081456A2 (ko) | 2011-07-07 |
US20120261404A1 (en) | 2012-10-18 |
EP2521422A4 (en) | 2015-01-21 |
US20130292373A1 (en) | 2013-11-07 |
CN102687586B (zh) | 2016-09-21 |
CN102687586A (zh) | 2012-09-19 |
EP2521422A2 (en) | 2012-11-07 |
TWI451800B (zh) | 2014-09-01 |
KR20110076837A (ko) | 2011-07-06 |
JP5665237B2 (ja) | 2015-02-04 |
KR101221689B1 (ko) | 2013-01-11 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |